Optical frequency combs,a revolutionary light source characterized by discrete and equally spaced frequencies,are usually regarded as a cornerstone for advanced frequency metrology,precision spectroscopy,high-speed co...Optical frequency combs,a revolutionary light source characterized by discrete and equally spaced frequencies,are usually regarded as a cornerstone for advanced frequency metrology,precision spectroscopy,high-speed communication,distance ranging,molecule detection,and many others.Due to the rapid development of micro/nanofabrication technology,breakthroughs in the quality factor of microresonators enable ultrahigh energy buildup inside cavities,which gives birth to microcavity-based frequency combs.In particular,the full coherent spectrum of the soliton microcomb(SMC)provides a route to low-noise ultrashort pulses with a repetition rate over two orders of magnitude higher than that of traditional mode-locking approaches.This enables lower power consumption and cost for a wide range of applications.This review summarizes recent achievements in SMCs,including the basic theory and physical model,as well as experimental techniques for single-soliton generation and various extraordinary soliton states(soliton crystals,Stokes solitons,breathers,molecules,cavity solitons,and dark solitons),with a perspective on their potential applications and remaining challenges.展开更多
The arrival of the big data era has driven the rapid development of high-speed optical signaling and processing, ranging from long-haul optical communication links to short-reach data centers and highperformance compu...The arrival of the big data era has driven the rapid development of high-speed optical signaling and processing, ranging from long-haul optical communication links to short-reach data centers and highperformance computing, and even micro-/nano-scale inter-chip and intra-chip optical interconnects.On-chip photonic signaling is essential for optical data transmission, especially for chip-scale optical interconnects, while on-chip photonic processing is a critical technology for optical data manipulation or processing, especially at the network nodes to facilitate ultracompact data management with low power consumption. In this paper, we review recent research progress in on-chip photonic signaling and processing on silicon photonics platforms. Firstly, basic key devices (lasers, modulators, detectors)are introduced. Secondly, for on-chip photonic signaling, we present recent works on on-chip data transmission of advanced multi-level modulation signals using various silicon photonic integrated devices(microring, slot waveguide, hybrid plasmonic waveguide, subwavelength grating slot waveguide).Thirdly, for on-chip photonic processing, we summarize recent works on on-chip data processing of advanced multi-level modulation signals exploiting linear and nonlinear effects in different kinds of silicon photonic integrated devices (strip waveguide, directional coupler, 2D grating coupler, microring,silicon-organic hybrid slot waveguide). Various photonic processing functions are demonstrated, such as photonic switch, filtering, polarization/wavelength/mode (de)multiplexing, wavelength conversion,signal regeneration, optical logic and computing. Additionally, we also introduce extended silicon+photonics and show recent works on on-chip graphene-silicon photonic signal processing. The advances in on-chip silicon photonic signaling and processing with favorable performance pave the way to integrate complete optical communication systems on a monolithic chip and integrate silicon photonics and silicon nanoelectronics on a chip展开更多
Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,whic...Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,which in itself,has been the focus of research and development extensively.This paper sheds light and conveys our perspective on the current state-of-the-art in different aspects of application-driven on-chip silicon lasers.We tackle this from two perspectives:device-level and system-wide points of view.In the former,the different routes taken in integrating on-chip lasers are explored from different material systems to the chosen integration methodologies.Then,the discussion focus is shifted towards system-wide applications that show great prospects in incorporating photonic integrated circuits(PIC)with on-chip lasers and active devices,namely,optical communications and interconnects,optical phased array-based LiDAR,sensors for chemical and biological analysis,integrated quantum technologies,and finally,optical computing.By leveraging the myriad inherent attractive features of integrated silicon photonics,this paper aims to inspire further development in incorporating PICs with on-chip lasers in,but not limited to,these applications for substantial performance gains,green solutions,and mass production.展开更多
