An innovative, thermally-insensitive phenomenon of cascaded cross-coupled structures is found. And a novel CMOS temperature sensor based on a cross-coupled structure is proposed. This sensor consists of two different ...An innovative, thermally-insensitive phenomenon of cascaded cross-coupled structures is found. And a novel CMOS temperature sensor based on a cross-coupled structure is proposed. This sensor consists of two different ring oscillators. The first ring oscillator generates pulses that have a period, changing linearly with temperature. Instead of using the system clock like in traditional sensors, the second oscillator utilizes a cascaded cross-coupled structure to generate temperature independent pulses to capture the result from the first oscillator. Due to the compensation between the two ring oscillators, errors caused by supply voltage variations and systematic process variations are reduced. The layout design of the sensor is based on the TSMC13G process standard cell library. Only three inverters are modified for proper channel width tuning without any other custom design. This allows for an easy integration of the sensor into cell-based chips. Post-layout simulations results show that an error lower than ±1.1 °C can be achieved in the full temperature range from 40 to 120 °C. As shown by SPICE simulations, the thermal insensitivity of the cross-coupled inverters can be realized for various TSMC technologies： 0.25 μm, 0.18 μm, 0.13 μm, and 65 nm.展开更多
In this work thermal conduction in one-dimensional （1D） chains of anharmonic oscillators are studied using computer simulation. The temperature profile, heat flux and thermal conductivity are investigated for chain ...In this work thermal conduction in one-dimensional （1D） chains of anharmonic oscillators are studied using computer simulation. The temperature profile, heat flux and thermal conductivity are investigated for chain length N = 100, 200, 400, 800 and 1600. In the computer simulation anharmonicity is introduced due to Fermi-Pasta- U1am-β （FPU-β） model For substrate interaction, an onsite potential due to Frenkel-Kontorova （FK） model has been used. Numerical simulations demonstrate that temperature gradient scales behave as N-1 linearly with the relation J = 0.1765/N. For the thermal conductivity K, KN to N obey the linear relation of the type KN = 0.8805N. It is shown that thermal transport is dependent on phonon-phonon interaction as web as phonon-lattice interaction. The thermal conductivity increases linearly with increase inanharmonicity and predicts relation κ =0.133 ＋ 0.804β. It is also concluded that for higher value of the strength of the onsite potential system tends to a thermal insulator.展开更多
通过对频率抖动机理的研究,提出一种基于压控振荡器(Voltage-Controlled Oscillator,VCO)的真随机数发生器(True Random Number Generator,TRNG)设计方案.该方案将电阻热噪声放大后作为VCO的控制信号使其振荡频率在中心频率附近随机抖动...通过对频率抖动机理的研究,提出一种基于压控振荡器(Voltage-Controlled Oscillator,VCO)的真随机数发生器(True Random Number Generator,TRNG)设计方案.该方案将电阻热噪声放大后作为VCO的控制信号使其振荡频率在中心频率附近随机抖动. VCO所产生的慢振荡信号对周期固定的快振荡信号采样生成原始随机序列,然后利用后处理电路提高序列均匀性并消除自相关性.通过热噪声发生器调节VCO的中心频率可实现序列比特率和随机性之间的权衡.所提电路采用SMIC 55nm CMOS工艺设计,芯片面积0. 0124mm2,比特率10Mbps,平均功率0. 81mW.输出的随机序列通过NIST SP 800-22测试.展开更多
In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermome- chanical stress monitoring. It is proposed in the context of a waf...In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermome- chanical stress monitoring. It is proposed in the context of a wafer-scale-based (WaferICTM) rapid prototyping platform for electronic systems. This technique will be embedded into the structure of the WaferIC, and will be used as a preventive measure to protect the wafer from possible damages that can be caused by excessive thermomechanical stress. The paper also presents spatial and spatiotemporal algorithms and the experimental results from an IR images collection campaign conducted using an IR camera.展开更多
Using thermal entangled state representation,we solve the master equation of a diffusive anharmonic oscillator（AHO） to obtain the exact time evolution formula for the density operator in the infinitive operator-sum ...Using thermal entangled state representation,we solve the master equation of a diffusive anharmonic oscillator（AHO） to obtain the exact time evolution formula for the density operator in the infinitive operator-sum representation.We present a new evolution formula of the Wigner function（WF） for any initial state of the diffusive AHO by converting the WF calculation into an overlap between two pure states in an enlarged Fock space.It is found that this formula is very convenient in investigating the WF＇s evolution of any known initial state.As applications,this formula is used to obtain the evolution of the WF for a coherent state and the evolution of the photon-number distribution of diffusive AHOs.展开更多
