A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan....A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan.A special optional gate bias technique is introduced to allow an adjustable gain control range of 10 dB.A novel cascode structure is adopted to extend the output voltage and bandwidth.The measurement results show that the amplifier gives an average gain of 15 dB with a gain flatness of±1 dB in the 2-20 GHz band.The noise figure is between 2 and 4.1 dB during the band from 2 to 20 GHz.The amplifier also provides 13.8 dBm of output power at a 1 dB gain compression point and 10.5 dBm of input third order intercept point（IIP3）,which demonstrates the excellent performance of linearity.The power consumption is 300 mW with a supply of 5 V,and the chip area is 2.36×1.01 mm^2.展开更多
The high power microwave （HPM） damage effect on the AIGaAs/InGaAs pseudomorphic high electron mobility transistor （pHEMT） is studied by simulation and experiments. Simulated results suggest that the HPM damage to ...The high power microwave （HPM） damage effect on the AIGaAs/InGaAs pseudomorphic high electron mobility transistor （pHEMT） is studied by simulation and experiments. Simulated results suggest that the HPM damage to pHEMT is due to device burn-out caused by the emerging current path and strong electric field beneath the gate. Besides, the results demonstrate that the damage power threshold decreases but the energy threshold slightly increases with the increase of pulse-width, indicating that HPM with longer pulse-width requires lower power density but more energy to cause the damage to pHEMT. The empirical formulas are proposed to describe the pulse-width dependence. Then the experimental data validate the pulse-width dependence and verify that the proposed formula P = 55τ^-0.06 is capable of quickly and accurately estimating the HPM damage susceptibility of pHEMT. Finally the interior observation of damaged samples by scanning electron microscopy （SEM） illustrates that the failure mechanism of the HPM damage to pHEMT is indeed device bum-out and the location beneath the gate near the source side is most susceptible to bum-out, which is in accordance with the simulated results.展开更多
采用E-mode 0.25μm Ga As p HEMT工艺,2.0 mm×2.0 mm 8-pin双侧引脚扁平封装,设计了一款应用于S波段的噪声系数低于0.5 d B的低噪声放大器。通过采用共源共栅结构、有源偏置网络和多重反馈网络等技术改进了电路结构,该放大器具有...采用E-mode 0.25μm Ga As p HEMT工艺,2.0 mm×2.0 mm 8-pin双侧引脚扁平封装,设计了一款应用于S波段的噪声系数低于0.5 d B的低噪声放大器。通过采用共源共栅结构、有源偏置网络和多重反馈网络等技术改进了电路结构,该放大器具有低噪声,高增益,高线性等特点,是手持终端应用上理想的一款低噪声放大器。测试结果表明在2.3 GHz^2.7 GHz内,增益大于18 d B,输入回波损耗小于-10 d B,输出回波损耗小于-16 d B,输出三阶交调点大于36 d B。展开更多
基金Project supported by the National Natural Science Foundation of China(No.61106021)the Chinese Postdoctoral Science Foundation(Nos. 20090461049.20090461048)the Innovation Fund of Ministry of Science & Technology for Small and Medium Sized Enterprises, China(No.11C26213211234)
文摘A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan.A special optional gate bias technique is introduced to allow an adjustable gain control range of 10 dB.A novel cascode structure is adopted to extend the output voltage and bandwidth.The measurement results show that the amplifier gives an average gain of 15 dB with a gain flatness of±1 dB in the 2-20 GHz band.The noise figure is between 2 and 4.1 dB during the band from 2 to 20 GHz.The amplifier also provides 13.8 dBm of output power at a 1 dB gain compression point and 10.5 dBm of input third order intercept point（IIP3）,which demonstrates the excellent performance of linearity.The power consumption is 300 mW with a supply of 5 V,and the chip area is 2.36×1.01 mm^2.
基金Project supported by the National Basic Research Program of China(Grant No.2014CB339900)the National Natural Science Foundation of China(Grant No.60776034)
文摘The high power microwave （HPM） damage effect on the AIGaAs/InGaAs pseudomorphic high electron mobility transistor （pHEMT） is studied by simulation and experiments. Simulated results suggest that the HPM damage to pHEMT is due to device burn-out caused by the emerging current path and strong electric field beneath the gate. Besides, the results demonstrate that the damage power threshold decreases but the energy threshold slightly increases with the increase of pulse-width, indicating that HPM with longer pulse-width requires lower power density but more energy to cause the damage to pHEMT. The empirical formulas are proposed to describe the pulse-width dependence. Then the experimental data validate the pulse-width dependence and verify that the proposed formula P = 55τ^-0.06 is capable of quickly and accurately estimating the HPM damage susceptibility of pHEMT. Finally the interior observation of damaged samples by scanning electron microscopy （SEM） illustrates that the failure mechanism of the HPM damage to pHEMT is indeed device bum-out and the location beneath the gate near the source side is most susceptible to bum-out, which is in accordance with the simulated results.
文摘采用E-mode 0.25μm Ga As p HEMT工艺,2.0 mm×2.0 mm 8-pin双侧引脚扁平封装,设计了一款应用于S波段的噪声系数低于0.5 d B的低噪声放大器。通过采用共源共栅结构、有源偏置网络和多重反馈网络等技术改进了电路结构,该放大器具有低噪声,高增益,高线性等特点,是手持终端应用上理想的一款低噪声放大器。测试结果表明在2.3 GHz^2.7 GHz内,增益大于18 d B,输入回波损耗小于-10 d B,输出回波损耗小于-16 d B,输出三阶交调点大于36 d B。
