One process based on phase inversion of fillers in microstructures for the fabrication of multi-level three-dimensional(3-D) microstructures is described using SU-8, a kind of epoxy photoresist, as the model construct...One process based on phase inversion of fillers in microstructures for the fabrication of multi-level three-dimensional(3-D) microstructures is described using SU-8, a kind of epoxy photoresist, as the model constructing materials. This process is depicted by use of the routine photolithography technique to construct the top layer of 3-D microstructures on the bottom layer of 3-D microstructures layer by layer. This process makes it possible to fabricate multi-level 3-D microstructures with connectors at desired locations, and to seal long span microstructures(e.g. very shallow channels with depth less than 50 μm and width more than 300 μm) without blockage. In addition, this process can provide a sealing layer by the solidification of a liquid polymer layer, which can be as strong as the bulk constructing materials for microstructures due to a complete contact and cross-linking between the sealing layer and the patterned layers. The hydrodynamic testing indicates that this kind of sealing and interconnection can endure a static pressure of more than 10 MPa overnight and a hydrodynamic pressure drop of about 5.3 MPa for more than 8 hours by pumping the tetrahydrofuran solution through a 60 μm wide micro-channels.展开更多
基金financially supported by the National Science Foundation of China(No.50971010)New Teacher Foundation of Beihang University(211109)+1 种基金New Teacher Funds of Education Ministry of China(2008-00061025)SRF and SEM funds of Education Ministry of China
文摘One process based on phase inversion of fillers in microstructures for the fabrication of multi-level three-dimensional(3-D) microstructures is described using SU-8, a kind of epoxy photoresist, as the model constructing materials. This process is depicted by use of the routine photolithography technique to construct the top layer of 3-D microstructures on the bottom layer of 3-D microstructures layer by layer. This process makes it possible to fabricate multi-level 3-D microstructures with connectors at desired locations, and to seal long span microstructures(e.g. very shallow channels with depth less than 50 μm and width more than 300 μm) without blockage. In addition, this process can provide a sealing layer by the solidification of a liquid polymer layer, which can be as strong as the bulk constructing materials for microstructures due to a complete contact and cross-linking between the sealing layer and the patterned layers. The hydrodynamic testing indicates that this kind of sealing and interconnection can endure a static pressure of more than 10 MPa overnight and a hydrodynamic pressure drop of about 5.3 MPa for more than 8 hours by pumping the tetrahydrofuran solution through a 60 μm wide micro-channels.
