设计并用低成本的0.5μm BCD(biplor,CMOS and DMOS)工艺实现了用于650nm塑料光纤(POF)通信的Si基单片集成光接收芯片,其中包含了与标准工艺兼容的大面积的叉指状的PIN结构的光电探测器(PD)、跨阻放大器(TIA)以及后端放大器(PA)。采用N...设计并用低成本的0.5μm BCD(biplor,CMOS and DMOS)工艺实现了用于650nm塑料光纤(POF)通信的Si基单片集成光接收芯片,其中包含了与标准工艺兼容的大面积的叉指状的PIN结构的光电探测器(PD)、跨阻放大器(TIA)以及后端放大器(PA)。采用NI公司的图形化编程软件LabVIEW和硬件PXI并结合光学调整平台的测试方案对流片后的光接收芯片进行测试,结果表明,PD的暗电流为pA量级,响应度为0.25A/W,电容为4.4pF;对650nm的入射光,在180Mbit/s速率的伪随机二进制序列(PRBS)以及小于10-9的误码率(BER)条件下,测得光接收芯片的灵敏度为-14.6dBm,并能得到清晰的眼图,包括200μm×200μm的PD在内总的芯片面积0.9mm2,5V的电源下功耗为60mW。展开更多
Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides withi...Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.展开更多
文摘设计并用低成本的0.5μm BCD(biplor,CMOS and DMOS)工艺实现了用于650nm塑料光纤(POF)通信的Si基单片集成光接收芯片,其中包含了与标准工艺兼容的大面积的叉指状的PIN结构的光电探测器(PD)、跨阻放大器(TIA)以及后端放大器(PA)。采用NI公司的图形化编程软件LabVIEW和硬件PXI并结合光学调整平台的测试方案对流片后的光接收芯片进行测试,结果表明,PD的暗电流为pA量级,响应度为0.25A/W,电容为4.4pF;对650nm的入射光,在180Mbit/s速率的伪随机二进制序列(PRBS)以及小于10-9的误码率(BER)条件下,测得光接收芯片的灵敏度为-14.6dBm,并能得到清晰的眼图,包括200μm×200μm的PD在内总的芯片面积0.9mm2,5V的电源下功耗为60mW。
基金supported by the National Key Research and Development Program of China(No.2019YFB2203004).
文摘Due to the rise of 5G,IoT,AI,and high-performance computing applications,datacenter trafc has grown at a compound annual growth rate of nearly 30%.Furthermore,nearly three-fourths of the datacenter trafc resides within datacenters.The conventional pluggable optics increases at a much slower rate than that of datacenter trafc.The gap between application requirements and the capability of conventional pluggable optics keeps increasing,a trend that is unsustainable.Copackaged optics(CPO)is a disruptive approach to increasing the interconnecting bandwidth density and energy efciency by dramatically shortening the electrical link length through advanced packaging and co-optimization of electronics and photonics.CPO is widely regarded as a promising solution for future datacenter interconnections,and silicon platform is the most promising platform for large-scale integration.Leading international companies(e.g.,Intel,Broadcom and IBM)have heavily investigated in CPO technology,an inter-disciplinary research feld that involves photonic devices,integrated circuits design,packaging,photonic device modeling,electronic-photonic co-simulation,applications,and standardization.This review aims to provide the readers a comprehensive overview of the state-of-the-art progress of CPO in silicon platform,identify the key challenges,and point out the potential solutions,hoping to encourage collaboration between diferent research felds to accelerate the development of CPO technology.
