摘要
高密度互连(HDI)印制板具有制作流程复杂、加工技术难度大的问题,其中电镀填盲孔凹陷、电镀填盲孔空洞、蚀刻不净是常见缺陷和问题,严重影响产品的可靠性和制作良率.文章根据公司现有制作HDI板出现的问题和原因进行分析,提出具体的改善措施并进行相应的改善试验,为同行HDI板加工提供一定的参考,减少品质报废,提高良率和可靠性.
In PCB industry,some plating issues,such as blind hole without copper,plating and filling depression,non—uniform of plating,bothers the industry a lot during the process of HDI board production.The thesis intended to analyze why these defectives appear and provided specific improvement actions which can be reference evidence for other PCB enterprises during plating to reduce quality scrape rate and improve the reliability of blind hole of HDI boards.
作者
王波
何自立
唐奔
WANG Bo;HE Zi-Li;TANG Ben
出处
《印制电路信息》
2017年第A02期223-229,共7页
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