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An analytical model for nanowire junctionless SOI FinFETs with considering three-dimensional coupling effect 被引量:3
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作者 刘凡宇 刘衡竹 +1 位作者 刘必慰 郭宇峰 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第4期344-352,共9页
In this paper, the three-dimensional (3D) coupling effect is discussed for nanowire junctionless silicon-on-insulator (SOI) FinFETs. With fin width decreasing from 100 nm to 7 nm, the electric field induced by the... In this paper, the three-dimensional (3D) coupling effect is discussed for nanowire junctionless silicon-on-insulator (SOI) FinFETs. With fin width decreasing from 100 nm to 7 nm, the electric field induced by the lateral gates increases and therefore the influence of back gate on the threshold voltage weakens. For a narrow and tall fin, the lateral gates mainly control the channel and therefore the effect of back gate decreases. A simple two-dimensional (2D) potential model is proposed for the subthreshold region of junctionless SO1 FinFET. TCAD simulations validate our model. It can be used to extract the threshold voltage and doping concentration. In addition, the tuning of back gate on the threshold voltage can be predicted. 展开更多
关键词 coupling effect threshold voltage subthreshold region SOI FinFETs junctionless front gate lateral gate back gate
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侧栅晶体管太赫兹探测器的物理模型、结构制备与直流测试
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作者 康亚茹 董慧 +4 位作者 刘晶 黄镇 李兆峰 颜伟 王晓东 《红外与毫米波学报》 SCIE EI CAS CSCD 北大核心 2024年第4期526-532,共7页
针对侧栅结构高电子迁移率晶体管(High Electron Mobility Transistors,HEMTs)太赫兹探测器,构建了器件的直流输运和太赫兹探测的物理模型。运用自对准工艺,成功制备了形态良好、接触可靠的侧栅结构,有效地解决了器件双侧栅与台面间的... 针对侧栅结构高电子迁移率晶体管(High Electron Mobility Transistors,HEMTs)太赫兹探测器,构建了器件的直流输运和太赫兹探测的物理模型。运用自对准工艺,成功制备了形态良好、接触可靠的侧栅结构,有效地解决了器件双侧栅与台面间的接触问题,最终获得了不同栅宽(200 nm、800 nm和1400 nm)的侧栅GaN/AlGaN HEMT太赫兹探测器。通过直流测试表征发现,不同器件的栅宽与其阈值电压之间呈现出明显的线性关系,验证了侧栅结构HEMT太赫兹探测器的直流输运模型。上述结果为完整的侧栅HEMT太赫兹探测器的理论模型提供了实验验证和指导,为侧栅HEMT太赫兹探测器的发展提供了重要支持。 展开更多
关键词 氮化镓 太赫兹探测器 侧栅 高电子迁移率晶体管
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A novel high speed lateral IGBT with a self-driven second gate
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作者 胡浩 陈星弼 《Journal of Semiconductors》 EI CAS CSCD 2012年第3期28-31,共4页
A novel lateral IGBT with a second gate on the emitter portion is presented.A PMOS transistor,driven by the proposed device itself,is used to short the PN junction at the emitter while turned off.Low on state voltage ... A novel lateral IGBT with a second gate on the emitter portion is presented.A PMOS transistor,driven by the proposed device itself,is used to short the PN junction at the emitter while turned off.Low on state voltage and fast turn off speed are obtained without side-effects such as snapback I-V characteristics and difficulties of process complexity.Numerical simulation results show a drop of fall time from 120 to 12 ns and no increase of on state voltage. 展开更多
关键词 lateral IGBT second gate high speed
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Fast-switching SOI-LIGBT with compound dielectric buried layer and assistant-depletion trench
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作者 Chunzao Wang Baoxing Duan +1 位作者 Licheng Sun Yintang Yang 《Chinese Physics B》 SCIE EI CAS CSCD 2022年第4期647-652,共6页
