We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it...We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.展开更多
Two dimensional scan for laser welded joint of stainless steel was implemented according to the reflection characteristics of ultrasonic. B-scan imaging technique was applied to characterize the fusion state in the jo...Two dimensional scan for laser welded joint of stainless steel was implemented according to the reflection characteristics of ultrasonic. B-scan imaging technique was applied to characterize the fusion state in the joint and distinguish welding detects such as incomplete penetration. Calculation of weld width at the interface of the two plates and imaging of the weld cross section were accomplished. Experimental results show that rapid nondestructive testing can be achieved by this method with threshold value of 30% attenuation degree. The calculation error is less than 0. 25 mm.展开更多
文摘We propose a new laser preparation technique to solder Sn-Ag3.5-Cu0.7 on a copper clad laminate （CCL）. The experiment is conducted by selective laser heating and melting the thin solder layer and then preprinting it on CCL in order to form the matrix with solder pads. Through the analysis of macro morphology of the matrix with solder pads and microstructure of single pads, this technique is proved to be suitable for preparing solder pads and that the solder pads are of good mechanical properties. The results also reveal that high frequency laser pulse is beneficial to the formation of better solder pad, and that the 12-W fiber laser with a beam diameter of 0.030 mm can solder Sn-Ag3.5-Cu0.7 successfully on CCL at 500-kHz pulse frequency. The optimized parameters of laser soldering on CCL are as follows： the laser power is 12 W, the scanning speed is 1.0 mm/s, the beam diameter is 0.030 ram, the lead-free solder is Sn-Ag3.5-Cu0.7, and the laser pulse frequency is 500 kHz.
文摘Two dimensional scan for laser welded joint of stainless steel was implemented according to the reflection characteristics of ultrasonic. B-scan imaging technique was applied to characterize the fusion state in the joint and distinguish welding detects such as incomplete penetration. Calculation of weld width at the interface of the two plates and imaging of the weld cross section were accomplished. Experimental results show that rapid nondestructive testing can be achieved by this method with threshold value of 30% attenuation degree. The calculation error is less than 0. 25 mm.