基金supported by the National High Technology Research and Development Program of China (No. 2006AA010202)
文摘An innovative, thermally-insensitive phenomenon of cascaded cross-coupled structures is found. And a novel CMOS temperature sensor based on a cross-coupled structure is proposed. This sensor consists of two different ring oscillators. The first ring oscillator generates pulses that have a period, changing linearly with temperature. Instead of using the system clock like in traditional sensors, the second oscillator utilizes a cascaded cross-coupled structure to generate temperature independent pulses to capture the result from the first oscillator. Due to the compensation between the two ring oscillators, errors caused by supply voltage variations and systematic process variations are reduced. The layout design of the sensor is based on the TSMC13G process standard cell library. Only three inverters are modified for proper channel width tuning without any other custom design. This allows for an easy integration of the sensor into cell-based chips. Post-layout simulations results show that an error lower than ±1.1 °C can be achieved in the full temperature range from 40 to 120 °C. As shown by SPICE simulations, the thermal insensitivity of the cross-coupled inverters can be realized for various TSMC technologies： 0.25 μm, 0.18 μm, 0.13 μm, and 65 nm.
文摘In this work thermal conduction in one-dimensional （1D） chains of anharmonic oscillators are studied using computer simulation. The temperature profile, heat flux and thermal conductivity are investigated for chain length N = 100, 200, 400, 800 and 1600. In the computer simulation anharmonicity is introduced due to Fermi-Pasta- U1am-β （FPU-β） model For substrate interaction, an onsite potential due to Frenkel-Kontorova （FK） model has been used. Numerical simulations demonstrate that temperature gradient scales behave as N-1 linearly with the relation J = 0.1765/N. For the thermal conductivity K, KN to N obey the linear relation of the type KN = 0.8805N. It is shown that thermal transport is dependent on phonon-phonon interaction as web as phonon-lattice interaction. The thermal conductivity increases linearly with increase inanharmonicity and predicts relation κ =0.133 ＋ 0.804β. It is also concluded that for higher value of the strength of the onsite potential system tends to a thermal insulator.
文摘In this paper, we describe a new silicon-die thermal monitoring approach using spatiotemporal signal processing technique for Wafer-Scale IC thermome- chanical stress monitoring. It is proposed in the context of a wafer-scale-based (WaferICTM) rapid prototyping platform for electronic systems. This technique will be embedded into the structure of the WaferIC, and will be used as a preventive measure to protect the wafer from possible damages that can be caused by excessive thermomechanical stress. The paper also presents spatial and spatiotemporal algorithms and the experimental results from an IR images collection campaign conducted using an IR camera.
基金Project supported by the National Natural Science Foundation of China (Grant Nos. 11147009 and 11244005)the Natural Science Foundation of Shandong Province,China (Grant No. ZR2012AM004)
文摘Using thermal entangled state representation,we solve the master equation of a diffusive anharmonic oscillator（AHO） to obtain the exact time evolution formula for the density operator in the infinitive operator-sum representation.We present a new evolution formula of the Wigner function（WF） for any initial state of the diffusive AHO by converting the WF calculation into an overlap between two pure states in an enlarged Fock space.It is found that this formula is very convenient in investigating the WF＇s evolution of any known initial state.As applications,this formula is used to obtain the evolution of the WF for a coherent state and the evolution of the photon-number distribution of diffusive AHOs.
