本研究借鉴重组木生产的工艺特点,探讨了以小径杂竹—雷竹(Phyllostachys praecox f. prevernalis),孝顺竹(Bambusa glaucescen)为原料,水溶性PF树脂胶为胶粘剂,在不去除竹青的条件下生产作为结构材料使用的重组竹新产品的可能性。结果...本研究借鉴重组木生产的工艺特点,探讨了以小径杂竹—雷竹(Phyllostachys praecox f. prevernalis),孝顺竹(Bambusa glaucescen)为原料,水溶性PF树脂胶为胶粘剂,在不去除竹青的条件下生产作为结构材料使用的重组竹新产品的可能性。结果如下:①小径杂竹在不去除竹青的条件下,适当的处理后,以水溶性PF树脂胶为胶粘剂完全可制得有较高物理力学性能的重组竹板材,②密度1.0～1.1g/cm^3的重组板材,其平均MOR可达120N/mm^2,MOE可达1.60×10~4N/mm^2;③重组竹板材生产的较佳热压工艺参数为:热压温度130～140℃,压力为3.43MPa左右,升温到预定值后的保温时间约每毫米板厚0.9min.展开更多
Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10...Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.展开更多
文摘本研究借鉴重组木生产的工艺特点,探讨了以小径杂竹—雷竹(Phyllostachys praecox f. prevernalis),孝顺竹(Bambusa glaucescen)为原料,水溶性PF树脂胶为胶粘剂,在不去除竹青的条件下生产作为结构材料使用的重组竹新产品的可能性。结果如下:①小径杂竹在不去除竹青的条件下,适当的处理后,以水溶性PF树脂胶为胶粘剂完全可制得有较高物理力学性能的重组竹板材,②密度1.0～1.1g/cm^3的重组板材,其平均MOR可达120N/mm^2,MOE可达1.60×10~4N/mm^2;③重组竹板材生产的较佳热压工艺参数为:热压温度130～140℃,压力为3.43MPa左右,升温到预定值后的保温时间约每毫米板厚0.9min.
基金Project (10037273) supported by the Ministry of Knowledge Economy, Korea
文摘Diffusion bonding between aluminum and copper was performed by vacuum hot pressing at temperatures between 623 and 923 K through two thermal processes： hot compression under the deformation rate of 0.2 mrrdmin for 10 rain at pre-set temperatures, and additional pressing at 0.2 mm/min for 20 rain during furnace cooling. After analyzing interface, the feasible diffusion bonding temperature was suggested as 823 K. The three major intermetallic layers generated during diffusion bonding process were identified as AIECu, AlCu＋AlaCu4 and Al4Cu9. Furthermore, local hardness values ofAlECU, AlCu＋AlaCu4 and Al4Cu9 layers average at （4.97±0.05）, （6.33±0.00） and （6.06±0.18） GPa, respectively.
