High-voltage controller area network(CAN)buses have a harsh working environment and require a robust electrostatic discharge(ESD)design window.Thus,ordinary silicon-controlled rectifier(SCR)devices do not satisfy thes...High-voltage controller area network(CAN)buses have a harsh working environment and require a robust electrostatic discharge(ESD)design window.Thus,ordinary silicon-controlled rectifier(SCR)devices do not satisfy these design requirements.To streamline the design and manufacturing of SCRs,this study proposes a novel dual-gate dual-direction SCR(DG-DDSCR)with a high failure current and holding voltage.First,four polysilicon gates,GateA1,GateA2,GateC1,and GateC2,were introduced to the N+and P+middle regions of the anode and cathode.When the voltage acts on the anode,the electric field generated by the polysilicon gate strengthens the SCR current path while promoting the release of ESD current in the substrate path.Specifically,the holding voltage of the DG-DDSCR and failure current derived from the test results of a transmission line pulse(TLP)are 29.4 V and 16.7 A,respectively.When the clamping voltage was 40 V,the transient current release of the structure can reach 11.61 A,which met the specifications of the CAN bus ESD window and was suitable for the ESD protection of the target application.展开更多
A novel dual-directional silicon controlled rectifier（DDSCR） device with embedded PNP structure（DDSCR-PNP） is proposed for electrostatic discharge（ESD） protection, which has greatly reduced latch-up risk owing t...A novel dual-directional silicon controlled rectifier（DDSCR） device with embedded PNP structure（DDSCR-PNP） is proposed for electrostatic discharge（ESD） protection, which has greatly reduced latch-up risk owing to the improved holding voltage（V_h/. Firstly, the working mechanism of the DDSCR-PNP is analyzed. The theoretical analysis indicates that the proposed device possesses good voltage clamp ability due to the embedded PNP（PNP_2）. Then, experimental devices are fabricated in a 0.35 m bipolar-CMOS-DMOS process and measured with a Barth 4002 transmission line pulse testing system. The results show that the V_h of DDSCR-PNP is much higher than that of the conventional DDSCR, and can be further increased by adjusting the P well width.However, the reduced leakage current（I_L/ of the DDSCR-PNP shows obvious fluctuations when the P well width is increased to more than 12 m. Finally, the factors influencing V_h and I_L are investigated by Sentaurus simulations. The results verify that the lateral PNP_2 helps to increase V_h and decrease I_L. When the P well width is further increased, the effect of the lateral PNP_2 is weakened, causing an increased I_L. The proposed DDSCR-PNP provides an effective and attractive ESD protection solution for high-voltage integrated circuits.展开更多
The low snapback holding voltage of the SCR-LDMOS device makes it susceptible to latch-up failure,when used in power-rail ESD（electro-static discharge） clamp circuits.In order to eliminate latch-up risk,this work pr...The low snapback holding voltage of the SCR-LDMOS device makes it susceptible to latch-up failure,when used in power-rail ESD（electro-static discharge） clamp circuits.In order to eliminate latch-up risk,this work presents a novel SCR-LDMOS structure with an N-type implantation layer to achieve a 17 V holding voltage and a 5.2 A second breakdown current.The device has been validated using TLP measurement analysis and is applied to a power-rail ESD clamp in half-bridge driver ICs.展开更多
Developing an electrostatic discharge（ESD） protection device with a better latch-up immunity has been a challenging issue for the nanometer complementary metal-oxide semiconductor（CMOS） technology. In this work, a...Developing an electrostatic discharge（ESD） protection device with a better latch-up immunity has been a challenging issue for the nanometer complementary metal-oxide semiconductor（CMOS） technology. In this work, an improved grounded-gate N-channel metal-oxide semiconductor（GGNMOS） transistor triggered silicon-controlled rectifier（SCR）structure, named GGSCR, is proposed for high holding voltage ESD protection applications. The GGSCR demonstrates a double snapback behavior as a result of progressive trigger-on of the GGNMOS and SCR. The double snapback makes the holding voltage increase from 3.43 V to 6.25 V as compared with the conventional low-voltage SCR. The TCAD simulations are carried out to verify the modes of operation of the device.展开更多
A novel NMOS triggered LIGBT(NTLIGBT) structure is proposed for electrostatic discharge(ESD) protection in this paper. The structure utilizes internal NMOS to trigger SCR-like structure in LIGBT. The trigger voltage i...A novel NMOS triggered LIGBT(NTLIGBT) structure is proposed for electrostatic discharge(ESD) protection in this paper. The structure utilizes internal NMOS to trigger SCR-like structure in LIGBT. The trigger voltage is significantly reduced because the embedded NMOS causes N+-drain/P-body junction being apt to avalanche breakdown. At the same time, the new parasitic PNP transistor including the newly added P+-region as a collector forms another path to bleed ESD current and then the conductivity modulation in the LIGBT is weakened. As a result, the holding voltage is increased. So, the proposed NTLIGBT structure has a narrow ESD design window. The simulation results show an improvement of 71.5% in trigger voltage and over 50% in holding voltage comparing with the conventional LIGBT structure.展开更多