To overcome the capacity crunch of optical communications based on the traditional single-mode fiber(SMF), different modes in a few-mode fiber(FMF) can be employed for mode division multiplexing(MDM). MDM can also be ...To overcome the capacity crunch of optical communications based on the traditional single-mode fiber(SMF), different modes in a few-mode fiber(FMF) can be employed for mode division multiplexing(MDM). MDM can also be extended to photonic integration for obtaining improved density and efficiency, as well as interconnection capacity. Therefore, MDM becomes the most promising method for maintaining the trend of "Moore’s law" in photonic integration and optical fiber transmission. In this tutorial, we provide a review of MDM works and cutting-edge progresses from photonic integration to optical fiber transmission, including our recent works of MDM low-noise amplification, FMF fiber design, MDM Si photonic devices, and so on. Research and application challenges of MDM for optical communications regarding long-haul transmission and short reach interconnection are discussed as well. The content is expected to be of important value for both academic researchers and industrial engineers during the development of next-generation optical communication systems,from photonic chips to fiber links.展开更多
Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However...Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based solutions.Specifically,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly process.This unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based solutions.In this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical stops.FaML can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective surfaces.Specifically,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment tolerances.Moreover,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC facets.We show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical surfaces.Based on our results,we believe that the FaML concept opens an 展开更多
We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integr...We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique.展开更多
In recent years,optical phased arrays(OPAs)have attracted great interest for their potential applications in light detection and ranging(Li DAR),free-space optical communications(FSOs),holography,and so on.Photonic in...In recent years,optical phased arrays(OPAs)have attracted great interest for their potential applications in light detection and ranging(Li DAR),free-space optical communications(FSOs),holography,and so on.Photonic integrated circuits(PICs)provide solutions for further reducing the size,weight,power,and cost of OPAs.In this paper,we review the recent development of photonic integrated OPAs.We summarize the typical architecture of the integrated OPAs and their performance.We analyze the key components of OPAs and evaluate the figure of merit for OPAs.Various applications in Li DAR,FSO,imaging,biomedical sensing,and specialized beam generation are introduced.展开更多
We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent bas...We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.展开更多
基金This work was supported by the National Natural Science Foundation of China(Grant Nos.61635013 and 61675231)the Strategic Priority Research Program of the Chinese Academy of Sciences(Grant No.XDB24030600)the Youth Innovation Promotion Association of CAS(Grant No.2016353)。
文摘Optical frequency combs,a revolutionary light source characterized by discrete and equally spaced frequencies,are usually regarded as a cornerstone for advanced frequency metrology,precision spectroscopy,high-speed communication,distance ranging,molecule detection,and many others.Due to the rapid development of micro/nanofabrication technology,breakthroughs in the quality factor of microresonators enable ultrahigh energy buildup inside cavities,which gives birth to microcavity-based frequency combs.In particular,the full coherent spectrum of the soliton microcomb(SMC)provides a route to low-noise ultrashort pulses with a repetition rate over two orders of magnitude higher than that of traditional mode-locking approaches.This enables lower power consumption and cost for a wide range of applications.This review summarizes recent achievements in SMCs,including the basic theory and physical model,as well as experimental techniques for single-soliton generation and various extraordinary soliton states(soliton crystals,Stokes solitons,breathers,molecules,cavity solitons,and dark solitons),with a perspective on their potential applications and remaining challenges.
