摘要
湿热环境对塑封微电路的可靠性影响非常大,本文介绍了IEC、JEDEC、GB、GJB等标准规定的塑封微电路稳态湿热试验(THB)、高加速应力试验(HAST)、无偏置高加速应力试验(UHAST)和无偏置高压蒸煮试验(PCT)等4种试验方法,从标准角度对比分析了4种湿热试验方法及其区别。
The temperature and humidity environment has a great influence on the reliability of plastic encapsulated microcircuits.This article introduces four test methods of plastic encapsulated microcircuits:the steady state temperature and humidity bias lift test(THB),highly accelerated temperature and humidity stress test(HAST),accelerated moisture resistance unbiased HAST(UHAST)and accelerated moisture resistance unbiased autoclave(PCT)specified by IEC,JEDEC,GB,GJB and others.The four temperature and humidity test methods are compared and their differences were analyzed from the standard point of view.
作者
阳辉
钟征宇
黄文铮
杜忠磊
YANG Hui;ZHONG Zheng-yu;HUANG Wen-zheng;DU Zhong-lei(Beijing San-talking Testing Engineering Academy Co.,Ltd.)
出处
《中国标准化》
2021年第S01期107-111,共5页
China Standardization
关键词
塑封微电路
湿热试验
标准
偏置电压
plastic encapsulated microcircuits
temperature and humidity test
standards
bias voltage
