摘要
本文从设计、配本、材料类型和热处理方式等方面研究分析多阶HDI产品孔底芯板裂纹产生的机理。研究结果表明,这种“外层铜皮+激光填孔铜柱+铜皮+基材”的设计在热量传递和受力方式上,容易存在HDI孔孔底芯板裂纹问题。
In this paper,the mechanism of the multi-stage HDI product hole bottom base material crack is studied and analyzed from the aspects of design,cost,material type and heat treatment method.The results show that the design of"outer copper skin+laser filled copper pillar+copper skin+base material"is prone to HDI hole bottom base material cracks in terms of heat transfer and force bearing mode.
作者
吴劲伦
姚勇敢
余美琪
Wu Jinglun;Yao Yonggan;Yu Meiqi(SHENGYI ELECTRONICS CO.,LTD.DongGuan 523127,Guangdong,China)
出处
《印制电路信息》
2023年第S02期186-194,共9页
Printed Circuit Information
关键词
HDI叠孔
树脂裂纹
玻纤纱裂
HDI Stacked Holes
Resin Cracks
Glass Fiber Yarn Cracked