基金supported by the National Program for Support of Top-notch Young Professionalsthe National Natural Science Foundation of China(NSFC)(61222502,61761130082,11574001and 11774116)+5 种基金the Royal Society-Newton Advanced Fellowshipthe National Basic Research Program of China(973 Program)(2014CB340004)the Yangtze River Excellent Young Scholars Programthe Program for New Century Excellent Talents in University(NCET-11-0182)the Natural Science Foundation of Hubei Province of China(2018CFA048)the Program for HUST Academic Frontier Youth Team
文摘The arrival of the big data era has driven the rapid development of high-speed optical signaling and processing, ranging from long-haul optical communication links to short-reach data centers and highperformance computing, and even micro-/nano-scale inter-chip and intra-chip optical interconnects.On-chip photonic signaling is essential for optical data transmission, especially for chip-scale optical interconnects, while on-chip photonic processing is a critical technology for optical data manipulation or processing, especially at the network nodes to facilitate ultracompact data management with low power consumption. In this paper, we review recent research progress in on-chip photonic signaling and processing on silicon photonics platforms. Firstly, basic key devices (lasers, modulators, detectors)are introduced. Secondly, for on-chip photonic signaling, we present recent works on on-chip data transmission of advanced multi-level modulation signals using various silicon photonic integrated devices(microring, slot waveguide, hybrid plasmonic waveguide, subwavelength grating slot waveguide).Thirdly, for on-chip photonic processing, we summarize recent works on on-chip data processing of advanced multi-level modulation signals exploiting linear and nonlinear effects in different kinds of silicon photonic integrated devices (strip waveguide, directional coupler, 2D grating coupler, microring,silicon-organic hybrid slot waveguide). Various photonic processing functions are demonstrated, such as photonic switch, filtering, polarization/wavelength/mode (de)multiplexing, wavelength conversion,signal regeneration, optical logic and computing. Additionally, we also introduce extended silicon+photonics and show recent works on on-chip graphene-silicon photonic signal processing. The advances in on-chip silicon photonic signaling and processing with favorable performance pave the way to integrate complete optical communication systems on a monolithic chip and integrate silicon photonics and silicon nanoelectronics on a chip
基金supported by Intel(CG#62148533)Advanced Research Projects Agency-Energy(ARPA-E)(DE-AR0001039)+1 种基金the U.S.Department of Defense under AIM Photonics(Air Force contract FA8650-15-2-5220)the DARPA LUMOS(DARPA contract HR001120C0142).
文摘Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,which in itself,has been the focus of research and development extensively.This paper sheds light and conveys our perspective on the current state-of-the-art in different aspects of application-driven on-chip silicon lasers.We tackle this from two perspectives:device-level and system-wide points of view.In the former,the different routes taken in integrating on-chip lasers are explored from different material systems to the chosen integration methodologies.Then,the discussion focus is shifted towards system-wide applications that show great prospects in incorporating photonic integrated circuits(PIC)with on-chip lasers and active devices,namely,optical communications and interconnects,optical phased array-based LiDAR,sensors for chemical and biological analysis,integrated quantum technologies,and finally,optical computing.By leveraging the myriad inherent attractive features of integrated silicon photonics,this paper aims to inspire further development in incorporating PICs with on-chip lasers in,but not limited to,these applications for substantial performance gains,green solutions,and mass production.
基金supported by the National Key R&D Program of China (No. 2018YFB1801804)the National Natural Science Foundation of China (NSFC) (Nos. 61935011, 61875124, and 61675128)
文摘To overcome the capacity crunch of optical communications based on the traditional single-mode fiber(SMF), different modes in a few-mode fiber(FMF) can be employed for mode division multiplexing(MDM). MDM can also be extended to photonic integration for obtaining improved density and efficiency, as well as interconnection capacity. Therefore, MDM becomes the most promising method for maintaining the trend of "Moore’s law" in photonic integration and optical fiber transmission. In this tutorial, we provide a review of MDM works and cutting-edge progresses from photonic integration to optical fiber transmission, including our recent works of MDM low-noise amplification, FMF fiber design, MDM Si photonic devices, and so on. Research and application challenges of MDM for optical communications regarding long-haul transmission and short reach interconnection are discussed as well. The content is expected to be of important value for both academic researchers and industrial engineers during the development of next-generation optical communication systems,from photonic chips to fiber links.
基金the Deutsche Forschungsgemeinschaft(DFG,German Research Foundation)under Germany’s Excellence Strategy via the Excellence Cluster 3D Matter Made to Order(EXC-2082/1-390761711)the Collaborative Research Center WavePhenomena(CRC 1173)+4 种基金by the Bundesministerium für Bildung und Forschung(BMBF)via the projects PRIMA(#13N14630),DiFeMiS(#16ES0948)which is part of the programme“Forschungslabore Mikroelektronik Deutschland(ForLab),and Open6GHub(#16KISK010)by the European Research Council(ERC Consolidator Grant‘TeraSHAPE’#773248),by the H2020 Photonic Packaging Pilot Line PIXAPP(#731954)by the Alfried Krupp von Bohlen und Halbach Foundation,and by the Karlsruhe School of Optics and Photonics(KSOP).
