摘要
文章通过多个PCB功能性失效案例,主要是盲孔导致的PCBA功能性失效案例,进行原因解析,并给出了一些PCB制程管控关键点和预防措施,希望能减少类似缺陷的发生。同时还给出了一些盲孔出现异常时出现的外观特征,通过这些特征能更好对PCB失效的原因进行定性,从而提高PCB焊接失效分析的准确性。
This article analyzes the causes of several PCB functional failure cases,mainly PCBA functional failure issues caused by blind via in PCB,and gives some key points and prevention actions for PCB process control,which will reduce the occurrence of similar defects.Meanwhile,some appearance characteristics of blind via are given for reference,through which the causes of PCB failure can be quickly defined,which will improve the accuracy of PCB failure analysis.
出处
《印制电路信息》
2023年第S01期126-132,共7页
Printed Circuit Information
关键词
HDI
盲孔
失效
HDI
Blind-Via
Failure
