摘要
图形电镀是一种制作精细线路的电镀方式。区别于全板电镀,由于边缘效应的影响,图形电镀的铜厚增长受产品设计等因素的影响。文章将线路铜厚与大铜面铜厚比值称为边缘效应比值。测试了在同一块板内不同电流密度、不同间距、不同孤立程度区域下的边缘效应比值,称为特征边缘效应比值;同时,也测试了不同板在不同混挂方式下不同设计因素之间的边缘效应比值,称为板间边缘效应比值,为图形电镀的参数制定、加工能力、混镀规则等提供技术依据。并基于两种边缘效应形成边缘算法,建立混镀的可量化规则。
Pattern electroplating is a kind of electroplating method for making fine lines.Different from normal electroplating,due to the influence of edge effect,the copper thickness growth of pattern electroplating is affected by factors such as product design.In this paper,the ratio of line copper thickness to large copper surface copper thickness is called edge effect ratio.The edge effect ratio is measured under different current density,different spacing and different isolation degree in the same plate,which is called characteristic edge effect ratio.At the same time,the edge effect ratio between different design factors of different plates under different mixing modes is also tested,which is called the edge effect ratio between plates.It provides a technical basis for the formulation of pattern electroplating parameters,processing capacity and the rules of mixed plating.Based on the two edge effects,the edge algorithm is formed,and the quantifiable rules of mixed plating are established.
作者
郑宏亮
刘日富
陈春华
陈黎阳
Zheng Hongliang;Liu Rifu;Chen Chunhua;Chen Liyang
出处
《印制电路信息》
2022年第S01期301-307,共7页
Printed Circuit Information
关键词
图形电镀
边缘效应比值
混镀
可量化
Pattern Electroplating
The Edge Effect Ratio
Mixed Plating
Quantifiable
