摘要
提出了微小型平板LHP来实现高热流密度电子器件的散热,分析了LHP的工作原理以及运用于电子器件散热的优点.建立了蒸发器多孔芯,金属壁面以及工质汽、液空间区域的耦合数学模型,并运用SIMPLE算法进行求解.数值结果表明,微小型平板LHP蒸发器具有较高热流的散热能力,加热表面的温度水平较低,均温性较好,有利于电子器件的散热.提出微小型平板LHP存在侧壁效应传热极限,由于该极限的存在,系统传热能力在17.5×104W·m-2左右.
The miniature flat heat loop pipe (LHP) used for heat dissipation of electronic apparatus at high heat fluxes is presented, and its operational principle and advantages are analyzed. The mathematical model of porous wick, metal wall and fluid region of LHP evaporator are made, and the overall evaporator is solved with SIMPLE algorithm as a conjugate problem. The numerical results show that the miniature flat LHP is capable of transport large heat density for cooling of electronic apparatus, and the temperat...
出处
《电子器件》
CAS
2007年第6期2197-2200,2204,共5页
Chinese Journal of Electron Devices
基金
国家重点基础研究发展规划资助项目(2007CB206900)
关键词
LHP
微小型
蒸发器
电子器件散热
侧壁效应传热极限
loop heat pipe
miniature
evaporator
heat dissipation of electronic apparatus
side wall effect heat transfer limit