A lateral insulated gate bipolar transistor(LIGBT)based on silicon-on-insulator(SOI)structure is proposed and investigated.This device features a compound dielectric buried layer(CDBL)and an assistant-depletion trench... A lateral insulated gate bipolar transistor(LIGBT)based on silicon-on-insulator(SOI)structure is proposed and investigated.This device features a compound dielectric buried layer(CDBL)and an assistant-depletion trench(ADT).The CDBL is employed to introduce two high electric field peaks that optimize the electric field distributions and that,under the same breakdown voltage(BV)condition,allow the CDBL to acquire a drift region of shorter length and a smaller number of stored carriers.Reducing their numbers helps in fast-switching.Furthermore,the ADT contributes to the rapid extraction of the stored carriers from the drift region as well as the formation of an additional heat-flow channel.The simulation results show that the BV of the proposed LIGBT is increased by 113%compared with the conventional SOI LIGBT of the same length L_(D).Contrastingly,the length of the drift region of the proposed device(11.2μm)is about one third that of a traditional device(33μm)with the same BV of 141 V.Therefore,the turn-off loss(E_(OFF))of the CDBL SOI LIGBT is decreased by 88.7%compared with a conventional SOI LIGBT when the forward voltage drop(VF)is 1.64 V.Moreover,the short-circuit failure time of the proposed device is 45%longer than that of the conventional SOI LIGBT.Therefor,the proposed CDBL SOI LIGBT exhibits a better V_(F)-E_(OFF)tradeoff and an improved short-circuit robustness. 展开更多
关键词 lateral insulated gate bipolar transistor breakdown voltage electric field modulation turn-off loss
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Snapback-free shorted anode LIGBT with controlled anode barrier and resistance
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作者 Shun Li Jin-Sha Zhang +3 位作者 Wei-Zhong Chen Yao Huang Li-Jun He Yi Huang 《Chinese Physics B》 SCIE EI CAS CSCD 2021年第2期557-562,共6页
A novel shorted anode lateral-insulated gate bipolar transistor(SA LIGBT)with snapback-free characteristic is proposed and investigated.The device features a controlled barrier V_(barrier)and resistance R_(SA)in anode... A novel shorted anode lateral-insulated gate bipolar transistor(SA LIGBT)with snapback-free characteristic is proposed and investigated.The device features a controlled barrier V_(barrier)and resistance R_(SA)in anode,named CBR LIGBT.The electron barrier is formed by the P-float/N-buffer junction,while the anode resistance includes the polysilicon layer and N-float.At forward conduction stage,the V_(barrier)and R_(SA)can be increased by adjusting the doping of the P-float and polysilicon layer,respectively,which can suppress the unipolar mode to eliminate the snapback.At turn-off stage,the low-resistance extraction path(N-buffer/P-float/polysilicon layer/N-float)can quickly extract the electrons in the N-drift,which can effectively accelerate the turn-off speed of the device.The simulation results show that at the same V_(on) of 1.3 V,the E_(off)of the CBR LIGBT is reduced by 85%,73%,and 59.6%compared with the SSA LIGBT,conventional LIGBT,and TSA LIGBT,respectively.Additionally,at the same Eoffof 1.5 m J/cm^(2),the CBR LIGBT achieves the lowest V_(on) of 1.1 V compared with the other LIGBTs. 展开更多
关键词 shorted anode lateral-insulated gate bipolar transistor SNAPBACK BARRIER trade-off
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Novel lateral insulated gate bipolar transistor on SOI substrate for optimizing hot-carrier degradation
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作者 黄婷婷 刘斯扬 +1 位作者 孙伟锋 张春伟 《Journal of Southeast University(English Edition)》 EI CAS 2014年第1期17-21,共5页
