Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Mo...Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Moreover,the working grits have low protrusion heights,so the cutting speed of the tool is limited. Furthermore,the rubbing of metal matrix and the work object can cause thermal damages of diamond and other materials,and power increase for the operation. Diamond can be firmly held in a metal matrix by brazing.Because of the presence of strong chemical bonding,diamond grits can protrude twice as high without being knocked off from the matrix.As a result,the cutting speed of the tool may be doubled. When the braze melts,the carbide formers will migrate toward diamond to form carbide at the interface. This reaction may be excessive as to degrade diamond significantly.In this case,a coating on diamond may be needed to moderate the reaction. When diamond is brazed on the surface of a substrate,the melt tends to pull the grits closer together that may thicken the braze layer locally.The clustering of grits can reduce the cutting effectiveness of the diamond tool.A diamond grid design is necessary to maintain the uniform thickness of the braze layer.Moreover,the controlled melting of braze alloy can form a gentle slope around each diamond grit.Such a massive support can allow aggressive cutting of the diamond tool with a low power consumption.展开更多
Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity ...Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity is controlled by the frequency(density) of such asperities.Current diamond pad conditioners cannot dress the pad to produce microns sized asperities at high density.This is because the tips of diamond grits cannot be leveled to the same height so the grooved pad top is uneven with excessive asperities that may ruin the wafer and under sized asperities that is easily glazed. New designs of diamond pad conditioners have markedly improved the leveling of diamond tips.Organic diamond disks(ODD) are manufactured by reverse casting of polymers.Due to the uniform spacing of diamond grits and their controlled tip heights,none of the diamond grits will be overly stressed.Moreover,all diamond grits are sharing the dressing work.Consequently,the number of working grits of ODD is significantly higher than conventional designs.Moreover,because no diamond will cut pad unecessarily,the pad life is greatly lengthened.Furthermore,due to the uniform distribution of pad asperities,the slurry will be held efficiently so the run off is avoided.As a result,the slurry usage is reduced.ODD is therefore a significant savor of CMP consumables for semiconductor manufacture.展开更多
With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not o...With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.展开更多
Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the h...Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the higher stress present.展开更多
文摘Diamond grits held in metal matrix(sintered or electroplated) are retained primary by mechanical locking.Because of this weak attachment,the pullouts of diamond from matrix are inevitable during the cutting process.Moreover,the working grits have low protrusion heights,so the cutting speed of the tool is limited. Furthermore,the rubbing of metal matrix and the work object can cause thermal damages of diamond and other materials,and power increase for the operation. Diamond can be firmly held in a metal matrix by brazing.Because of the presence of strong chemical bonding,diamond grits can protrude twice as high without being knocked off from the matrix.As a result,the cutting speed of the tool may be doubled. When the braze melts,the carbide formers will migrate toward diamond to form carbide at the interface. This reaction may be excessive as to degrade diamond significantly.In this case,a coating on diamond may be needed to moderate the reaction. When diamond is brazed on the surface of a substrate,the melt tends to pull the grits closer together that may thicken the braze layer locally.The clustering of grits can reduce the cutting effectiveness of the diamond tool.A diamond grid design is necessary to maintain the uniform thickness of the braze layer.Moreover,the controlled melting of braze alloy can form a gentle slope around each diamond grit.Such a massive support can allow aggressive cutting of the diamond tool with a low power consumption.
文摘Diamond pad conditioners can determine the efficiency of CMP processes and the quality of polished wafers.The polishing rate of a wafer is dependent on the amplitude(height) of pad asperities.The polishing uniformity is controlled by the frequency(density) of such asperities.Current diamond pad conditioners cannot dress the pad to produce microns sized asperities at high density.This is because the tips of diamond grits cannot be leveled to the same height so the grooved pad top is uneven with excessive asperities that may ruin the wafer and under sized asperities that is easily glazed. New designs of diamond pad conditioners have markedly improved the leveling of diamond tips.Organic diamond disks(ODD) are manufactured by reverse casting of polymers.Due to the uniform spacing of diamond grits and their controlled tip heights,none of the diamond grits will be overly stressed.Moreover,all diamond grits are sharing the dressing work.Consequently,the number of working grits of ODD is significantly higher than conventional designs.Moreover,because no diamond will cut pad unecessarily,the pad life is greatly lengthened.Furthermore,due to the uniform distribution of pad asperities,the slurry will be held efficiently so the run off is avoided.As a result,the slurry usage is reduced.ODD is therefore a significant savor of CMP consumables for semiconductor manufacture.
文摘With the relentless densification of interconnected circuitry dictated by Moore’ s Law,the CMP manufacture of such delicate wafers requires the significant reduction of polishing pressure of integrated circuits,not only globally,but also locally on every tip of the pad asperities.Conventional diamond disks used for dressing the polyurethane pads cannot produce asperities to achieve such uniformity.A new design of diamond disk was fabricated by casting diamond film on a silicon wafer that contains patterned etching pits. This silicon mold was subsequently removed by dissolution in a hydroxide solution.The diamond film followed the profile of the etching pits on silicon to form pyramids of identical in size and shape.The variation of their tip heights was in microns of single digit that was about one order of magnitude smaller than conventional diamond disks for CMP production.Moreover,the diamond film contained no metal that might contaminate the circuits on polished wafer during a CMP operation.The continuous diamond film could resist any corrosive attack by slurry of acid or base.Consequently,in-situ dressing during CMP is possible that may improve wafer uniformity and production throughput.This ideal diamond disk(IDD) is designed for the future manufacture of advanced semiconductor chips with node sizes of 32 nm or smaller.
文摘Diamond grits may be thermally weakened during the high temperature cycle of brazing.This weakening may exhibit as diamond breakage.During the dressing action,taller diamond grits are more likely to break due to the higher stress present.
