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恒定压降下电子元件热沉的拓扑优化设计 被引量:2

Topology optimization design of electronic component heat sink under constant pressure drop
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摘要 利用变密度法的拓扑优化对引入的新型电子元件热沉进行设计。以流体输入功率恒定时最大化散热为目标,将N-S方程与定义的流动功率积分式结合,从而将恒定功率转化为流体入口压力。以Re和无量纲化产热系数σ作为变量,利用MMA算法得到恒温边界条件下的最优流道。研究发现Re和σ越大,流道越复杂,散热效果越好;如果出现Re过小,σ过大则会出现热量富集。 In this paper, the topology of the variable density method was used to design the new electronic component heat sink. With the goal of maximizing heat dissipation when the fluid input power was constant, the N-S equation was combined with the defined flow power integral to convert constant power into fluid inlet pressure. TakingReand the dimensionless heat production coefficientσas variables, the MMA algorithm was used to obtain the optimal flow path under constant temperature boundary conditions. The study finds that the larger theReand theσ, the more complicated the flow path and the better the heat dissipation effect;ifReis too small, the heat will be enriched if theσis too large.
作者 裴元帅 王定标 王光辉 王晓亮 袁洪琳 Pei Yuanshuai;Wang Dingbiao;Wang Guanghui;Wang Xiaoliang;Yuan Honglin(School of Chemical Engineering,Zhengzhou University,Zhengzhou 450001,China)
出处 《低温与超导》 CAS 北大核心 2020年第1期56-61,共6页 Cryogenics and Superconductivity
基金 国家自然科学基金(21576245)资助.
关键词 拓扑优化 变密度法 热沉 MMA算法 Topology optimization Variable density method Heat sink MMA algorithm
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