以硅烷和氨气分别做为硅源和氮源,以高纯氮气为载气,采用热壁式管式反应炉,通过低压化学气相沉积(low pressure chemical vapor deposition,LPCVD)技术制备了氮化硅薄膜(SiN_x)。借助椭圆偏振仪研究了SiN_x薄膜的生长动力学,通过Fourie...以硅烷和氨气分别做为硅源和氮源,以高纯氮气为载气,采用热壁式管式反应炉,通过低压化学气相沉积(low pressure chemical vapor deposition,LPCVD)技术制备了氮化硅薄膜(SiN_x)。借助椭圆偏振仪研究了SiN_x薄膜的生长动力学,通过Fourier红外光谱和X光电子能谱表征了SiN_x薄膜的性质,并利用原子力显微镜观察了SiN_x薄膜的微观形貌。在其它工艺条件相同的情况下,SiN_x薄膜的生长速率随着工作压力的增大单调增加,原料气中氨气与硅烷的流量之比(R)对薄膜的生长速率有相反的影响。随着反应温度的升高,沉积速率逐渐增加,在840℃附近达到最大,随后迅速降低。当R<2时获得富Si的SiN_x薄膜(x<1.33);当R>4时获得近化学计量(z≈1.33)的SiN_x薄膜。展开更多
SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR...SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS）. It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.展开更多
利用电感耦合等离子体化学气相沉积系统SENTECH SI 500 D以Si H_4和NH_3研究了在不同工艺条件下的氮化硅薄膜生长实验。而后利用台阶仪和椭圆偏振仪表征了薄膜的厚度、生长速率、均匀性和折射率等参数;并用原子力显微镜（AFM）和扫描电...利用电感耦合等离子体化学气相沉积系统SENTECH SI 500 D以Si H_4和NH_3研究了在不同工艺条件下的氮化硅薄膜生长实验。而后利用台阶仪和椭圆偏振仪表征了薄膜的厚度、生长速率、均匀性和折射率等参数;并用原子力显微镜（AFM）和扫描电子显微镜（SEM）研究了薄膜表面形貌。实验结果表明：沉积温度和ICP功率是影响薄膜生长速率的主要因素,生长速率可以达到20 nm/min;NH_3流量是影响薄膜折射率的主要因素,其变化在1.85~2.35之间;沉积温度是影响薄膜表面形貌的关键因素。展开更多
文摘以硅烷和氨气分别做为硅源和氮源,以高纯氮气为载气,采用热壁式管式反应炉,通过低压化学气相沉积(low pressure chemical vapor deposition,LPCVD)技术制备了氮化硅薄膜(SiN_x)。借助椭圆偏振仪研究了SiN_x薄膜的生长动力学,通过Fourier红外光谱和X光电子能谱表征了SiN_x薄膜的性质,并利用原子力显微镜观察了SiN_x薄膜的微观形貌。在其它工艺条件相同的情况下,SiN_x薄膜的生长速率随着工作压力的增大单调增加,原料气中氨气与硅烷的流量之比(R)对薄膜的生长速率有相反的影响。随着反应温度的升高,沉积速率逐渐增加,在840℃附近达到最大,随后迅速降低。当R<2时获得富Si的SiN_x薄膜(x<1.33);当R>4时获得近化学计量(z≈1.33)的SiN_x薄膜。
文摘SiNx：H films with different N/Si ratios are synthesized by plasma-enhanced chemical vapor deposition （PECVD）. Composition and structure characteristics are detected by Fourier transform infrared spectroscopy （FTIR） and X-ray photoelectron spectroscopy （XPS）. It indicates that Si-N bonds increase with increased NH3/SiH4 ratio. Electrical property investigations by I-V measurements show that the prepared films offer higher resistivity and less leakage current with increased N/Si ratio and exhibit entirely insulating properties when N/Si ratio reaches 0.9, which is ascribed to increased Si-N bonds achieved.
