Herein, hierarchically structured SnO2 microspheres are designed and synthesized as an efficient anode material for lithium-ion batteries using hollow SnO2 nanoplates. Three-dimensionally ordered macroporous （3-DOM）...Herein, hierarchically structured SnO2 microspheres are designed and synthesized as an efficient anode material for lithium-ion batteries using hollow SnO2 nanoplates. Three-dimensionally ordered macroporous （3-DOM） SnOx-C microspheres synthesized by spray pyrolysis are transformed into hierarchically structured SnO2 microspheres by a two-step post-treatment process. Sulfidation produces hierarchically structured SnS-SnS2-C microspheres comprising tin sulfide nanoplate and carbon building blocks. A subsequent oxidation process produces SnO2 microspheres from hollow SnO2 nanoplate building blocks, which are formed by Kirkendall diffusion. The discharge capacity of the hierarchically structured SnO2 microspheres at a current density of 5 Ag^-1 for the 600th cycle is 404 mA·h·g^-1. The hierarchically structured SnO2 microspheres have reversible discharge capacities of 609 and 158 mA·h·g^-1 at current densities of 0.5 and 30 Ag^-1, respectively. The ultrafine nanosheets contain empty voids that allow excellent lithium-ion storage performance, even at high current densities.展开更多
The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electr...The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope （SEM）, energy dispersive spectroscopy （ EDS ） and X-ray diffraction （ XRD ）. The results show that when the interlayer is Ni or Ni ＋ Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds （Cu3Ti, CuTi etc. ）. But the Ni-Ti intermetallic compounds （NiTi, Ni3Ti） are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni ＋ Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni ＋ Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.展开更多
In order to clarify and control the silver defect on surface of cold-rolled sheet of the Ti-stabilized ultra-pure ferrite stainless steel, the distribution of TiN inclusions on the cross section of hot-rolled plate wa...In order to clarify and control the silver defect on surface of cold-rolled sheet of the Ti-stabilized ultra-pure ferrite stainless steel, the distribution of TiN inclusions on the cross section of hot-rolled plate was studied using automated scanning electron microscopy/energy-dispersive X-ray spectroscopy inclusion analysis (ASPEX 1020 system). It was found that the number density decreases sharply from the surface to the center of the hot-rolled plate, whereas the average size increases. Then, the distribution of TiN inclusions on the cross section of continuously cast slab was investigated. Similarly, numerous small-sized TiN inclusions were generated at the subsurface of the slab. The average size rapidly increased and the number density dramatically decreased from the subsurface to 1/4 thickness, while from 1/4 thickness to 1/2 thickness, the increase in average size and the decrease in number density were slight. Thermodynamics results showed that TiN inclusion was formed below the liquidus temperature, which indicated that TiN inclusions could not be formed during secondary refining. Considering the microsegregation of solute elements and the equilibrium of TiN formation during solidification, TiN precipitated in the mushy zone when the solid fraction was close to 0.2. The growth of TiN was analyzed based on the diffusion-controlled growth model. With the increase in cooling rate, the time for TiN growth decreased and the size of TiN inclusions was diminished, which revealed the size distribution of TiN inclusions in the cast slab qualitatively.展开更多
文摘Herein, hierarchically structured SnO2 microspheres are designed and synthesized as an efficient anode material for lithium-ion batteries using hollow SnO2 nanoplates. Three-dimensionally ordered macroporous （3-DOM） SnOx-C microspheres synthesized by spray pyrolysis are transformed into hierarchically structured SnO2 microspheres by a two-step post-treatment process. Sulfidation produces hierarchically structured SnS-SnS2-C microspheres comprising tin sulfide nanoplate and carbon building blocks. A subsequent oxidation process produces SnO2 microspheres from hollow SnO2 nanoplate building blocks, which are formed by Kirkendall diffusion. The discharge capacity of the hierarchically structured SnO2 microspheres at a current density of 5 Ag^-1 for the 600th cycle is 404 mA·h·g^-1. The hierarchically structured SnO2 microspheres have reversible discharge capacities of 609 and 158 mA·h·g^-1 at current densities of 0.5 and 30 Ag^-1, respectively. The ultrafine nanosheets contain empty voids that allow excellent lithium-ion storage performance, even at high current densities.
基金The work was supported by National Natural Science Foundation of China(No50375065)State Key Laboratory of Advanced Welding Production Technology(No04005)
文摘The diffusion bonding was carried out to join Ti alloy （Ti-6Al-4V） and tin-bronze （ ZQSn10-10 ） with Ni and Ni ＋ Cu interlayer. The microstructures of the diffusion bonded joints were analyzed by scanning electron microscope （SEM）, energy dispersive spectroscopy （ EDS ） and X-ray diffraction （ XRD ）. The results show that when the interlayer is Ni or Ni ＋ Cu transition metals both could effectively prevent the diffusion between Ti and Cu and avoid the formation of the Cu-Ti intermetallic compounds （Cu3Ti, CuTi etc. ）. But the Ni-Ti intermetallic compounds （NiTi, Ni3Ti） are formed on the Ti-6Al-4V/Ni interface. When the interlayer is Ni, the optimum bonding parameters are 830 ℃/10 MPa/30 min. And when the interlayer is Ni ＋ Cu, the optimum bonding parameters are 850 ℃/10 MPa/20 min. With the optimum bonding parameters, the tensile strength of the joints with Ni and Ni ＋ Cu interlayer both are 155.8 MPa, which is 65 percent of the strength of ZQSn10-10 base metal.
文摘In order to clarify and control the silver defect on surface of cold-rolled sheet of the Ti-stabilized ultra-pure ferrite stainless steel, the distribution of TiN inclusions on the cross section of hot-rolled plate was studied using automated scanning electron microscopy/energy-dispersive X-ray spectroscopy inclusion analysis (ASPEX 1020 system). It was found that the number density decreases sharply from the surface to the center of the hot-rolled plate, whereas the average size increases. Then, the distribution of TiN inclusions on the cross section of continuously cast slab was investigated. Similarly, numerous small-sized TiN inclusions were generated at the subsurface of the slab. The average size rapidly increased and the number density dramatically decreased from the subsurface to 1/4 thickness, while from 1/4 thickness to 1/2 thickness, the increase in average size and the decrease in number density were slight. Thermodynamics results showed that TiN inclusion was formed below the liquidus temperature, which indicated that TiN inclusions could not be formed during secondary refining. Considering the microsegregation of solute elements and the equilibrium of TiN formation during solidification, TiN precipitated in the mushy zone when the solid fraction was close to 0.2. The growth of TiN was analyzed based on the diffusion-controlled growth model. With the increase in cooling rate, the time for TiN growth decreased and the size of TiN inclusions was diminished, which revealed the size distribution of TiN inclusions in the cast slab qualitatively.
