In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore ...In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.展开更多
为了分析微孔聚氨酯弹性材料的力学性能,分别对微孔聚氨酯弹性材料式样进行了拉伸和压缩试验;再利用拉伸与压缩试验数据对常见的经典超弹本构模型进行拟合,得出了相应的本构模型参数;通过误差分析对各种本构模型在不同应变条件下的适用...为了分析微孔聚氨酯弹性材料的力学性能,分别对微孔聚氨酯弹性材料式样进行了拉伸和压缩试验;再利用拉伸与压缩试验数据对常见的经典超弹本构模型进行拟合,得出了相应的本构模型参数;通过误差分析对各种本构模型在不同应变条件下的适用性进行了分析探讨;最后,用拟合出的本构参数对高铁轨道用WJ-8扣件的微孔聚氨酯弹性垫板的静刚度进行数值模拟,有限元仿真结果与产品试验结果进行对比,说明了Yeoh模型、Van der Waals模型和Ogden N=3模型的预测值与试验值的相对误差分别为8.44%,7.83%和5.93%,Ogden N=3模型相对于其他模型具有更高的预测精度。展开更多
文摘In order to obtain substrates with good conductive foam for high porosity foam metal materials used in the metal electrodes,the technique of electroless copper plating on the microcellular polyurethane foam with pore size of 0.3 mm was investigated.The main factors affecting the deposition rate such as the solution composition,temperature,pH value and adding ultrasonic were explored.The results show that the optimum process conditions are CuSO4 16 g/L,HCHO 5 mL/L,NaKC4H4O6 30 g/L,Na2EDTA 20 g/L,K4Fe(CN)6 25 mg/L,pH value of 12.5-13.0 and temperature of 40-50℃.Under these technical conditions, the process has excellent bath stability.Adding ultrasonic on the process can elevate the deposition rate of copper by 20%-30%.The foam metal material with a porosity of 92.2%and a three-dimensional network structure,was fabricated by electro-deposition after the electroless copper plating.
文摘为了分析微孔聚氨酯弹性材料的力学性能,分别对微孔聚氨酯弹性材料式样进行了拉伸和压缩试验;再利用拉伸与压缩试验数据对常见的经典超弹本构模型进行拟合,得出了相应的本构模型参数;通过误差分析对各种本构模型在不同应变条件下的适用性进行了分析探讨;最后,用拟合出的本构参数对高铁轨道用WJ-8扣件的微孔聚氨酯弹性垫板的静刚度进行数值模拟,有限元仿真结果与产品试验结果进行对比,说明了Yeoh模型、Van der Waals模型和Ogden N=3模型的预测值与试验值的相对误差分别为8.44%,7.83%和5.93%,Ogden N=3模型相对于其他模型具有更高的预测精度。