A novel lateral insulated gate bipolar transistor on a silicon-on-insulator substrate SOI-LIGBT with a special low-doped P-well structure is proposed.The P-well structure is added to attach the P-body under the channe... A novel lateral insulated gate bipolar transistor on a silicon-on-insulator substrate SOI-LIGBT with a special low-doped P-well structure is proposed.The P-well structure is added to attach the P-body under the channel so as to reduce the linear anode current degradation without additional process.The influence of the length and depth of the P-well on the hot-carrier HC reliability of the SOI-LIGBT is studied.With the increase in the length of the P-well the perpendicular electric field peak and the impact ionization peak diminish resulting in the reduction of the hot-carrier degradation. In addition the impact ionization will be weakened with the increase in the depth of the P-well which also makes the hot-carrier degradation decrease.Considering the effect of the low-doped P-well and the process windows the length and depth of the P-well are both chosen as 2 μm. 展开更多
关键词 lateral insulated gate bipolar transistor LIGBT SILICON-ON-INSULATOR SOI hot-carrier effect HCE optimi-zation
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Low Gate Voltage Operated Multi-emitter-dot H^+ Ion-Sensitive Gated Lateral Bipolar Junction Transistor
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作者 袁珩 张冀星 +4 位作者 张晨 张宁 徐丽霞 丁铭 Patrick J.C 《Chinese Physics Letters》 SCIE CAS CSCD 2015年第2期27-30,共4页
A low gate voltage operated multi-emitter-dot gated lateral bipolar junction transistor (BJT) ion sensor is proposed. The proposed device is composed of an arrayed gated lateral BJT, which is driven in the metal-oxi... A low gate voltage operated multi-emitter-dot gated lateral bipolar junction transistor (BJT) ion sensor is proposed. The proposed device is composed of an arrayed gated lateral BJT, which is driven in the metal-oxidesemiconductor field-effect transistor (MOSFET)-BJT hybrid operation mode. Further, it has multiple emitter dots linked to each other in parallel to improve ionic sensitivity. Using hydrogen ionic solutions as reference solutions, we conduct experiments in which we compare the sensitivity and threshold voltage of the multi-emitter-dot gated lateral BJT with that of the single-emitter-dot gated lateral BJT. The multi-emitter-dot gated lateral BJT not only shows increased sensitivity but, more importantly, the proposed device can be operated under very low gate voltage, whereas the conventional ion-sensitive field-effect transistors cannot. This special characteristic is significant for low power devices and for function devices in which the provision of a gate voltage is difficult. 展开更多
关键词 BJT MOSFET Ion-Sensitive gated lateral Bipolar Junction Transistor Low gate Voltage Operated Multi-emitter-dot H
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管接头的二次抽芯机构注塑模具开发 被引量:9
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作者 陈叶娣 黄敏高 严小锋 《现代塑料加工应用》 CAS 北大核心 2019年第6期48-51,共4页
为保证管接头成型质量,提高试模成功率,应用Moldflow软件进行了模具的浇口分析比较,确定采用3点轮辐式扇形浇口。为节约模具成本,提高生产效率,简化模具结构,管接头注塑模采用组合式二次抽芯机构,将斜向抽芯机构嵌入侧向抽芯机构,动模... 为保证管接头成型质量,提高试模成功率,应用Moldflow软件进行了模具的浇口分析比较,确定采用3点轮辐式扇形浇口。为节约模具成本,提高生产效率,简化模具结构,管接头注塑模采用组合式二次抽芯机构,将斜向抽芯机构嵌入侧向抽芯机构,动模板上设有小滑块限位面,实现了模具动作的安全性与可靠性。 展开更多
关键词 斜向抽芯 侧向抽芯 扇形浇口 熔接痕
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突扩跌坎掺气设施深化研究 被引量:7
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作者 周赤 李静 《长江科学院院报》 CSCD 北大核心 2015年第9期76-79,89,共5页
