The steep sub-threshold swing of a tunneling field-effect transistor(TFET)makes it one of the best candidates for lowpower nanometer devices.However,the low driving capability of TFETs prevents their application in in...The steep sub-threshold swing of a tunneling field-effect transistor(TFET)makes it one of the best candidates for lowpower nanometer devices.However,the low driving capability of TFETs prevents their application in integrated circuits.In this study,an innovative gate-all-around(GAA)TFET,which represents a negative capacitance GAA gate-to-source overlap TFET(NCGAA-SOL-TFET),is proposed to increase the driving current.The proposed NCGAA-SOL-TFET is developed based on technology computer-aided design(TCAD)simulations.The proposed structure can solve the problem of the insufficient driving capability of conventional TFETs and is suitable for sub-3-nm nodes.In addition,due to the negative capacitance effect,the surface potential of the channel can be amplified,thus enhancing the driving current.The gateto-source overlap(SOL)technique is used for the first time in an NCGAA-TFET to increase the band-to-band tunneling rate and tunneling area at the silicon-germanium heterojunction.By optimizing the design of the proposed structure via adjusting the SOL length and the ferroelectric layer thickness,a sufficiently large on-state current of 17.20μA can be achieved and the threshold voltage can be reduced to 0.31 V with a sub-threshold swing of 44.98 mV/decade.Finally,the proposed NCGAA-SOL-TFET can overcome the Boltzmann limit-related problem,achieving a driving current that is comparable to that of the traditional complementary metal-oxide semiconductor devices.展开更多
Metal–oxide–semiconductor field-effect transistor(MOSFET)faces the major problem of being unable to achieve a subthreshold swing(SS)below 60 mV/dec.As device dimensions continue to reduce and the demand for high swi...Metal–oxide–semiconductor field-effect transistor(MOSFET)faces the major problem of being unable to achieve a subthreshold swing(SS)below 60 mV/dec.As device dimensions continue to reduce and the demand for high switching ratios for low power consumption increases,the tunnel field-effect transistor(TFET)appears to be a viable device,displaying promising characteristic as an answer to the shortcomings of the traditional MOSFET.So far,TFET designing has been a task of sacrificing higher ON state current for low subthreshold swing(and vice versa),and a device that displays both while maintaining structural integrity and operational stability lies in the nascent stages of popular research.This work presents a comprehensive analysis of a heterojunction plasma doped gate-all-around TFET(HPD-GAA-TFET)by making a comparison between Mg_(2)Si and Si which serve as source materials.Charge plasma technique is employed to implement doping in an intrinsic silicon wafer with the help of suitable electrodes.A low-energy bandgap material,i.e.magnesium silicide is incorporated as source material to form a heterojunction between source and silicon-based channel.A rigorous comparison of performance between Si-based GAA-TFET and HPD-GAA-TFET is conducted in terms of electrical,radio frequency(RF),linearity,and distortion parameters.It is observable that HPD-GAA-TFET outperforms conventional Si-based GAA-TFET with an ON-state current(I_(ON)),subthreshold swing(SS),threshold voltage(V_(th)),and current switching ratio being 0.377 mA,12.660 mV/dec,0.214 V,and 2.985×10^(12),respectively.Moreover,HPD-GAA-TFET holds faster switching and is more reliable than Si-based device.Therefore,HPD-GAA-TFET is suitable for low-power applications.展开更多
In this work, a double-gate-all-around tunneling field-effect transistor is proposed. The performance of the novel device is studied by numerical simulation. The results show that with a thinner body and an additional...In this work, a double-gate-all-around tunneling field-effect transistor is proposed. The performance of the novel device is studied by numerical simulation. The results show that with a thinner body and an additional core gate, the novel device achieves a steeper subthreshold slope, less susceptibility to the short channel effect, higher on-state current, and larger on/off current ratio than the traditional gate-all-around tunneling field-effect transistor. The excellent performance makes the proposed structure more attractive to further dimension scaling.展开更多
