A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan....A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan.A special optional gate bias technique is introduced to allow an adjustable gain control range of 10 dB.A novel cascode structure is adopted to extend the output voltage and bandwidth.The measurement results show that the amplifier gives an average gain of 15 dB with a gain flatness of±1 dB in the 2-20 GHz band.The noise figure is between 2 and 4.1 dB during the band from 2 to 20 GHz.The amplifier also provides 13.8 dBm of output power at a 1 dB gain compression point and 10.5 dBm of input third order intercept point（IIP3）,which demonstrates the excellent performance of linearity.The power consumption is 300 mW with a supply of 5 V,and the chip area is 2.36×1.01 mm^2.展开更多
This work details the development of a broad-spectrum LNA (Low Noise Amplifier) circuit using a 65 nm CMOS technology. The design incorporates an inductive degeneracy circuit, employing a theoretical approach to enhan...This work details the development of a broad-spectrum LNA (Low Noise Amplifier) circuit using a 65 nm CMOS technology. The design incorporates an inductive degeneracy circuit, employing a theoretical approach to enhance gain, minimize noise levels, and uphold low power consumption. The progression includes a shift to a cascode structure to further refine LNA parameters. Ultimately, with a 1.8 V bias, the achieved performance showcases a gain-to-noise figure ratio of 16 dB/0.5 dB, an IIP3 linearity at 5.1 dBm, and a power consumption of 3 mW. This architecture is adept at operating across a wide frequency band spanning from 0.5 GHz to 6 GHz, rendering it applicable in diverse RF scenarios.展开更多
基金Project supported by the National Natural Science Foundation of China(No.61106021)the Chinese Postdoctoral Science Foundation(Nos. 20090461049.20090461048)the Innovation Fund of Ministry of Science & Technology for Small and Medium Sized Enterprises, China(No.11C26213211234)
文摘A low noise distributed amplifier consisting of 9 gain cells is presented.The chip is fabricated with 0.15-μm GaAs pseudomorphic high electron mobility transistor（PHEMT） technology from Win Semiconductor of Taiwan.A special optional gate bias technique is introduced to allow an adjustable gain control range of 10 dB.A novel cascode structure is adopted to extend the output voltage and bandwidth.The measurement results show that the amplifier gives an average gain of 15 dB with a gain flatness of±1 dB in the 2-20 GHz band.The noise figure is between 2 and 4.1 dB during the band from 2 to 20 GHz.The amplifier also provides 13.8 dBm of output power at a 1 dB gain compression point and 10.5 dBm of input third order intercept point（IIP3）,which demonstrates the excellent performance of linearity.The power consumption is 300 mW with a supply of 5 V,and the chip area is 2.36×1.01 mm^2.
文摘This work details the development of a broad-spectrum LNA (Low Noise Amplifier) circuit using a 65 nm CMOS technology. The design incorporates an inductive degeneracy circuit, employing a theoretical approach to enhance gain, minimize noise levels, and uphold low power consumption. The progression includes a shift to a cascode structure to further refine LNA parameters. Ultimately, with a 1.8 V bias, the achieved performance showcases a gain-to-noise figure ratio of 16 dB/0.5 dB, an IIP3 linearity at 5.1 dBm, and a power consumption of 3 mW. This architecture is adept at operating across a wide frequency band spanning from 0.5 GHz to 6 GHz, rendering it applicable in diverse RF scenarios.
