Third generation semiconductors for piezotronics and piezo-phototronics,such as Zn O and Ga N,have both piezoelectric and semiconducting properties.Piezotronic devices normally exhibit high strain sensitivity because ...Third generation semiconductors for piezotronics and piezo-phototronics,such as Zn O and Ga N,have both piezoelectric and semiconducting properties.Piezotronic devices normally exhibit high strain sensitivity because strain-induced piezoelectric charges control or tune the carrier transport at junctions,contacts and interfaces.The distribution width of piezoelectric charges in a junction is one of important parameters.Capacitance-voltage(C-V)characteristics can be used to estimate the distribution width of strain-induced piezoelectric charges.Piezotronic metal–insulator-semiconductor(MIS)has been modelled by analytical solutions and numerical simulations in this paper,which can serve as guidance for C-V measurements and experimental designs of piezotronic devices.展开更多
In this paper,an InGaN metal-insulator-semiconductor(MIS) photodetector with an ultra-thin Al2O3 insulation layer deposited by atomic layer deposition(ALD) was studied.A high photoelectric responsivity of 0.25 A/W and...In this paper,an InGaN metal-insulator-semiconductor(MIS) photodetector with an ultra-thin Al2O3 insulation layer deposited by atomic layer deposition(ALD) was studied.A high photoelectric responsivity of 0.25 A/W and a spectral responsivity rejection ratio of about three orders of magnitude at 1 V reverse bias were achieved for this MIS photodetector.The dominant carrier transport mechanism in the InGaN MIS photodetectors is submitted to the space charge limited current(SCLC) mechanism at high field and exhibits an Ohmic-like conduction at low electric field.The results indicate that the ultra-thin Al2O3 film deposited by the ALD technique can act as an excellent insulation dielectric for the InGaN photodetectors.展开更多
The results of experimental research of some effects in metal-insulator-semiconductor (MIS) structures induced by different types of radiation (50 MeV electrons, 12 keV gamma-quanta, 10 and 40 keV arsenic ions) are pr...The results of experimental research of some effects in metal-insulator-semiconductor (MIS) structures induced by different types of radiation (50 MeV electrons, 12 keV gamma-quanta, 10 and 40 keV arsenic ions) are presented. It is found that there is a significant difference between the characters of radiation surface states (SS) formed by ionization and impact actions of the MIS structure irradiation at the insulator-semiconductor (I-S) interface. It is shown that the SS generation rate is increased in electric fields and depends on the MIS structure field electrode material.展开更多
A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0...A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0.7N） as a barrier layer and relies on silicon nitride （SIN） passivation to control the 2DEG density is presented. Unlike the SiN passivation, aluminum oxide （AL2O3） by atomic layer deposition （ALD） on A1GaN surface would not increase the 2DEG density in the heterointerface. ALD AL2O3 was used as gate insulator after the depletion by etching of the SiN in the gate region. The E-mode MIS-HEMT with gate length （LG） of 1 μm showed a maximum drain current density （IDs） of 657 mA/mm, a maximum extrinsic transconductance （gin） of 187 mS/ram and a threshold voltage （Vth） of 1 V. Comparing with the corresponding E-mode HEMT, the device performances had been greatly improved due to the insertion of AL2O3 gate insulator. This provided an excellent way to realize E-mode A1GaN/GaN MIS-HEMTs with both high Vth and IDS.展开更多
