Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here ...Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption.展开更多
Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in...Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in fracture strength, elongation at break and hydrophilicity between rol- led and electrodeposited copper foils. The rolled copper foils have higher tensile strength, lower ductility and larger static contact angle than electrodeposited copper foils. The rolled copper foils contain a [^-fiber texture, and the electrodeposited copper foils have random crystalline orientations. It was also observed that the rolled foils have packed grains, and elec- trodeposited foils have equiaxial grains. The uniform fine grain size and a few substructures of Japanese electrode- posited foils are major reasons for their higher elongation.展开更多
基金the National Key R&D Program of China(No.2017YFB1200800)the National Natural Science Foundation of China(Nos.51827810 and 51637009)the Fundamental Research Funds for the Central Universities(2018XZZX001-05)。
文摘Smooth and strong copper foils are highly required for the development of printed circuit boards and Li-ion batteries.Adding additives is an efficient and low-cost method to enhance electrodeposited copper foils.Here we chose Bis-(3-sulfopropyl)-disulfide(SPS)as the additive and investigated its concentration on the surface roughness and tensile strength of the electrodeposited copper foils.A copper foil with the smoothest surface(Rz=2.1μm)and the highest tensile strength(~338 MPa)was prepared with1.5 mg/L SPS.The contact angle on the copper foil decreased with the reduction of surface roughness.The enhancing mechanism of the SPS was investigated by scanning electron microscopy and X-ray diffraction.The refined grain and enhanced(220)texture were considered to be the radical reason for the smooth and strong copper foils.The electrochemical results prove the suppressing effect is related to the SPS adsorption.
基金financially supported by the National Natural Science Foundation of China (No. 51344008)
文摘Commercial grade rolled and electrodeposited copper foils from Japan and China were selected, and their mechanical properties and microstructure were investigated. It was observed that there are notable differences in fracture strength, elongation at break and hydrophilicity between rol- led and electrodeposited copper foils. The rolled copper foils have higher tensile strength, lower ductility and larger static contact angle than electrodeposited copper foils. The rolled copper foils contain a [^-fiber texture, and the electrodeposited copper foils have random crystalline orientations. It was also observed that the rolled foils have packed grains, and elec- trodeposited foils have equiaxial grains. The uniform fine grain size and a few substructures of Japanese electrode- posited foils are major reasons for their higher elongation.
