Optical coherence microscopy is applied to measure scattering media'sinternal defect, which based on low coherence interferometry and confocal microscopy. Opticalcoherence microscopy is more effective in the rejec...Optical coherence microscopy is applied to measure scattering media'sinternal defect, which based on low coherence interferometry and confocal microscopy. Opticalcoherence microscopy is more effective in the rejection of out of focus and multiple scatteredphotons originating further away of the focal plane. With the three-dimension scanning, the internaldefect is detected by measuring the thickness of different points on the sample. The axialresolution is 6 μm and lateral resolution is 1. 2 μm. This method is possessed of the advantagesover the other measurement method of scattering media, such as non-destruction and high-resolution.展开更多
A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field ins...A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field inspection.A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision,high speed and simple structure.展开更多
基金National Natural Science Foundation of China(60077031)
文摘Optical coherence microscopy is applied to measure scattering media'sinternal defect, which based on low coherence interferometry and confocal microscopy. Opticalcoherence microscopy is more effective in the rejection of out of focus and multiple scatteredphotons originating further away of the focal plane. With the three-dimension scanning, the internaldefect is detected by measuring the thickness of different points on the sample. The axialresolution is 6 μm and lateral resolution is 1. 2 μm. This method is possessed of the advantagesover the other measurement method of scattering media, such as non-destruction and high-resolution.
文摘A whole-field 3D surface measurement system for semiconductor wafer inspection is described.The system consists of an optical fiber plate,which can split the light beam into N^2 subbeams to realize the whole-field inspection.A special prism is used to separate the illumination light and signal light.This setup is characterized by high precision,high speed and simple structure.
