摘要
以固态发射机大功率芯片为研究对象,从自动共晶焊接专用吸嘴设计、大功率芯片载体表面可焊性、焊料片尺寸、焊接温度等方面研究了大功率芯片高精度自动共晶焊接工艺技术,测试了大功率芯片外观、空洞率、共晶焊接强度、共晶焊接精度。结果表明,使用合适的共晶焊接吸嘴、选取适宜的芯片焊接载体、采用优化尺寸的焊料片以及适宜的焊接参数完成焊接的大功率芯片,每个边长的75%以上有焊料溢出,焊接层总空洞率≤10%,有源区焊接层空洞率≤3%,剪切强度满足标准要求,自动共晶焊接精度优于15μm,实现了大功率芯片高精度、高可靠性自动共晶焊接工艺技术的应用。
Taking the high-power chip of solid-state transmitter as the research object,the high-precision automatic eutectic soldering technology of high-power chip is studied from the aspects of automatic eutectic soldering nozzle design,surface solderability of high-power chip carrier,solder chip size and soldering temperature.The appearance,void ratio,eutectic soldering strength and eutectic soldering accuracy of high-power chip are tested,the results show that more than 75%of each side length of high-power chip which is soldered by using appropriate eutectic soldering nozzle,selecting appropriate chip soldering carrier,using optimized solder chip and appropriate soldering parameters has solder overflow,total void rate of high-power chip soldering is less than or equal to 10%,the void rate of high-power chip active area soldering is less than or equal to 3%,the shear strength meets the standard requirements,the precision of automatic eutectic soldering is better than 15μm.The application of automatic eutectic soldering technology with high-precision and high reliability for high-power chip is achieved.
作者
兰元飞
姬峰
焦庆
张鹏哲
王代兴
张晓宇
郑晓华
Lan Yuanfei;Ji Feng;Jiao Qing;Zhang Pengzhe;Wang Daixing;Zhang Xiaoyu;Zheng Xiaohua(Beijing Institute of Remote Sensing Equipment,Beijing 100854)
出处
《航天制造技术》
2022年第3期61-64,共4页
Aerospace Manufacturing Technology
关键词
大功率芯片
高精度
共晶焊接工艺技术
high-power chip
high-precision
eutectic soldering process technology
