摘要
当今微机电系统电路板焊接点已可采用导电胶替代传统工艺所用的锡铅合金来进行电气连通。但是导电胶的固化温度和固化时间对导电胶的导电性有很大的影响。本论文通过实验,研究了固化温度与固化时间之间的关系以及最终固化完成后对导电性能的影响。导电胶层的厚度对其固化性能也有一定的影响,实验得出导电胶层厚度可以做得薄些。同时还通过固化冷却到室温后电阻变化的研究和初步温度循环中电阻变化的研究,得出其固化的最佳工艺应是当固化过程进行到导电胶电阻值基本不变化时即停止固化的结论,也就是要避免固化过度。
Lead is highly toxic to human beings.Another limitation of solder paste exists in its use for fine pitch components.Eliminating lead from electronic packages is underway.In the electronic industry,two groups of materials are being investigated currently as possible alternatives for lead-containing solders: lead-free and electrically conductive adhesive.The work presented in the paper focuses on conductivity of conductive adhesive by experiment.According to the principle of four-probe,an automatism measuring collection system is designed for measuring the resistance of electrically conductive adhesive. By the designed system,the effect of curing process parameters on electrical conductivity during the curing is researched.The study result shows that preheat can effectively decrease the curing time,the better electrical conductivity can be get ranging from 80 ℃ to 140 ℃ while 110 ℃ to(140 ℃) if it has not be preheated.But the latter takes more time than preheating.The study of electrically thickness of conductive adhesive's shows that the curing time and the resistance after curing raised a little more with the thickness increasing.In this paper,the operating of the automatism measurement collection system is simple and convenient.It can completely realize the study of electrical conductivity and reliability for electrically conductive adhesive.
出处
《光学精密工程》
EI
CAS
CSCD
北大核心
2005年第z1期114-120,共7页
Optics and Precision Engineering
基金
国家自然科学基金资助项目(No.60166001)
关键词
导电胶
导电性能
固化过度
可靠性
conductive adhesive
conductivity
curing process parameter
reliability