高速水流下的空化空蚀和高水头下的闸门止水问题是高水头泄水建筑物运行所遇到的2大问题。为深入研究突扩跌坎掺气设施,进一步了解其水力特性和空化特性,以某水利枢纽孔板泄洪洞中闸室通气系统和突扩跌坎掺气设施为具体研究对象,通过建... 高速水流下的空化空蚀和高水头下的闸门止水问题是高水头泄水建筑物运行所遇到的2大问题。为深入研究突扩跌坎掺气设施,进一步了解其水力特性和空化特性,以某水利枢纽孔板泄洪洞中闸室通气系统和突扩跌坎掺气设施为具体研究对象,通过建立比尺1∶20的局部水工模型,分析研究了通气孔风速、流态、压力、掺气浓度等水力特征参数,并将试验结果与原型观测结果进行了对比。结果表明:该工程布置的掺气效果良好,试验所得通气管内风速随闸门开度变化的趋势、水流掺气浓度、压力及其脉动在数值上与原型观测结果均一致,说明工程原型观测与模型试验对比验证是成功的。理论研究和实际运用均表明,结合闸门止水和掺气减蚀要求的突扩跌坎布置,是符合实际需求且安全可行的,同时也是解决高水头条件下闸门止水和掺气减蚀的有效措施,具有广泛的推广应用价值。 展开更多
关键词 突扩跌坎 空化空蚀 闸门止水 掺气设施 压力 掺气浓度
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新型载流子积累的逆导型横向绝缘栅双极晶体管
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作者 段宝兴 王佳森 +1 位作者 唐春萍 杨银堂 《物理学报》 SCIE EI CAS CSCD 北大核心 2024年第15期179-186,共8页
通过引入n^(+)阳极在体内集成续流二极管的逆导型横向绝缘栅双极晶体管(reverse-conducting lateral insulated gate bipolar transistor,RC-LIGBT)可以实现反向导通,并且优化器件的关断特性,是功率集成电路中一个有竞争力的器件.本文... 通过引入n^(+)阳极在体内集成续流二极管的逆导型横向绝缘栅双极晶体管(reverse-conducting lateral insulated gate bipolar transistor,RC-LIGBT)可以实现反向导通,并且优化器件的关断特性,是功率集成电路中一个有竞争力的器件.本文提出了一种新型载流子积累的RC-LIGBT,它具有电子控制栅(electron-controlled gate,EG)和分离短路阳极(separated short-anode,SSA),可以同时实现较低的导通压降和关断损耗.在正向导通状态,漂移区上方的EG结构可以在漂移区的表面积累一个高密度的电子层,从而大大地降低器件的导通压降.同时,SSA结构的使用还极大优化了器件的关断损耗.另外,低掺杂p型漂移区与SSA结构配合,可以简单地实现反向导通并且消除回吸电压.仿真结果表明,所提出的器件具有优秀的导通压降与关断损耗之间的折衷关系,其导通压降为1.16 V,比SSA LIGBT低55%,其关断损耗为0.099 mJ/cm^(2),比SSA LIGBT和常规LIGBT分别低38.5%和94.7%. 展开更多
关键词 载流子积累 逆导型横向绝缘栅双极晶体管 导通压降 回吸电压
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多晶硅栅对LDMOS-SCR器件ESD防护性能的影响 被引量:5
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作者 黄龙 梁海莲 +3 位作者 顾晓峰 董树荣 毕秀文 魏志芬 《浙江大学学报(工学版)》 EI CAS CSCD 北大核心 2015年第2期366-370,共5页
为了研究多晶硅栅对内嵌可控硅(SCR)的横向扩散金属氧化物半导体(LDMOS-SCR)器件静电放电(ESD)防护性能的影响,基于0.35μm Bipolar-CMOS-DMOS(BCD)工艺制备了LDMOS-SCR与SCR器件,并利用传输线脉冲测试比较它们的ESD特性.通过仿真2种器... 为了研究多晶硅栅对内嵌可控硅(SCR)的横向扩散金属氧化物半导体(LDMOS-SCR)器件静电放电(ESD)防护性能的影响,基于0.35μm Bipolar-CMOS-DMOS(BCD)工艺制备了LDMOS-SCR与SCR器件,并利用传输线脉冲测试比较它们的ESD特性.通过仿真2种器件在不同强度ESD应力下的电流密度分布,比较器件内部触发电流泄放路径的开启顺序;通过仿真2种器件在强电压回滞下的电流线和晶格温度的分布,分析因电场影响电流泄放的方式以及温度的分布而导致ESD鲁棒性的差异.仿真和测试结果表明,与SCR相比,具有多晶硅栅的LDMOS-SCR有多条导通路径且开启速度快,有更均匀的电流和电场分布;触发电压降低了12.5%,失效电流提高了27.0%,ESD鲁棒性强. 展开更多
关键词 静电放电 可控硅 横向扩散金属氧化物半导体 多晶硅栅 传输线脉冲测试
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功率集成器件及其兼容技术的发展 被引量:4
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作者 乔明 袁柳 《电子与封装》 2021年第4期71-86,共16页
功率集成器件在交流转直流(AC/DC)电源转换IC、高压栅驱动IC、LED驱动IC等领域均有着广泛的应用。介绍了典型的可集成功率高压器件,包括不同电压等级的横向双扩散金属氧化物半导体场效应晶体管(LDMOS)以及基于硅和SOI材料的横向绝缘栅... 功率集成器件在交流转直流(AC/DC)电源转换IC、高压栅驱动IC、LED驱动IC等领域均有着广泛的应用。介绍了典型的可集成功率高压器件,包括不同电压等级的横向双扩散金属氧化物半导体场效应晶体管(LDMOS)以及基于硅和SOI材料的横向绝缘栅双极型晶体管(LIGBT),此外还介绍了高低压器件集成的BCD工艺和其他的功率集成关键技术,包括隔离技术、高压互连技术、dV/dt技术、di/dt技术、抗闩锁技术等,最后讨论了功率集成器件及其兼容技术的发展趋势。 展开更多
关键词 功率集成器件 横向双扩散金属氧化物半导体场效应晶体管 横向绝缘栅双极型晶体管 BCD工艺 兼容技术
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Ultralow turnoff loss dual-gate SOI LIGBT with trench gate barrier and carrier stored layer 被引量:1
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作者 何逸涛 乔明 张波 《Chinese Physics B》 SCIE EI CAS CSCD 2016年第12期424-429,共6页
