对比分析目前商用大功率COB(Chip On Board)封装硅胶的性能;总结近年来大功率COB LED封装的国内外研究进展,重点分析COB封装散热结构的研究情况;根据研究及应用情况,指出COB封装过程中的一些关键的技术问题,并针对这些问题给出一些合理...对比分析目前商用大功率COB(Chip On Board)封装硅胶的性能;总结近年来大功率COB LED封装的国内外研究进展,重点分析COB封装散热结构的研究情况;根据研究及应用情况,指出COB封装过程中的一些关键的技术问题,并针对这些问题给出一些合理化的解决方案。摘要:展开更多
针对系统级封装(System in Package,SiP)中多尺度复杂结构的热仿真效率等问题,采用热阻网络等效热导率方法,推导得到等效热导率模型。与精确SiP模型相比,等效模型的仿真效率提高了58%,同时保证了仿真精度,两者之间误差为7.6%。对等效Si...针对系统级封装(System in Package,SiP)中多尺度复杂结构的热仿真效率等问题,采用热阻网络等效热导率方法,推导得到等效热导率模型。与精确SiP模型相比,等效模型的仿真效率提高了58%,同时保证了仿真精度,两者之间误差为7.6%。对等效SiP模型进行散热优化设计,分析带散热器的自然对流、带散热器的强迫风冷和微通道液冷3种方案的散热效果,结果显示微通道液冷表面传热系数大,散热能力更强,完全满足高功率SiP可靠工作的温度要求。展开更多
High power light-emitting diodes （LEDs） lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market a...High power light-emitting diodes （LEDs） lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.展开更多
文摘针对系统级封装(System in Package,SiP)中多尺度复杂结构的热仿真效率等问题,采用热阻网络等效热导率方法,推导得到等效热导率模型。与精确SiP模型相比,等效模型的仿真效率提高了58%,同时保证了仿真精度,两者之间误差为7.6%。对等效SiP模型进行散热优化设计,分析带散热器的自然对流、带散热器的强迫风冷和微通道液冷3种方案的散热效果,结果显示微通道液冷表面传热系数大,散热能力更强,完全满足高功率SiP可靠工作的温度要求。
文摘High power light-emitting diodes （LEDs） lighting has drawn a great interest in the field of street light system in recent years. Key parameters for successful launching of LED street light in the commercial market are price and light efficiency, respectively, and they are greatly influenced by the materials and design factors used in high power LED package. This article presents a new design and materials processing technology to realize the solution of LED packaging with advantageous in price and performance. Cost effective materials and processing technology can be realized via thick film glass-ceramic insulating layer and silver conductor. Highly effective thermal design using direct heat dissipation to heat sink in LED package is demonstrated.
