摘要
首次全面系统地报告：对国产９６Ａｌ＿２Ｏ＿３瓷进行了化学镀铜，测试和研究了它们的各种性能．采用外加添加剂的方法研究了各种化学镀液的稳定性；用微量天平称重法研究了沉积速度、膜厚与镀液组成、稳定剂的关系；用可焊性测试原理的润湿力法研究了铜膜的抗氧化性和可焊性；用直接引拉法测试基片与铜膜的附着力，研究了附着力与粗化、化学镀速的关系，研制结果表明国内生产的９６Ａｌ＿２Ｏ＿３瓷，完全可以化学镀铜制成印刷线路板，投入工业生产。
This paper reports for the first time that we have succeededin producing 96 Al_2O_3 ceram-ics with electroless copper plating and studied and measured their various properties. Variousstabilities of electroless copper solutions are investigated by using additives; relationship be-tween deposition rate、film thickness and solution compostion、stablizers is investigated by us-ing microbalance;weldability and resistivity against oxidation of electroless copper plating areinvestigated by using wetting test method;adhesion between substrates and copper plating isdetermined by using pluch test method; relationship between adhesion and rough handling、deposition rate is investigated. The result of the development shows that 96 Al_2O_3 ceramicswith electroless copper plating is good enough to be employed for producing printed circuitboards and can be put into industrial production.
出处
《西安交通大学学报》
EI
CAS
CSCD
北大核心
1995年第1期34-40,共7页
Journal of Xi'an Jiaotong University
关键词
装置瓷
电化学
化学镀
陶瓷
镀铜
: chemical deoxidizing plating ceramics for mounting purpose electrochemistry
