高温可靠性测试如高温栅偏(High Temperature Gate Bias,HTGB)、高温反偏(High Temperature Reverse Bias,HTRB)、高温高湿反偏(High Humidity High Temperature Reverse Bias,H3TRB)是器件出厂和寿命评估必备的测试。然而,不同标准的...高温可靠性测试如高温栅偏(High Temperature Gate Bias,HTGB)、高温反偏(High Temperature Reverse Bias,HTRB)、高温高湿反偏(High Humidity High Temperature Reverse Bias,H3TRB)是器件出厂和寿命评估必备的测试。然而,不同标准的测试条件不尽相同,其对应的内在机理也不明确。为讨论测试条件的确定原则,首先从单个和耦合的温度、电场、湿度加速老化模型出发,论述了相关测试标准所用模型,分析了其应用范围和使用原则。进一步地,总结了现有各类标准下的测试条件,计算了电动汽车模块正常运行30年所需HTGB、HTRB、H3TRB加速老化时间分别为832 h、866 h、1038 h,测试的样本数均为70,并指出测试时间、样本数需根据实际工况决定。最后,基于以上分析,提出了一种加速老化时间、样本数可调的高温可靠性测试流程。展开更多
The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal ...The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.展开更多
文摘高温可靠性测试如高温栅偏(High Temperature Gate Bias,HTGB)、高温反偏(High Temperature Reverse Bias,HTRB)、高温高湿反偏(High Humidity High Temperature Reverse Bias,H3TRB)是器件出厂和寿命评估必备的测试。然而,不同标准的测试条件不尽相同,其对应的内在机理也不明确。为讨论测试条件的确定原则,首先从单个和耦合的温度、电场、湿度加速老化模型出发,论述了相关测试标准所用模型,分析了其应用范围和使用原则。进一步地,总结了现有各类标准下的测试条件,计算了电动汽车模块正常运行30年所需HTGB、HTRB、H3TRB加速老化时间分别为832 h、866 h、1038 h,测试的样本数均为70,并指出测试时间、样本数需根据实际工况决定。最后,基于以上分析,提出了一种加速老化时间、样本数可调的高温可靠性测试流程。
基金partly supported by the Japan Society for the Promotion of Science (JSPS) Grant-in-Aid for Scientific Research (Grant No. 19121587)supported by the Natural Science Foundation of Shaanxi Province (No.2021KW-25)。
文摘The excellent properties of SiC bring new challenges for the device packaging.In this study,the bonding strength,fracture behaviors and microstructural evolution of micron-porous Ag joint were elevated during thermal cycling(–50 ℃–250 ℃) in SiC/DBC(direct bonding copper) die attachment structure for different time.During harsh thermal shock test,the strength of sintered joint deceased gradually with the increase of cycling number,and the value just was half of the value of as-sintered after 1 000 cycles.Coarsening of Ag grains was observed in micron-porous joint with the structure inhomogeneity and defects increasing,which were the reasons of the strength decease.In addition,it was also found that the fracture behavior of sintered joints was changed from ductile deformation of Ag grain to brittle fracture of crack propagation after 1 000 cycles.This study will add the understanding in the mechanical properties of Ag sinter joining and its applications at high temperature.