A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been...A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been fabricated. The experimental results indicate that the prepared ultra-thin Al2O3 gate dielectric exhibits good physical and electrical characteristics, including a high breakdown electrical field of 25 MV/cm, excellent interface properties （1 × 10^14 cm^-2） and low gate-leakage current （IG = 1 × 10^-3 A/cm 2@Eox = 8 MV/cm）. Analysis of the current conduction mecha- nism on the deposited Al2O3 gate dielectric was also systematically performed. The confirmed conduction mechanisms consisted of Fowler-Nordheim （FN） tuaneling, the Frenkel-Poole mechanism, direct tunneling and Schottky emission, and the dominant current conduction mechanism depends on the applied electrical field. When the gate leakage current mechanism is dominated by FN tunneling, the barrier height of SiC/Al2O3 is 1.4 eV, which can meet the requirements of silicon carbide metal-insulator-semiconductor transistor devices.展开更多
In0.3Ga0.7N metal-insulator-semiconductor （MIS） and metal-semiconductor （MS） surface barrier photodetectors have been fabricated. The In0.3Ga0.7N epilayers were grown on sapphire by metalorganic chemical vapour de...In0.3Ga0.7N metal-insulator-semiconductor （MIS） and metal-semiconductor （MS） surface barrier photodetectors have been fabricated. The In0.3Ga0.7N epilayers were grown on sapphire by metalorganic chemical vapour deposition （MOCVD）. The photoresponse and reverse current-voltage characteristics of the In0.3Ga0.7N MIS and MS photodetectors were measured. A best zero bias responsivity of 0.18 A/W at 450 nm is obtained for the In0.3Ga0.7N MIS photodetector with 10 nm Si3N4 insulator layer, which is more than ten times higher than the In0.3Ga0.7N MS photodetector. The reason is attributed to the decrease of the interface states and increase of surface barrier height by the inserted insulator. The influence of the thickness of the Si3N4 insulator layer on the photoresponsivity of the MIS photodetector is also discussed.展开更多
The dielectric properties of Au/Si3N4/n-Si （MIS） structures are studied using the admittance measurements （C–V and G/ω–V） each as a function of temperature in a range from 80 K to 400 K for two frequencies （10...The dielectric properties of Au/Si3N4/n-Si （MIS） structures are studied using the admittance measurements （C–V and G/ω–V） each as a function of temperature in a range from 80 K to 400 K for two frequencies （100 kHz and 1 MHz）. Experimental results show that both the dielectric constant （ε’） and the dielectric loss （ε＂） increase with temperature increasing and decrease with frequency increasing. The measurements also show that the ac conductivity （σac） increases with temperature and frequency increasing. The lnσac versus 1000/T plot shows two linear regions with different slopes which correspond to low （120 K–240 K） and high （280 K–400 K） temperature ranges for the two frequencies. It is found that activation energy increases with frequency and temperature increasing.展开更多
α-Fe_2O_3 nanocrystal was encapsulated by a block-copolymer, hydroxylated poly (styrene-b- butadiene-styrene) (HO-SBS) to fabricate composite microspheres with α-Fe_2O_3 cores and HOSBS shell. Its film fabricated o...α-Fe_2O_3 nanocrystal was encapsulated by a block-copolymer, hydroxylated poly (styrene-b- butadiene-styrene) (HO-SBS) to fabricate composite microspheres with α-Fe_2O_3 cores and HOSBS shell. Its film fabricated on n-Si wafer acts as the insulator layer in the metal-insulator- semiconductor(MIS) structure. The capacitance-voltage (C-V) properties were measured to characterize the composite particulate films.展开更多
AlGaN/GaN heterojunction field-effect transistors(HFETs)with p-GaN cap layer are developed for normally-off operation,in which an in-situ grown AlN layer is utilized as the gate insulator.Compared with the SiNxgate in...AlGaN/GaN heterojunction field-effect transistors(HFETs)with p-GaN cap layer are developed for normally-off operation,in which an in-situ grown AlN layer is utilized as the gate insulator.Compared with the SiNxgate insulator,the AlN/p-GaN interface presents a more obvious energy band bending and a wider depletion region,which helps to positively shift the threshold voltage.In addition,the relatively large conduction band offset of AlN/p-GaN is beneficial to suppress the gate leakage current and enhance the gate breakdown voltage.Owing to the introduction of AlN layer,normally-off p-GaN capped AlGaN/GaN HFET with a threshold voltage of 4 V and a gate swing of 13 V is realized.Furthermore,the field-effect mobility is approximately 1500 cm^(2)·V^(-1)·s^(-1)in the 2DEG channel,implying a good device performance.展开更多