A novel silicon controlled rectifier（SCR） with high holding voltage（Vh） for electrostatic discharge（ESD） protection is proposed and investigated in this paper. The proposed SCR obtains high Vhby adding a long N...A novel silicon controlled rectifier（SCR） with high holding voltage（Vh） for electrostatic discharge（ESD） protection is proposed and investigated in this paper. The proposed SCR obtains high Vhby adding a long N＋ layer（LN＋） and a long P＋ layer（LP＋）, which divide the conventional low voltage trigger silicon controlled rectifier（LVTSCR） into two SCRs（SCR1： P＋/Nwell/Pwell/N＋ and SCR2： P＋/LN＋/LP＋/N＋） with a shared emitter. Under the low ESD current（IESD）, the two SCRs are turned on at the same time to induce the first snapback with high V_h（V_（h1））. As the IESDincreases, the SCR2 will be turned off because of its low current gain. Therefore, the IESDwill flow through the longer SCR1 path, bypassing SCR2, which induces the second snapback with high V_h（V_（h2））. The anti-latch-up ability of the proposed SCR for ESD protection is proved by a dynamic TLP-like（Transmission Line Pulse-like） simulation. An optimized V_（h2） of 7.4 V with a maximum failure current（I_（t2）） of 14.7 m A/μm is obtained by the simulation.展开更多
This paper presents a new phenomenon,where the holding-voltage of a silicon-controlled rectifier acts as an electrostatic-discharge protection drift in diverse film thicknesses in silicon-on-insulator（SOI） technolog...This paper presents a new phenomenon,where the holding-voltage of a silicon-controlled rectifier acts as an electrostatic-discharge protection drift in diverse film thicknesses in silicon-on-insulator（SOI） technology. The phenomenon was demonstrated through fabricated chips in 0.18μm SOI technology.The drift of the holding voltage was then simulated,and its mechanism is discussed comprehensively through ISE TCAD simulations.展开更多
基金National Natural Science Foundation of China(62174052).
文摘High-voltage controller area network(CAN)buses have a harsh working environment and require a robust electrostatic discharge(ESD)design window.Thus,ordinary silicon-controlled rectifier(SCR)devices do not satisfy these design requirements.To streamline the design and manufacturing of SCRs,this study proposes a novel dual-gate dual-direction SCR(DG-DDSCR)with a high failure current and holding voltage.First,four polysilicon gates,GateA1,GateA2,GateC1,and GateC2,were introduced to the N+and P+middle regions of the anode and cathode.When the voltage acts on the anode,the electric field generated by the polysilicon gate strengthens the SCR current path while promoting the release of ESD current in the substrate path.Specifically,the holding voltage of the DG-DDSCR and failure current derived from the test results of a transmission line pulse(TLP)are 29.4 V and 16.7 A,respectively.When the clamping voltage was 40 V,the transient current release of the structure can reach 11.61 A,which met the specifications of the CAN bus ESD window and was suitable for the ESD protection of the target application.
基金supported by the Fundamental Research Funds for the Central Universities(No.JUSRP51323B)the Joint Innovation Project of Jiangsu Province(No.BY2013015-19)+2 种基金the Summit of the Six Top Talents Program of Jiangsu Province(No.DZXX-053)the Graduate Student Innovation Program for Universities of Jiangsu Province(Nos.KYLX_1119SJZZ_0148)
文摘A novel dual-directional silicon controlled rectifier（DDSCR） device with embedded PNP structure（DDSCR-PNP） is proposed for electrostatic discharge（ESD） protection, which has greatly reduced latch-up risk owing to the improved holding voltage（V_h/. Firstly, the working mechanism of the DDSCR-PNP is analyzed. The theoretical analysis indicates that the proposed device possesses good voltage clamp ability due to the embedded PNP（PNP_2）. Then, experimental devices are fabricated in a 0.35 m bipolar-CMOS-DMOS process and measured with a Barth 4002 transmission line pulse testing system. The results show that the V_h of DDSCR-PNP is much higher than that of the conventional DDSCR, and can be further increased by adjusting the P well width.However, the reduced leakage current（I_L/ of the DDSCR-PNP shows obvious fluctuations when the P well width is increased to more than 12 m. Finally, the factors influencing V_h and I_L are investigated by Sentaurus simulations. The results verify that the lateral PNP_2 helps to increase V_h and decrease I_L. When the P well width is further increased, the effect of the lateral PNP_2 is weakened, causing an increased I_L. The proposed DDSCR-PNP provides an effective and attractive ESD protection solution for high-voltage integrated circuits.
