摘要
添加不同质量浓度的小分子胶原蛋白(QS)或大分子骨胶(GJ)制备电解铜箔,通过X射线衍射仪(XRD)、扫描电子显微镜(SEM)、微机控制万能试验机等对电解铜箔的相关性能进行了研究。结果表明,与聚二硫二丙烷磺酸钠(SPS)搭配使用时,加入QS或GJ都具有降低铜箔粗糙度和增加光泽的效果,但GJ需要搭配更高浓度的SPS才能发挥此效果;加入QS或GJ都会降低铜箔的抗拉强度,GJ对铜箔抗拉强度的影响相对更小,加入QS后铜箔断裂伸长率有升高的趋势;加入QS或GJ,铜箔毛面均表现出(111)晶面择优取向,晶面(200)和(220)可能与光泽和抗拉强度有关联。
Electrolysis copper foil was prepared by adding small molecule collagen(QS)or large molecule bone glue(GJ)with different mass concentrations.The properties of electrolysis copper foil were studied by means of microcomputer controlled universal testing ma-chine,scanning electron microscope(SEM)and X-ray diffractometry(XRD).The results showed that the addition of QS or GJ can re-duce the roughness and increase the luster of copper foil when it is used with sodium polydithiodipropane sulfonate(SPS),but the effect of GJ can be achieved only when the SPS concentration is higher.The addition of QS or GJ will reduce the tensile strength of copper foil,and the influence of GJ on the tensile strength of copper foil is relatively small.The addition of QS will increase the elongation at break of copper foil.When QS or GJ were added,the copper foils showed the preferred orientation of(111)crystal surface,and the crys-tal surface of(200)and(220)might be related to the gloss and tensile strength.
作者
宋言
SONG Yan(Jiangxi Copper Technology Research Institute Co.,Ltd,Nanchang 330500,China)
出处
《铜业工程》
CAS
2023年第5期79-83,共5页
Copper Engineering
基金
江西铜业技术研究院重点研发计划项目(2019006)资助。
关键词
电解铜箔
胶原蛋白
骨胶
抗拉强度
晶面取向
electrolytic copper foil
collagen
bone glue
tensile strength
crystal surface orientation