A novel ultralow turnoff loss dual-gate silicon-on-insulator (SOI) lateral insulated gate bipolar transistor (LIGBT) is proposed. The proposed SOI LIGBT features an extra trench gate inserted between the p-well an... A novel ultralow turnoff loss dual-gate silicon-on-insulator (SOI) lateral insulated gate bipolar transistor (LIGBT) is proposed. The proposed SOI LIGBT features an extra trench gate inserted between the p-well and n-drift, and an n-type carrier stored (CS) layer beneath the p-well. In the on-state, the extra trench gate acts as a barrier, which increases the cartier density at the cathode side of n-drift region, resulting in a decrease of the on-state voltage drop (Von). In the off-state, due to the uniform carder distribution and the assisted depletion effect induced by the extra trench gate, large number of carriers can be removed at the initial turnoff process, contributing to a low turnoff loss (Eoff). Moreover, owing to the dual-gate field plates and CS layer, the carrier density beneath the p-well can greatly increase, which further improves the tradeoff between Eoff and Von. Simulation results show that Eoff of the proposed SOI LIGBT can decrease by 77% compared with the conventional trench gate SOI LIGBT at the same Von of 1.1 V. 展开更多
关键词 lateral insulated gate bipolar transistor (LIGBT) turnoff loss trench gate barrier carrier storedlayer
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A dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor on a silicon-on-insulator substrate 被引量:1
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作者 付强 张波 +1 位作者 罗小蓉 李肇基 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第7期473-477,共5页
In this paper, a novel dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor (DGDI LTIGBT) structure, which features a double extended trench gate and a dielectric inserted in the drift ... In this paper, a novel dual-gate and dielectric-inserted lateral trench insulated gate bipolar transistor (DGDI LTIGBT) structure, which features a double extended trench gate and a dielectric inserted in the drift region, is proposed and discussed. The device can not only decrease the specific on-resistance Ron,sp , but also simultaneously improve the temperature performance. Simulation results show that the proposed LTIGBT achieves an ultra-low on-state voltage drop of 1.31 V at 700 A·cm-2 with a small half-cell pitch of 10.5 μm, a specific on-resistance R on,sp of 187 mΩ·mm2, and a high breakdown voltage of 250 V. The on-state voltage drop of the DGDI LTIGBT is 18% less than that of the DI LTIGBT and 30.3% less than that of the conventional LTIGBT. The proposed LTIGBT exhibits a good positive temperature coefficient for safety paralleling to handling larger currents and enhances the short-circuit capability while maintaining a low self-heating effect. Furthermore, it also shows a better tradeoff between the specific on-resistance and the turnoff loss, although it has a longer turnoff delay time. 展开更多
关键词 lateral trench insulated gate bipolar transistor specific on-resistance positive temperature coefficient turnoff characteristic
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Quasi-two-dimensional subthreshold current model of deep submicromter SOI drive-in gate controlled hybrid transistors with lateral non-uniform doping profile
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作者 黄如 卜伟海 +1 位作者 张兴 王阳元 《Science in China(Series F)》 2001年第1期60-67,共8页
We have analyzed the operating mechanism of the novel deep submicrometer SOI drive-in gate controlled hybrid transistor (DGCHT), which can effectively alleviate the contradiction between speed enhancement and power re... We have analyzed the operating mechanism of the novel deep submicrometer SOI drive-in gate controlled hybrid transistor (DGCHT), which can effectively alleviate the contradiction between speed enhancement and power reduction in conventional MOS devices and can improve the output resistance. On the basis of this, the subthreshold current model of DGCHTs is