基金supported by the Zhejiang Provincial Natural Science Foundation of China(Grant No.LY22F040001)the National Natural Science Foundation of China(Grant No.62071160)the Graduate Scientific Research Foundation of Hangzhou Dianzi University。
文摘The steep sub-threshold swing of a tunneling field-effect transistor(TFET)makes it one of the best candidates for lowpower nanometer devices.However,the low driving capability of TFETs prevents their application in integrated circuits.In this study,an innovative gate-all-around(GAA)TFET,which represents a negative capacitance GAA gate-to-source overlap TFET(NCGAA-SOL-TFET),is proposed to increase the driving current.The proposed NCGAA-SOL-TFET is developed based on technology computer-aided design(TCAD)simulations.The proposed structure can solve the problem of the insufficient driving capability of conventional TFETs and is suitable for sub-3-nm nodes.In addition,due to the negative capacitance effect,the surface potential of the channel can be amplified,thus enhancing the driving current.The gateto-source overlap(SOL)technique is used for the first time in an NCGAA-TFET to increase the band-to-band tunneling rate and tunneling area at the silicon-germanium heterojunction.By optimizing the design of the proposed structure via adjusting the SOL length and the ferroelectric layer thickness,a sufficiently large on-state current of 17.20μA can be achieved and the threshold voltage can be reduced to 0.31 V with a sub-threshold swing of 44.98 mV/decade.Finally,the proposed NCGAA-SOL-TFET can overcome the Boltzmann limit-related problem,achieving a driving current that is comparable to that of the traditional complementary metal-oxide semiconductor devices.
文摘Metal–oxide–semiconductor field-effect transistor(MOSFET)faces the major problem of being unable to achieve a subthreshold swing(SS)below 60 mV/dec.As device dimensions continue to reduce and the demand for high switching ratios for low power consumption increases,the tunnel field-effect transistor(TFET)appears to be a viable device,displaying promising characteristic as an answer to the shortcomings of the traditional MOSFET.So far,TFET designing has been a task of sacrificing higher ON state current for low subthreshold swing(and vice versa),and a device that displays both while maintaining structural integrity and operational stability lies in the nascent stages of popular research.This work presents a comprehensive analysis of a heterojunction plasma doped gate-all-around TFET(HPD-GAA-TFET)by making a comparison between Mg_(2)Si and Si which serve as source materials.Charge plasma technique is employed to implement doping in an intrinsic silicon wafer with the help of suitable electrodes.A low-energy bandgap material,i.e.magnesium silicide is incorporated as source material to form a heterojunction between source and silicon-based channel.A rigorous comparison of performance between Si-based GAA-TFET and HPD-GAA-TFET is conducted in terms of electrical,radio frequency(RF),linearity,and distortion parameters.It is observable that HPD-GAA-TFET outperforms conventional Si-based GAA-TFET with an ON-state current(I_(ON)),subthreshold swing(SS),threshold voltage(V_(th)),and current switching ratio being 0.377 mA,12.660 mV/dec,0.214 V,and 2.985×10^(12),respectively.Moreover,HPD-GAA-TFET holds faster switching and is more reliable than Si-based device.Therefore,HPD-GAA-TFET is suitable for low-power applications.
基金Project supported by the National Natural Science Foundation of China(Grant Nos.61176038 and 61474093)the Science and Technology Planning Project of Guangdong Province,China(Grant No.2015A010103002)the Technology Development Program of Shanxi Province,China(Grant No.2016GY075)
文摘In this work, a double-gate-all-around tunneling field-effect transistor is proposed. The performance of the novel device is studied by numerical simulation. The results show that with a thinner body and an additional core gate, the novel device achieves a steeper subthreshold slope, less susceptibility to the short channel effect, higher on-state current, and larger on/off current ratio than the traditional gate-all-around tunneling field-effect transistor. The excellent performance makes the proposed structure more attractive to further dimension scaling.
