摘要
人工智能服务器系统中的加速器模块使用的高阶HDI板,要求达到超高可靠性,即经过500次高加速热冲击循环测试、模块网络电阻变化率小于5%。这类板的关键工艺技术是激光孔的金属化加工,要求孔壁镀铜层和激光孔堆叠界面有极好的耐热冲击能力。盲孔的激光钻孔、等离子体清洗、盲孔底盘铜层的微蚀量、盲孔闪镀等因素对激光孔堆叠界面的裂纹有显著影响,电镀槽液的寿命对孔壁镀铜的断裂有显著影响。通过对这些因素的严格控制,可以提高孔壁镀铜的耐热冲击能力和改善激光孔堆叠界面的结合力。
Multi-step HDI boards used for accelerator modules in AI server systems are required to achieve ultrahigh reliability,i.e.,500 cycles of highly accelerated thermal shock tests with less than 5%change rate in module network resistance.The key process technology for these boards is the metallization of laser holes,which requires excellent thermal shock resistance of the hole wall copper plating layer and the laser hole stacking interface.Factors such as laser drilling of blind holes,plasma cleaning,the amount of micro-etching of copper layer on land pad in the blind holes and flash plating of the blind holes have a significant effect on the cracking of the laser hole stacking interface.The bath life of the plating chemical has a significant effect on the fracture of the hole-wall plated copper,and the thermal shock resistance of the holewall plated copper can be improved and the bonding of the laser hole stacking interface can be improved through strict control of these factors.
作者
付艺
王锋
Fu Yi;Wang Feng(Zhuhai Founder PCB Development Limited.PCB Institute,Guangdong,Zhuhai 519175)
出处
《印制电路信息》
2024年第S01期253-258,共6页
Printed Circuit Information
关键词
超高可靠性
HDI板
电镀填孔
回流焊
高加速热冲击测试
Ultrahigh Reliability
HDI Boards
Plating Copper Via Filling
Reflow
Highly Accelerated Thermal Shock Test
