The liquid-solid compound casting technology was used to produce the AZ91D/0Cr19Ni9 bimetal composite without and with hot dipping aluminium, respectively. The influences of Al coating on microstructures and mechanica...The liquid-solid compound casting technology was used to produce the AZ91D/0Cr19Ni9 bimetal composite without and with hot dipping aluminium, respectively. The influences of Al coating on microstructures and mechanical properties of AZ91D/0Cr19Ni9 interface were investigated. The results showed that the mechanical bonding was obtained between AZ91D and bare steel 0Cr19Ni9 where a gap existed at the interface; the metallurgical bonding was formed between AZ91D and Al-coated 0Cr19Ni9, which could be divided into two different intermetallic layers: layer Ⅰ was mainly composed of α-Mg+β-Mg17Al12 eutectic structure and a small amount of MgAl2O4, and layer Ⅱ mainly comprised of Fe2Al5 intermetallic compound. Furthermore, the hardness value of interface was obviously higher than that of AZ91D matrix, and the average hardness values of layers Ⅰ and Ⅱ were HV 158 and HV 493, respectively. The shear strength of AZ91D/Al-coated 0Cr19Ni9 interface was higher than that of AZ91D/bare 0Cr19Ni9 interface, which confirmed that Al coating could improve the adhesive strength between AZ91D and 0Cr19Ni9 during liquid-solid compound casting process.展开更多
The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronau...The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronautics,and astronautics,and therefore has drawn increasing research interests.To design preferential microstructure and optimize mechanical properties of the interconnects,it is crucial to understand the formation and growth mechanisms of diversified structures at the L/S interface during interconnecting.In situ synchrotron radiation or tube-generated X-ray radiography and tomography technologies make it possible to observe the evolution of the L/S interface directly and therefore have greatly propelled the research in this field.Here,we review the recent progress in understanding the L/S interface behaviors using advanced in situ X-ray imaging techniques with a particular focus on the following two issues:(1)interface behaviors in the solder joints for microelectronic packaging including the intermetallic compounds(IMCs)during refl ow,Sn dendrites,and IMCs during solidification and refl ow porosities and(2)growth characteristics and morphological transition of IMCs in the interconnect of dissimilar metals at high temperature.Furthermore,the main achievements and future research perspectives in terms of metallurgical bonding mechanisms under complex conditions with improved X-ray sources and detectors are remarked and discussed.展开更多
The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time...The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.展开更多
Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, te...Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, temperature of liquid aluminium, temperture of tools and pressure on thickness of the intermetallic layer at the interface between steel and aluminium under solid-liquid pressure bonding of steel and aluminium perfectly. The optimum thickness has been determined according to the value of the optimum shearing strength.展开更多
Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and roo...Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are gen- erally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac- tions above 20%, the joint strengths decrease.展开更多
To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, ...To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.展开更多
基金Project(cstc2015yykfC0001)supported by the National Engineering Research Centre for Magnesium Alloys,ChinaProject supported by State Key Laboratory of Mechanical Transmission of Chongqing University,China
文摘The liquid-solid compound casting technology was used to produce the AZ91D/0Cr19Ni9 bimetal composite without and with hot dipping aluminium, respectively. The influences of Al coating on microstructures and mechanical properties of AZ91D/0Cr19Ni9 interface were investigated. The results showed that the mechanical bonding was obtained between AZ91D and bare steel 0Cr19Ni9 where a gap existed at the interface; the metallurgical bonding was formed between AZ91D and Al-coated 0Cr19Ni9, which could be divided into two different intermetallic layers: layer Ⅰ was mainly composed of α-Mg+β-Mg17Al12 eutectic structure and a small amount of MgAl2O4, and layer Ⅱ mainly comprised of Fe2Al5 intermetallic compound. Furthermore, the hardness value of interface was obviously higher than that of AZ91D matrix, and the average hardness values of layers Ⅰ and Ⅱ were HV 158 and HV 493, respectively. The shear strength of AZ91D/Al-coated 0Cr19Ni9 interface was higher than that of AZ91D/bare 0Cr19Ni9 interface, which confirmed that Al coating could improve the adhesive strength between AZ91D and 0Cr19Ni9 during liquid-solid compound casting process.