文摘Wafer-level mass production of photonic integrated circuits(PIC)has become a technological mainstay in the field of optics and photonics,enabling many novel and disrupting a wide range of existing applications.However,scalable photonic packaging and system assembly still represents a major challenge that often hinders commercial adoption of PIC-based solutions.Specifically,chip-to-chip and fiber-to-chip connections often rely on so-called active alignment techniques,where the coupling efficiency is continuously measured and optimized during the assembly process.This unavoidably leads to technically complex assembly processes and high cost,thereby eliminating most of the inherent scalability advantages of PIC-based solutions.In this paper,we demonstrate that 3D-printed facet-attached microlenses(FaML)can overcome this problem by opening an attractive path towards highly scalable photonic system assembly,relying entirely on passive assembly techniques based on industry-standard machine vision and/or simple mechanical stops.FaML can be printed with high precision to the facets of optical components using multi-photon lithography,thereby offering the possibility to shape the emitted beams by freely designed refractive or reflective surfaces.Specifically,the emitted beams can be collimated to a comparatively large diameter that is independent of the device-specific mode fields,thereby relaxing both axial and lateral alignment tolerances.Moreover,the FaML concept allows to insert discrete optical elements such as optical isolators into the free-space beam paths between PIC facets.We show the viability and the versatility of the scheme in a series of selected experiments of high technical relevance,comprising pluggable fiber-chip interfaces,the combination of PIC with discrete micro-optical elements such as polarization beam splitters,as well as coupling with ultra-low back-reflection based on non-planar beam paths that only comprise tilted optical surfaces.Based on our results,we believe that the FaML concept opens an
基金the National High-Tech Research & Development Program of China (2011AA0103)
文摘We summarized the design, fabrication challenges and important technologies for multi-wavelength laser transmitting photonic integration. Technologies discussed include multi-wavelength laser arrays, monolithic integration and modularizing coupling and packaging. Fabrication technique requirements have significantly declined with the rise of reconstruction-equivalent-chirp and second nanoimprint mask technologies. The monolithic integration problem between active and passive waveguides can be overcome with Butt-joint and InP array waveguide grating technologies. The dynamic characteristics of multi-factors will be simultaneously measured with multi-port analyzing modules. The performance of photonic integration chips is significantly improved with the autoecious factors compensation packaging technique.
基金supported by the Key Research and Development Program of Hubei Province(No.2021BAA004)the Innovation Project of Optics Valley Laboratory(Nos.OVL2021BG004 and OVL2023ZD004)+1 种基金the National Natural Science Foundation of China(NSFC)(Nos.62125503,62261160388,and 62105115)the Natural Science Foundation of Hubei Province of China(No.2023AFA028)。
文摘In recent years,optical phased arrays(OPAs)have attracted great interest for their potential applications in light detection and ranging(Li DAR),free-space optical communications(FSOs),holography,and so on.Photonic integrated circuits(PICs)provide solutions for further reducing the size,weight,power,and cost of OPAs.In this paper,we review the recent development of photonic integrated OPAs.We summarize the typical architecture of the integrated OPAs and their performance.We analyze the key components of OPAs and evaluate the figure of merit for OPAs.Various applications in Li DAR,FSO,imaging,biomedical sensing,and specialized beam generation are introduced.
文摘We formulate a “Moore’s law” for photonic integrated circuits (PICs) and their spatial integration density using two methods. One is decomposing the integrated photonics devices of diverse types into equivalent basic elements, which makes a comparison with the generic elements of electronic integrated circuits more meaningful. The other is making a complex compo- nent equivalent to a series of basic elements of the same functionality, which is used to calculate the integration density for func- tional components realized with different structures. The results serve as a benchmark of the evolution of PICs and we can con- clude that the density of integration measured in this way roughly increases by a factor of 2 per year. The prospects for a continued increase of spatial integration density are discussed.