摘要
随着PCB高密度、高集成化的发展,PCB上图形间距越来越小,为避免SMT偏位、锡膏短路等问题,对PCB翘曲度提出了越来越高的要求。文章从CCL和PCB加工过程受力变化的角度,分析了双面板翘曲产生机理。并通过释放CCL板料内应力、优化PCB设计、减小PCB加工过程外加应力、释放PCB应力等方式对双面板翘曲进行改善。
With the development of high density and high integration of PCB,the graphic spacing on PCB is becoming smaller and smaller.The requirement of PCB warpage is becoming more and more strict to avoid the solder paste short circuit.In this paper,the mechanism of double-sided board warping is analyzed from the side of force variation during CCL and PCB processing.The warpage of double side board was improved by releasing the internal stress of CCL,optimizing PCB design,reducing the applied stress during PCB processing and releasing PCB stress.
作者
何思良
宋祥群
黄杰
苏晓锋
He Siliang;Song Xiangqun;Huang Jie;Su Xiaofeng
出处
《印制电路信息》
2022年第S01期8-15,共8页
Printed Circuit Information
关键词
双面板
翘曲
受力变化
应力释放
Double-Sided Board
Warping
Stress Change
Stress Release