基金Project supported by the Natural Science Foundation of Jiangsu Province (No.BK2011059)the Program for New Century Excellent Talent in University (No.NCET-10-0331)
文摘The low snapback holding voltage of the SCR-LDMOS device makes it susceptible to latch-up failure,when used in power-rail ESD（electro-static discharge） clamp circuits.In order to eliminate latch-up risk,this work presents a novel SCR-LDMOS structure with an N-type implantation layer to achieve a 17 V holding voltage and a 5.2 A second breakdown current.The device has been validated using TLP measurement analysis and is applied to a power-rail ESD clamp in half-bridge driver ICs.
文摘Developing an electrostatic discharge（ESD） protection device with a better latch-up immunity has been a challenging issue for the nanometer complementary metal-oxide semiconductor（CMOS） technology. In this work, an improved grounded-gate N-channel metal-oxide semiconductor（GGNMOS） transistor triggered silicon-controlled rectifier（SCR）structure, named GGSCR, is proposed for high holding voltage ESD protection applications. The GGSCR demonstrates a double snapback behavior as a result of progressive trigger-on of the GGNMOS and SCR. The double snapback makes the holding voltage increase from 3.43 V to 6.25 V as compared with the conventional low-voltage SCR. The TCAD simulations are carried out to verify the modes of operation of the device.
基金supported by National Natural Science Foundation of China(Grant No.61274080)
文摘A novel NMOS triggered LIGBT(NTLIGBT) structure is proposed for electrostatic discharge(ESD) protection in this paper. The structure utilizes internal NMOS to trigger SCR-like structure in LIGBT. The trigger voltage is significantly reduced because the embedded NMOS causes N+-drain/P-body junction being apt to avalanche breakdown. At the same time, the new parasitic PNP transistor including the newly added P+-region as a collector forms another path to bleed ESD current and then the conductivity modulation in the LIGBT is weakened. As a result, the holding voltage is increased. So, the proposed NTLIGBT structure has a narrow ESD design window. The simulation results show an improvement of 71.5% in trigger voltage and over 50% in holding voltage comparing with the conventional LIGBT structure.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61376080 and 61674027)the Natural Science Foundation of Guangdong Province,China(Grant Nos.2014A030313736 and 2016A030311022)
文摘A novel silicon controlled rectifier（SCR） with high holding voltage（Vh） for electrostatic discharge（ESD） protection is proposed and investigated in this paper. The proposed SCR obtains high Vhby adding a long N＋ layer（LN＋） and a long P＋ layer（LP＋）, which divide the conventional low voltage trigger silicon controlled rectifier（LVTSCR） into two SCRs（SCR1： P＋/Nwell/Pwell/N＋ and SCR2： P＋/LN＋/LP＋/N＋） with a shared emitter. Under the low ESD current（IESD）, the two SCRs are turned on at the same time to induce the first snapback with high V_h（V_（h1））. As the IESDincreases, the SCR2 will be turned off because of its low current gain. Therefore, the IESDwill flow through the longer SCR1 path, bypassing SCR2, which induces the second snapback with high V_h（V_（h2））. The anti-latch-up ability of the proposed SCR for ESD protection is proved by a dynamic TLP-like（Transmission Line Pulse-like） simulation. An optimized V_（h2） of 7.4 V with a maximum failure current（I_（t2）） of 14.7 m A/μm is obtained by the simulation.
基金Project supported by the National Natural Science Foundation of China(No.60927006)
文摘This paper presents a new phenomenon,where the holding-voltage of a silicon-controlled rectifier acts as an electrostatic-discharge protection drift in diverse film thicknesses in silicon-on-insulator（SOI） technology. The phenomenon was demonstrated through fabricated chips in 0.18μm SOI technology.The drift of the holding voltage was then simulated,and its mechanism is discussed comprehensively through ISE TCAD simulations.