Superior characteristics of Al Ga N-channel metal-insulator-semiconductor（MIS） high electron mobility transistors（HEMTs） at high temperatures are demonstrated in detail. The temperature coefficient of the maximum ...Superior characteristics of Al Ga N-channel metal-insulator-semiconductor（MIS） high electron mobility transistors（HEMTs） at high temperatures are demonstrated in detail. The temperature coefficient of the maximum saturation drain current for the Al GaN-channel MIS HEMT can be reduced by 50% compared with the Ga N-channel HEMT. Moreover, benefiting from the better suppression of gate current and reduced leakage current in the buffer layer, the Al Ga N-channel MIS HEMT demonstrates an average breakdown electric field of 1.83 MV/cm at25℃ and 1.06 MV/cm at 300℃, which is almost 2 times and 3 times respectively larger than that of the reference Ga N-channel HEMT. Pulsed mode analyses suggest that the proposed device suffers from smaller current collapse when the temperature reaches as high as 300℃.展开更多
Sunlight is the most abundant and inexhaustible energy source on earth.However,its low energy density,dispersibility and intermittent nature make its direct utilization with industrial relevance challenging,suggesting...Sunlight is the most abundant and inexhaustible energy source on earth.However,its low energy density,dispersibility and intermittent nature make its direct utilization with industrial relevance challenging,suggesting that converting sunlight into chemical energy and storing it is a valuable measure to achieve global sustainable development.Carbon–neutral,clean and secondary pollution-free solar-driven water splitting to produce hydrogen is one of the most attractive avenues among all the current options and is expected to realize the transformation from dependence on fossil fuels to zero-pollution hydrogen.Artificial photosynthetic systems(APSs)based on photoelectrochemical(PEC)devices appear to be an ideal avenue to efficiently achieve solar-to-hydrogen conversion.In this review,we comprehensively highlight the recent developments in photocathodes,including architectures,semiconductor photoabsorbers and performance optimization strategies.In particular,frontier research cases of organic semiconductors,dye sensitization and surface grafted molecular catalysts applied to APSs based on frontier(molecular)orbital theory and semiconductor energy band theory are discussed.Moreover,research advances in typical photoelectrodes with the metal–insulator–semiconductor(MIS)architecture based on quantum tunnelling are also introduced.Finally,we discuss the benchmarks and protocols for designing integrated tandem photoelectrodes and PEC systems that conform to the solar spectrum to achieve high-efficiency and cost-effective solar-to-hydrogen conversion at an industrial scale in the near future.展开更多
具有金属 /绝缘层 /半导体 /金属结构的场助热电子发射阴极是大屏幕显示器中的主要候选部件。电子发射受到各层薄膜的厚度、材料组分和结晶状态等的严重影响。由Au/Ag双层薄膜构成的上电极使得电子亲和势降低0 .5 e V,发射电流提高了数...具有金属 /绝缘层 /半导体 /金属结构的场助热电子发射阴极是大屏幕显示器中的主要候选部件。电子发射受到各层薄膜的厚度、材料组分和结晶状态等的严重影响。由Au/Ag双层薄膜构成的上电极使得电子亲和势降低0 .5 e V,发射电流提高了数倍。半导体材料 Zn1 - x Mgx O具有低的电子亲和势以及适合电子注入的带隙宽度 ,并且已经较为容易地用溅射方法制备。上电极和半导体层之间的晶格匹配可以降低电子在界面上的散射 ,对提高发射电流是很重要的 ,这已经在 Zn1 - x Mgx O/Au和 L i F/Au界面上实现。在绝缘层和半导体层之间引入界面态控制层可以大大降低驱动电压 。展开更多
基金the support from Swansea University,Solar Photovoltaic Academic Research Consortium(SPARC)ⅡprojectUniversity of Electronic Science and Technology of China.