基金supported by the National Key Research and Development Program(Nos.2017YFA0403800 and 2017YFB0305301)the National Natural Science Foundation of ChinaExcellent Young Scholars(No.51922068)+1 种基金the National Natural Science Foundation of China(Nos.51727802,51821001 and 51904187)funded by China Postdoctoral Science Foundation(No.2019M661500)。
文摘The liquid/solid(L/S)interface of dissimilar metals is critical to the microstructure,mechanical strength,and structural integrity of interconnects in many important applications such as electronics,automotive,aeronautics,and astronautics,and therefore has drawn increasing research interests.To design preferential microstructure and optimize mechanical properties of the interconnects,it is crucial to understand the formation and growth mechanisms of diversified structures at the L/S interface during interconnecting.In situ synchrotron radiation or tube-generated X-ray radiography and tomography technologies make it possible to observe the evolution of the L/S interface directly and therefore have greatly propelled the research in this field.Here,we review the recent progress in understanding the L/S interface behaviors using advanced in situ X-ray imaging techniques with a particular focus on the following two issues:(1)interface behaviors in the solder joints for microelectronic packaging including the intermetallic compounds(IMCs)during refl ow,Sn dendrites,and IMCs during solidification and refl ow porosities and(2)growth characteristics and morphological transition of IMCs in the interconnect of dissimilar metals at high temperature.Furthermore,the main achievements and future research perspectives in terms of metallurgical bonding mechanisms under complex conditions with improved X-ray sources and detectors are remarked and discussed.
文摘The liquid-film solution-diffusion bonding of ZCuBe2.5 alloys was conducted using Cu-based alloy powders. The tensile strength of the joint is up to 318 MPa. With the increase of temperature gradient, the bonding time decreases and the interface migration velocity increases remarkably. The appropriate temperature gradient is 5-40 K/cm. Under fixed bonding time, the thickness of diffusion layer increases with the increase of temperature gradient, and this tendency becomes more remarkable with the prolonging of bonding time.
文摘Artificial neural networks (ANN), being a sophisticated type of information processing system by imitating the neural system of human brain, can be used to investigate the effects of concentration of flux solution, temperature of liquid aluminium, temperture of tools and pressure on thickness of the intermetallic layer at the interface between steel and aluminium under solid-liquid pressure bonding of steel and aluminium perfectly. The optimum thickness has been determined according to the value of the optimum shearing strength.
基金Supported by the National Natural Science Foundation of China (No. 50075046)
文摘Solid-liquid state bonding of Si3N4 ceramics with TiN-modified Ag-Cu-Ti brazing alloy was used'- to enhance joint strength. The effects of the TiN particles on the microstructures, interfacial reactions, and room-temperature properties of the joints were investigated. The results show that the TiN particles are gen- erally well dispersed in the Ag-Cu eutectic base and the interface between them is both clean and com-pact. Changes in the TiN volume fractions from 0 to 20% exert no noticeable effect on the interfacial reac-tion between Ag-Cu-Ti and the substrates. Other bonding parameters being constant, the TiN volume frac-tion in the filler material plays a key role in the joint properties. For TiN volume fractions below 20%, the joints are reinforced, especially joints with 5% and 20% TiN. The average shearing strength of joints with 5% TiN is 200.8 MPa, 30% higher than that of joints with no TiN (154.1 MPa). However, for TiN volumes frac- tions above 20%, the joint strengths decrease.
基金Funded by the General Program of National Natural Science Foundation of China(Nos.51474189 and 51674222)the Excellent Youth Foundation of Hebei Scientific Committee,China(No.E2018203446)the Scientific Research Foundation of the Higher Education Institutions of Hebei Province,China(No.QN2015214)
文摘To explore the complex thermal-mechanical-chemical behavior in the solid-liquid cast-roll bonding(SLCRB) of Cu/Al cladding strip, numerical simulations were conducted from both macro and micro scales. In macro-scale, with birth and death element method, a thermo-mechanical coupled finite element model(FEM) was set up to explore the temperature and contact pressure distribution at the Cu/Al bonding interface in the SLCRB process. Taking these macro-scale simulation results as boundary conditions, we simulated the atom diffusion law of the bonding interface by molecular dynamics(MD) in micro-scale. The results indicate that the temperature in Cu/Al bonding interface deceases from 700 to 320 ℃ from the entrance to the exit of caster, and the peak of contact pressure reaches up to 140 MPa. The interfacial diffusion thickness depends on temperature and rolling reduction, higher temperature results in larger thickness, and the rolling reduction below kiss point leads to significant elongation deformation of cladding strip which yields more newborn interface with fresh metal and make the diffusion layer thinner. The surface roughness of Cu strip was found to be benefit to atoms diffusion in the Cu/Al bonding interface. Meanwhile, combined with the SEM-EDS observation on the microstructure and composition in the bonding interface of the experimental samples acquired from the castrolling bite, it is revealed that the rolling reduction and severe elongation deformation in the solid-solid contact zone below kiss point guarantee the satisfactory metallurgical bonding with thin and smooth diffusion layer. The bonding mechanisms of reactive diffusion, mechanical interlocking and crack bonding are proved to coexist in the SLCRB process.
