摘要
车载板是印制电路板中的一个重要领域,随着智能电动汽车的高速发展,车载板趋于高密化和高多层化,产品可靠性面临挑战,尤其是BGA区域的小孔径金属化孔的可靠性。文章介绍几种常用的可靠性测试方法,如IST测试、CAF测试、冷热冲击在线阻值监控、热油测试等,全面评估产品的可靠性。并详细介绍测试后的失效分析方法,找出失效根因。提供多种测试项目的失效分析案例,供同行参考和借鉴。
Automotive board is an important field in printed circuit board.With the rapid development of intelligent electric vehicles,automotive board tends to be high-density and high layer count,and the product reliability is facing challenges,especially the reliability of small aperture metallized holes in BGA area.In order to meet the physical and electrical properties of vehicle products,this paper introduces several commonly used reliability testing methods,such as IST test,CAF test,cold and hot shock online resistance monitoring,hot oil test,etc.,to comprehensively evaluate the reliability of products.In addition,the failure analysis method after testing is introduced in detail to find out the root cause of failure,and failure analysis cases of various test items are provided for the reference of peers.
作者
李安安
周小霍
常会勇
黄贤权
Li Anan;Zhou Xiaohuo;Chang Huiyong;Huang Xianquan
出处
《印制电路信息》
2022年第S01期21-27,共7页
Printed Circuit Information
关键词
车载板
可靠性
金属化孔
互连应力测试
失效分析
Automotive Board
Reliability
Metallized Hole
IST(Interconnect Stress Test)
Failure Analysis
