摘要
为了提高电解铜箔的剥离强度,先研究了单独添加钼酸钠、羟乙基纤维素(HEC)和聚二硫二丙烷磺酸钠(SPS)对铜箔粗化效果的影响,再通过正交试验对3种添加剂进行复配,得到较佳的复合添加剂──50 mg/L钼酸钠+5 mg/L SPS+3 mg/L HEC。采用该复合添加剂时,铜箔在电流密度25 A/dm^(2)、温度35℃的条件下粗化1次,再固化2次后毛面粗糙度(Rz)为7.57μm,剥离强度为1.53 N/mm,劣化率为0。
The effects of different additives i.e.sodium molybdate,hydroxyethyl cellulose(HEC),and bis-(sodium sulfopropyl)-disulfide(SPS)on the roughening of electrolytic copper foil were studied to improve its peeling strength.A composite additive comprising 50 mg/L sodium molybdate,5 mg/L SPS,and 3 mg/L HEC was determined by orthogonal test.After roughening in the electrolyte containing the optimized composite additive at current density 25 A/dm^(2) and temperature 35℃once followed by curing twice,the surface roughness(Rz)at matte side of the electrolytic copper foil was 7.57μm.The copper foil featured a peeling strength of 1.53 N/mm and a zero degradation rate.
作者
彭雪嵩
由宏伟
李兰晨
宋姝嬛
乐士儒
张锦秋
杨培霞
安茂忠
PENG Xuesong;YOU Hongwei;LI Lanchen;SONG Shuhuan;LE Shiru;ZHANG Jinqiu;YANG Peixia;AN Maozhong(School of Chemical Engineering and Chemistry,Harbin Institute of Technology,Harbin 150000,China)
出处
《电镀与涂饰》
CAS
北大核心
2023年第17期56-67,共12页
Electroplating & Finishing
基金
国家重点研发项目(2021YFB3400800)
关键词
电解铜箔
添加剂
粗化
剥离强度
粗糙度
electrolytic copper foil
additive
roughening
peeling strength
roughness
