以200 m Pa·s和500 m Pa·s的端乙烯基硅油为基体硅油、活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径球形氧化铝以不同比例复配的导热填料制得低渗油高填充导热硅凝胶。研究了不同粒径球形氧化铝与基体硅油黏度对基胶黏...以200 m Pa·s和500 m Pa·s的端乙烯基硅油为基体硅油、活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径球形氧化铝以不同比例复配的导热填料制得低渗油高填充导热硅凝胶。研究了不同粒径球形氧化铝与基体硅油黏度对基胶黏度及氧化铝最大填充量的影响,探究了γ-巯丙基三甲氧基硅烷(KH590)对硅凝胶导热性能的影响,基体硅油黏度、活性氢与硅乙烯基物质的量之比及氧化铝填充量对硅凝胶硬度、密度、热导率及力学强度的影响。重点研究了氧化铝复配种类与比例对硅凝胶抗渗油性能及热稳定性的影响机制。结果表明,以不同黏度的端乙烯基硅油为基体硅油,活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径的球形氧化铝复配导热填料可制得低渗油高填充导热硅凝胶;在采用单一粒径球形氧化铝时,同一填充量下,20μm球形氧化铝对基胶的增黏不明显且最大填充量较高,可达1 500份;适当增加硅烷偶联剂KH590用量能有效提高硅凝胶的导热性能,较佳用量为2.00%;采用200 m Pa·s的端乙烯基硅油为基体硅油,活性氢与硅乙烯基物质的量之比为0.8∶1,单独采用600份20μm球形氧化铝作导热填料时,硅凝胶具有较佳的硬度、密度、热导率及拉伸强度,邵氏OO硬度为67,密度为1.83 g/cm^(3),热导率为3.69 W/(m·K),拉伸强度为1.95 MPa;采用不同粒径球形氧化铝复配时,导热硅凝胶的热导率均高于采用单一粒径球形氧化铝填充的硅凝胶,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶导热性能较佳,热导率为4.72 W/(m·K);由于球形氧化铝表面硅烷化后与基体硅油的缠绕及填料表面巯基与一定量残留双键的氢键效应,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶具有较佳的抗渗油性能及热稳定性,渗油比仅为1.0476,硅凝胶质量损失率5%时的温度为331℃,700℃时残余�展开更多
The welding mechanism of laser-TIG hybrid welding process is analyzed. Withthe variation of arc current, the welding process is divided into two patterns: deep-penetrationwelding and heat conductive welding. The heat ...The welding mechanism of laser-TIG hybrid welding process is analyzed. Withthe variation of arc current, the welding process is divided into two patterns: deep-penetrationwelding and heat conductive welding. The heat flow model of hybrid welding is presented. As todeep-penetration welding, the heat source includes a surface heat flux and a volume heat flux. Theheat source of heat conductive welding is composed of two Gaussian distribute surface heat sources.With this heat source model, a temperature field is calculated. The finite element code MARC isemployed for this purpose. The calculation results show a good agreement with the experimental data.展开更多
文摘以200 m Pa·s和500 m Pa·s的端乙烯基硅油为基体硅油、活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径球形氧化铝以不同比例复配的导热填料制得低渗油高填充导热硅凝胶。研究了不同粒径球形氧化铝与基体硅油黏度对基胶黏度及氧化铝最大填充量的影响,探究了γ-巯丙基三甲氧基硅烷(KH590)对硅凝胶导热性能的影响,基体硅油黏度、活性氢与硅乙烯基物质的量之比及氧化铝填充量对硅凝胶硬度、密度、热导率及力学强度的影响。重点研究了氧化铝复配种类与比例对硅凝胶抗渗油性能及热稳定性的影响机制。结果表明,以不同黏度的端乙烯基硅油为基体硅油,活性氢质量分数0.05%含氢硅油为交联剂,添加不同粒径的球形氧化铝复配导热填料可制得低渗油高填充导热硅凝胶;在采用单一粒径球形氧化铝时,同一填充量下,20μm球形氧化铝对基胶的增黏不明显且最大填充量较高,可达1 500份;适当增加硅烷偶联剂KH590用量能有效提高硅凝胶的导热性能,较佳用量为2.00%;采用200 m Pa·s的端乙烯基硅油为基体硅油,活性氢与硅乙烯基物质的量之比为0.8∶1,单独采用600份20μm球形氧化铝作导热填料时,硅凝胶具有较佳的硬度、密度、热导率及拉伸强度,邵氏OO硬度为67,密度为1.83 g/cm^(3),热导率为3.69 W/(m·K),拉伸强度为1.95 MPa;采用不同粒径球形氧化铝复配时,导热硅凝胶的热导率均高于采用单一粒径球形氧化铝填充的硅凝胶,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶导热性能较佳,热导率为4.72 W/(m·K);由于球形氧化铝表面硅烷化后与基体硅油的缠绕及填料表面巯基与一定量残留双键的氢键效应,导热填料采用20μm与5μm球形氧化铝按质量比2∶1复配时硅凝胶具有较佳的抗渗油性能及热稳定性,渗油比仅为1.0476,硅凝胶质量损失率5%时的温度为331℃,700℃时残余�
文摘The welding mechanism of laser-TIG hybrid welding process is analyzed. Withthe variation of arc current, the welding process is divided into two patterns: deep-penetrationwelding and heat conductive welding. The heat flow model of hybrid welding is presented. As todeep-penetration welding, the heat source includes a surface heat flux and a volume heat flux. Theheat source of heat conductive welding is composed of two Gaussian distribute surface heat sources.With this heat source model, a temperature field is calculated. The finite element code MARC isemployed for this purpose. The calculation results show a good agreement with the experimental data.