proposed. The model takes into account the impact of lateral non-uniform doping profile on body effect, short-channel effect and carrier mobility. Considering the mobile charge, two-dimensional Poisson equation is solved with quasi-two-dimensional analysis and parabolic approximation of surface potential. With the surface potential obtained, the subthreshold current is figured out, including both the diffusion and drift component. The calculated results are in good agreement with the MEDICI numerical simulation results, indicating the correct description of the current characteristics of SOI DGCHT by the presented model. The model can also be considered as an important reference to the current simulation of deep submicrometer MOSFET with pocket implantation. 展开更多
关键词 SOI gate controlled hybrid transmitter current model lateral non-uniform doping.
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A high voltage silicon-on-insulator lateral insulated gate bipolar transistor with a reduced cell-pitch
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作者 罗小蓉 王琦 +6 位作者 姚国亮 王元刚 雷天飞 王沛 蒋永恒 周坤 张波 《Chinese Physics B》 SCIE EI CAS CSCD 2013年第2期429-433,共5页
A high voltage(〉 600 V) integrable silicon-on-insulator(SOI) trench-type lateral insulated gate bipolar transistor(LIGBT) with a reduced cell-pitch is proposed.The LIGBT features multiple trenches(MTs):two o... A high voltage(〉 600 V) integrable silicon-on-insulator(SOI) trench-type lateral insulated gate bipolar transistor(LIGBT) with a reduced cell-pitch is proposed.The LIGBT features multiple trenches(MTs):two oxide trenches in the drift region and a trench gate extended to the buried oxide(BOX).Firstly,the oxide trenches enhance electric field strength because of the lower permittivity of oxide than that of Si.Secondly,oxide trenches bring in multi-directional depletion,leading to a reshaped electric field distribution and an enhanced reduced-surface electric-field(RESURF) effect.Both increase the breakdown voltage(BV).Thirdly,oxide trenches fold the drift region around the oxide trenches,leading to a reduced cell-pitch.Finally,the oxide trenches enhance the conductivity modulation,resulting in a high electron/hole concentration in the drift region as well as a low forward voltage drop(Von).The oxide trenches cause a low anode-cathode capacitance,which increases the switching speed and reduces the turn-off energy loss(Eoff).The MT SOI LIGBT exhibits a BV of 603 V at a small cell-pitch of 24 μm,a Von of 1.03 V at 100 A/cm-2,a turn-off time of 250 ns and Eoff of 4.1×10?3 mJ.The trench gate extended to BOX synchronously acts as dielectric isolation between high voltage LIGBT and low voltage circuits,simplifying the fabrication processes. 展开更多
关键词 SILICON-ON-INSULATOR lateral insulated gate bipolar transistor conductivity modulation breakdown voltage TRENCH
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A compact two-dimensional analytical model of the electrical characteristics of a triple-material double-gate tunneling FET structure
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作者 C.Usha P.Vimala 《Journal of Semiconductors》 EI CAS CSCD 2019年第12期135-141,共7页
