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A Monolithic InGaP/GaAs HBT PA for TD-SCDMA Handset Application 被引量:1
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作者 毕晓君 张海英 +1 位作者 陈立强 黄清华 《Journal of Semiconductors》 EI CAS CSCD 北大核心 2008年第10期1868-1872,共5页
This paper demonstrates the design and fabrication of a monolithic HBT power amplifier for TD-SCDMA cellu- lar phones that achieves high efficiency and linearity. The two-stage MMIC integrates the input matching circu... This paper demonstrates the design and fabrication of a monolithic HBT power amplifier for TD-SCDMA cellu- lar phones that achieves high efficiency and linearity. The two-stage MMIC integrates the input matching circuits,interstage matching circuits, and active bias circuits in a single chip with size as small as 0.91mm × 0.98mm. The amplifier obtains a power-added efficiency of 43% (15%) and a gain of 28.5dB (24dB) at the high and low operation mode under the 3.4V supply. In addition, the adjacent channel leakage power is below - 45dBc/- 56dBc and - 39dBc/- 50dBc at 1.6MHz/3.2MHz offset in low and high power output modes, respectively, with QPSK modulation. The MMIC offers the potential for low cost production due to small chip size, stable voltage supply, and high performance at the same time. 展开更多
关键词 rd-scdma power amplifier InGaP/GaAs HBT PAE ACPR
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