文摘Third generation semiconductors for piezotronics and piezo-phototronics,such as Zn O and Ga N,have both piezoelectric and semiconducting properties.Piezotronic devices normally exhibit high strain sensitivity because strain-induced piezoelectric charges control or tune the carrier transport at junctions,contacts and interfaces.The distribution width of piezoelectric charges in a junction is one of important parameters.Capacitance-voltage(C-V)characteristics can be used to estimate the distribution width of strain-induced piezoelectric charges.Piezotronic metal–insulator-semiconductor(MIS)has been modelled by analytical solutions and numerical simulations in this paper,which can serve as guidance for C-V measurements and experimental designs of piezotronic devices.
基金supported by the National Natural Science Foundation of China (Grant No. 51141002)the Fundamental Research Funds for the Central Universities (B1020270)Natural Science Foundation of Jiangsu Province of China (Grant No. BK2010521)
文摘In this paper,an InGaN metal-insulator-semiconductor(MIS) photodetector with an ultra-thin Al2O3 insulation layer deposited by atomic layer deposition(ALD) was studied.A high photoelectric responsivity of 0.25 A/W and a spectral responsivity rejection ratio of about three orders of magnitude at 1 V reverse bias were achieved for this MIS photodetector.The dominant carrier transport mechanism in the InGaN MIS photodetectors is submitted to the space charge limited current(SCLC) mechanism at high field and exhibits an Ohmic-like conduction at low electric field.The results indicate that the ultra-thin Al2O3 film deposited by the ALD technique can act as an excellent insulation dielectric for the InGaN photodetectors.
文摘The results of experimental research of some effects in metal-insulator-semiconductor (MIS) structures induced by different types of radiation (50 MeV electrons, 12 keV gamma-quanta, 10 and 40 keV arsenic ions) are presented. It is found that there is a significant difference between the characters of radiation surface states (SS) formed by ionization and impact actions of the MIS structure irradiation at the insulator-semiconductor (I-S) interface. It is shown that the SS generation rate is increased in electric fields and depends on the MIS structure field electrode material.
基金Project supported by the National Natural Science Foundation of China(Nos.61474101,61106130)the Natural Science Foundation of Jiangsu Province of China(No.BK20131072)
文摘A high-performance enhancement-mode （E-mode） gallium nitride （GaN）-based metal-insulator- semiconductor high electron mobility transistor （MIS-HEMT） that employs a 5-nm-thick aluminum gallium nitride （Al0.3Ga0.7N） as a barrier layer and relies on silicon nitride （SIN） passivation to control the 2DEG density is presented. Unlike the SiN passivation, aluminum oxide （AL2O3） by atomic layer deposition （ALD） on A1GaN surface would not increase the 2DEG density in the heterointerface. ALD AL2O3 was used as gate insulator after the depletion by etching of the SiN in the gate region. The E-mode MIS-HEMT with gate length （LG） of 1 μm showed a maximum drain current density （IDs） of 657 mA/mm, a maximum extrinsic transconductance （gin） of 187 mS/ram and a threshold voltage （Vth） of 1 V. Comparing with the corresponding E-mode HEMT, the device performances had been greatly improved due to the insertion of AL2O3 gate insulator. This provided an excellent way to realize E-mode A1GaN/GaN MIS-HEMTs with both high Vth and IDS.
