摘要
高热流密度电子元件的散热需求日益增加,为了有效提高双层微通道热沉的散热性能,本文设计一种双层微通道热沉,即上层为截断矩形微通道,下层为含有不同交错排列微针肋的微通道;旨在适当牺牲部分压降的同时提高热沉的换热性能,并与上层无截断型或复杂微通道,下层皆为复杂微结构热沉做对比。采用数值模拟方法,通过对不同微通道流动特性与传热特性的分析。结果表明:与其他几种微通道相比,下层微通道采用六边形微通道,上层采用截断矩形微通道在牺牲一定压降的同时传热性能得到提高,改善微通道底面温度分布均匀性,相较于传统双层矩形微通道,在入口雷诺数417时,其底面最高温度下降2.44K,热阻下降约25%,努塞尔数增大45%左右,整体传热性能(PEC)达1.335。
The heat dissipation demand of electronic components with high heat flux is increasing day by day.In order to effectively improve the heat dissipation performance of double-layer microchannel heat sink,a double-layer microchannel heat sink is designed in this paper.The upper layer is a truncated rectangular microchannel,and the lower layer is a microchannel with different staggered arrangement of microne ribs.The aim of this study is to improve the heat transfer performance of the heat sink while sacrificing part of the pressure drop appropriately.Compared with the upper layer without truncated or complex microchannels and the lower layer with complex microstructures.The flow characteristics and heat transfer characteristics of different microchannels were analyzed by numerical simulation.The results showed that:Compared with other kinds of microchannel,the lower microchannel adopts hexagon microchannel,upper using truncation rectangular microchannel in sacrifice a certain pressure drop of heat transfer performance was improved at the same time,improve the microchannel bottom temperature distribution uniformity,compared with the traditional double rectangular microchannel,when the inlet Reynolds number 417,the underside highest temperature drop 2.44 K,thermal resistance fell about 25%,The Nusselt number increases by about 45%,and the overall heat transfer performance(PEC)reaches 1.335.
作者
赵光攀
向立平
罗振兵
王维龙
黄坤荣
ZHAO Guangpan;XIANG Liping;LUO Zhenbing;WANG Weilong;HUANG Kunrong(College of Mechanical Engineering,University of South China,Hengyang 421001,China;College of Aerospace Science and Engineering,National University of Defense Technology,Changsha 410003,China)
出处
《工程热物理学报》
EI
CAS
CSCD
北大核心
2023年第8期2217-2223,共7页
Journal of Engineering Thermophysics
基金
国家自然科学基金资助项目(No.52075538,No.11872374,No.12002377)
湖南省自然科学基金资助项目(No.2020JJ5670)
关键词
双层微通道热沉
传热
结构
数值模拟
double-layered microchannel heat sinks
heat transfer
structure
numerical simulation
