摘要
随着集成封装技术的发展,封装尺寸不断缩小,热能和电流密度不断增大,导致失效现象频发。针对耦合场作用下的制导与控制(Guidance and Control,GNC)芯片的可靠性问题,对未填充和填充物料的GNC芯片进行了热电耦合实验,以分析其失效形式与填充物的作用。经过对不同制作工艺样品的分析与对比,讨论了热电耦合失效形式及填充对倒装芯片寿命的影响。研究发现,在热循环与电迁移的耦合作用下,蠕变和热应力是引起焊点失效的主要因素。电流的加入促进了金属间化合物(Intermetallic Compounds,IMC)的生长和Kirkendall空洞的产生,而热疲劳产生的初始裂纹和孔洞经过热应力和电流的耦合加速了失效的速度,但通过填充材料可削弱热应力的作用,提高了GNC倒装芯片的寿命。
With the development of integrated packaging technology,packaging size is shrinking and thermal energy and current density are increasing,resulting in frequent failures.In order to solve the reliability problem of guidance and control(GNC)chip under coupling field,thermoelectric coupling experiments are carried out on GNC chip without filling or with filling materials to analyze its failure mode and the role of the filler.Through the analysis and comparison of different fabrication process samples,the influence of thermoelectric coupling failure mode and filling on the life of flip chip is discussed.It is found that creep and thermal stress are the main factors of solder joint failure under the coupling action of thermal cycle and electromigration.The addition of current promotes the growth of intermetallic compounds(IMC)and the formation of Kirkendall cavities,and the initial cracks and holes caused by thermal fatigue accelerate the failure speed under the coupling action of thermal stress and electric current.However,the filling material can weaken the thermal stress and prolong the life of GNC flip chip.
作者
伍天翔
李军辉
WU Tian⁃xiang;LI Jun⁃hui(State Key Laboratory of High Performance Complex Manufacturing,School of Mechanical and Electrical Engineering,Central South University,Changsha 410083)
出处
《导航与控制》
2022年第3期166-173,共8页
Navigation and Control
基金
国家自然科学基金(编号:51975594)
国家自然科学基金区域创新发展联合基金重大集成项目(编号:U20A6004)
关键词
GNC倒装芯片
铜柱焊点
热电耦合
材料填充
GNC flip chip
copper pole solder joint
thermoelectric coupling
material filling