基金supported by the 2010 School Fundamental Scientific Research Fund of Xidian University (Grant No. K50510250008)
文摘A 4H-silicon carbide metal-insulator-semiconductor structure with ultra-thin Al2O3 as the gate dielectric, deposited by atomic layer deposition on tile epitaxial layer of a 4H-SiC （0001） 80N-/N＋ substrate, has been fabricated. The experimental results indicate that the prepared ultra-thin Al2O3 gate dielectric exhibits good physical and electrical characteristics, including a high breakdown electrical field of 25 MV/cm, excellent interface properties （1 × 10^14 cm^-2） and low gate-leakage current （IG = 1 × 10^-3 A/cm 2@Eox = 8 MV/cm）. Analysis of the current conduction mecha- nism on the deposited Al2O3 gate dielectric was also systematically performed. The confirmed conduction mechanisms consisted of Fowler-Nordheim （FN） tuaneling, the Frenkel-Poole mechanism, direct tunneling and Schottky emission, and the dominant current conduction mechanism depends on the applied electrical field. When the gate leakage current mechanism is dominated by FN tunneling, the barrier height of SiC/Al2O3 is 1.4 eV, which can meet the requirements of silicon carbide metal-insulator-semiconductor transistor devices.
基金Project supported by the State Key Development Program for Basic Research of China （Grant No 2006CB6049）, the National Natural Science Foundation of China （Grant No 60476030）, and the Natural Science Foundation of Jiangsu Province of China （Grant No BK2006126）.Acknowledgment The authors gratefully acknowledge Nanjing Institute of Electronic Devices for fabricating the insulator layers of the photodetectors.
文摘In0.3Ga0.7N metal-insulator-semiconductor （MIS） and metal-semiconductor （MS） surface barrier photodetectors have been fabricated. The In0.3Ga0.7N epilayers were grown on sapphire by metalorganic chemical vapour deposition （MOCVD）. The photoresponse and reverse current-voltage characteristics of the In0.3Ga0.7N MIS and MS photodetectors were measured. A best zero bias responsivity of 0.18 A/W at 450 nm is obtained for the In0.3Ga0.7N MIS photodetector with 10 nm Si3N4 insulator layer, which is more than ten times higher than the In0.3Ga0.7N MS photodetector. The reason is attributed to the decrease of the interface states and increase of surface barrier height by the inserted insulator. The influence of the thickness of the Si3N4 insulator layer on the photoresponsivity of the MIS photodetector is also discussed.
基金Projected supported by Gazi University Scientific Research Project(BAP),FEF.05/2012-15
文摘The dielectric properties of Au/Si3N4/n-Si （MIS） structures are studied using the admittance measurements （C–V and G/ω–V） each as a function of temperature in a range from 80 K to 400 K for two frequencies （100 kHz and 1 MHz）. Experimental results show that both the dielectric constant （ε’） and the dielectric loss （ε＂） increase with temperature increasing and decrease with frequency increasing. The measurements also show that the ac conductivity （σac） increases with temperature and frequency increasing. The lnσac versus 1000/T plot shows two linear regions with different slopes which correspond to low （120 K–240 K） and high （280 K–400 K） temperature ranges for the two frequencies. It is found that activation energy increases with frequency and temperature increasing.
基金the National Natural Science Foundation of China
文摘α-Fe_2O_3 nanocrystal was encapsulated by a block-copolymer, hydroxylated poly (styrene-b- butadiene-styrene) (HO-SBS) to fabricate composite microspheres with α-Fe_2O_3 cores and HOSBS shell. Its film fabricated on n-Si wafer acts as the insulator layer in the metal-insulator- semiconductor(MIS) structure. The capacitance-voltage (C-V) properties were measured to characterize the composite particulate films.
基金Supported by the National Natural Science Foundation of China(Grant No.61904207)scientific research support foundation for introduced high-level talents of Shenyang Ligong University(Grant No.1010147000914)the Natural Science Foundation of Sichuan Province,China(Grant No.2022NSFSC0886)
文摘AlGaN/GaN heterojunction field-effect transistors(HFETs)with p-GaN cap layer are developed for normally-off operation,in which an in-situ grown AlN layer is utilized as the gate insulator.Compared with the SiNxgate insulator,the AlN/p-GaN interface presents a more obvious energy band bending and a wider depletion region,which helps to positively shift the threshold voltage.In addition,the relatively large conduction band offset of AlN/p-GaN is beneficial to suppress the gate leakage current and enhance the gate breakdown voltage.Owing to the introduction of AlN layer,normally-off p-GaN capped AlGaN/GaN HFET with a threshold voltage of 4 V and a gate swing of 13 V is realized.Furthermore,the field-effect mobility is approximately 1500 cm^(2)·V^(-1)·s^(-1)in the 2DEG channel,implying a good device performance.