This paper presents a compact two-dimensional analytical device model of surface potential,in addition to electric field of triple-material double-gate(TMDG)tunnel FET.The TMDG TFET device model is developed using a p... This paper presents a compact two-dimensional analytical device model of surface potential,in addition to electric field of triple-material double-gate(TMDG)tunnel FET.The TMDG TFET device model is developed using a parabolic approximation method in the channel depletion space and a boundary state of affairs across the drain and source.The TMDG TFET device is used to analyze the electrical performance of the TMDG structure in terms of changes in potential voltage,lateral and vertical electric field.Because the TMDG TFET has a simple compact structure,the surface potential is computationally efficient and,therefore,may be utilized to analyze and characterize the gate-controlled devices.Furthermore,using Kane's model,the current across the drain can be modeled.The graph results achieved from this device model are close to the data collected from the technology computer aided design(TCAD)simulation. 展开更多
关键词 triple-material double-gate TFET surface potential lateral and vertical electric field drain current TCAD simulation
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A snapback-free TOL-RC-LIGBT with vertical P-collector and N-buffer design
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作者 Weizhong Chen Yao Huang +2 位作者 Lijun He Zhengsheng Han Yi Huang 《Chinese Physics B》 SCIE EI CAS CSCD 2018年第8期627-632,共6页
A reverse-conducting lateral insulated-gate bipolar transistor (NI.2-LltJlS|) with a trench oxide layer (IUL), teaturlng a vertical N-buffer and P-collector is proposed. Firstly, the TOL enhances both of the surf... A reverse-conducting lateral insulated-gate bipolar transistor (NI.2-LltJlS|) with a trench oxide layer (IUL), teaturlng a vertical N-buffer and P-collector is proposed. Firstly, the TOL enhances both of the surface and bulk electric fields of the N-drift region, thus the breakdown voltage (BV) is improved. Secondly, the vertical N-buffer layer increases the voltage drop VpN of the P-collector/N-buffer junction, thus the snapback is suppressed. Thirdly, the P-body and the vertical N-buffer act as the anode and the cathode, respectively, to conduct the reverse current, thus the inner diode is integrated. As shown by the simulation results, the proposed RC-LIGBT exhibits trapezoidal electric field distribution with BV of 342.4 V, which is increased by nearly 340% compared to the conventional RC-LIGBT with triangular electric fields of 100.2 V. Moreover, the snapback is eliminated by the vertical N-buffer layer design, thus the reliability of the device is improved. 展开更多
关键词 reverse-conducting lateral insulated-gate bipolar transistor (RC-LIGBT) breakdown voltage snapback phenomenon
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新型表孔弧门侧水封结构在阿海水电站的应用 被引量:1
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作者 李福年 杨浩 薛德惠 《水电站机电技术》 2017年第6期30-31,37,共3页
钢闸门是水电工程水工建筑的重要组成部分,而水封装置又是钢闸门的重要部件,是保证闸门密封止水的直接表现。本文通过分析阿海水电站表孔弧型闸门漏水原因及侧水封结构特点后,对侧水封结构型式进行了行之有效的技改并取得较好的止水效果... 钢闸门是水电工程水工建筑的重要组成部分,而水封装置又是钢闸门的重要部件,是保证闸门密封止水的直接表现。本文通过分析阿海水电站表孔弧型闸门漏水原因及侧水封结构特点后,对侧水封结构型式进行了行之有效的技改并取得较好的止水效果,给大孔口尺寸的表孔弧门止水措施提供一定的借鉴。 展开更多
关键词 新型结构 侧水封 表孔弧门 阿海水电站
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一种部分超结型薄层SOI LIGBT器件的研究
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作者 周淼 汤亮 +2 位作者 何逸涛 陈辰 周锌 《电子与封装》 2022年第9期74-79,共6页
基于介质场增强(ENDIF)理论,提出了一种部分超结型薄硅层SOI横向绝缘栅双极型晶体管(PSJ SOI LIGBT)。分析了漂移区注入剂量和超结区域位置对器件耐压性能的影响,并在工艺流程中结合线性变掺杂技术和超结技术,使该器件实现了高垂直方向... 基于介质场增强(ENDIF)理论,提出了一种部分超结型薄硅层SOI横向绝缘栅双极型晶体管(PSJ SOI LIGBT)。分析了漂移区注入剂量和超结区域位置对器件耐压性能的影响,并在工艺流程中结合线性变掺杂技术和超结技术,使该器件实现了高垂直方向耐压和低导通电阻。测试结果表明,该器件的耐压达到816 V,比导通电阻仅为12.5Ω·mm^(2)。 展开更多
关键词 介质场增强理论 横向绝缘栅双极型晶体管 线性变掺杂技术 超结 击穿电压 比导通电阻
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