文摘Superior characteristics of Al Ga N-channel metal-insulator-semiconductor（MIS） high electron mobility transistors（HEMTs） at high temperatures are demonstrated in detail. The temperature coefficient of the maximum saturation drain current for the Al GaN-channel MIS HEMT can be reduced by 50% compared with the Ga N-channel HEMT. Moreover, benefiting from the better suppression of gate current and reduced leakage current in the buffer layer, the Al Ga N-channel MIS HEMT demonstrates an average breakdown electric field of 1.83 MV/cm at25℃ and 1.06 MV/cm at 300℃, which is almost 2 times and 3 times respectively larger than that of the reference Ga N-channel HEMT. Pulsed mode analyses suggest that the proposed device suffers from smaller current collapse when the temperature reaches as high as 300℃.
基金supported by the National Key R&D Program of China(2018YFE0208500)the National Natural Science Foundation of China(Grant Nos.22072022,21773031,22011530144).
文摘Sunlight is the most abundant and inexhaustible energy source on earth.However,its low energy density,dispersibility and intermittent nature make its direct utilization with industrial relevance challenging,suggesting that converting sunlight into chemical energy and storing it is a valuable measure to achieve global sustainable development.Carbon–neutral,clean and secondary pollution-free solar-driven water splitting to produce hydrogen is one of the most attractive avenues among all the current options and is expected to realize the transformation from dependence on fossil fuels to zero-pollution hydrogen.Artificial photosynthetic systems(APSs)based on photoelectrochemical(PEC)devices appear to be an ideal avenue to efficiently achieve solar-to-hydrogen conversion.In this review,we comprehensively highlight the recent developments in photocathodes,including architectures,semiconductor photoabsorbers and performance optimization strategies.In particular,frontier research cases of organic semiconductors,dye sensitization and surface grafted molecular catalysts applied to APSs based on frontier(molecular)orbital theory and semiconductor energy band theory are discussed.Moreover,research advances in typical photoelectrodes with the metal–insulator–semiconductor(MIS)architecture based on quantum tunnelling are also introduced.Finally,we discuss the benchmarks and protocols for designing integrated tandem photoelectrodes and PEC systems that conform to the solar spectrum to achieve high-efficiency and cost-effective solar-to-hydrogen conversion at an industrial scale in the near future.
基金Supported by the National Natural Science Foundation of China(61822407,62074161,62004213)the National Key Research and De-velopment Program of China under(2018YFE0125700)。
基金Supported by the National Natural Science Foundation of China (61822407,62074161,62004213)the National Key Research and Development Program of China under (2018YFE0125700)。
文摘具有金属 /绝缘层 /半导体 /金属结构的场助热电子发射阴极是大屏幕显示器中的主要候选部件。电子发射受到各层薄膜的厚度、材料组分和结晶状态等的严重影响。由Au/Ag双层薄膜构成的上电极使得电子亲和势降低0 .5 e V,发射电流提高了数倍。半导体材料 Zn1 - x Mgx O具有低的电子亲和势以及适合电子注入的带隙宽度 ,并且已经较为容易地用溅射方法制备。上电极和半导体层之间的晶格匹配可以降低电子在界面上的散射 ,对提高发射电流是很重要的 ,这已经在 Zn1 - x Mgx O/Au和 L i F/Au界面上实现。在绝缘层和半导体层之间引入界面态控制层可以大大降低驱动电压 。
