A copper chemical mechanical polishing （Cu CMP） process is reviewed and analyzed from the view of chemical physics. Three steps Cu CMP process modeling is set up based on the actual process of manufacturing and patt...A copper chemical mechanical polishing （Cu CMP） process is reviewed and analyzed from the view of chemical physics. Three steps Cu CMP process modeling is set up based on the actual process of manufacturing and pattern-density-step-height （PDSH） modeling from MIT. To catch the pattern dependency, a 65 nm testing chip is designed and processed in the foundry. Following the model parameter extraction procedure, the model parameters are extracted and verified by testing data from the 65 nm testing chip. A comparison of results between the model predictions and test data show that the former has the same trend as the latter and the largest deviation is less than 5 nm. Third party testing data gives further evidence to support the great performance of model parameter optimization. Since precise CMP process modeling is used for the design of manufacturability （DFM） checks, critical hotspots are displayed and eliminated, which will assure good yield and production capacity of IC.展开更多
The laser chemical machining is a non-conventional substractive processing method. It is based on the laser-activation of a material dissolution of metals in electrolyte ambient via local-induced temperature gradients...The laser chemical machining is a non-conventional substractive processing method. It is based on the laser-activation of a material dissolution of metals in electrolyte ambient via local-induced temperature gradients and allows a gentle and smooth processing of especially temperature-sensitive metals. However, the material removal is characterized by a narrow process window and is restricted by occurring disturbances, which are supposed to be related to the localized electrolyte boiling. In order to control the removal quality and avoid disturbances, the correlation between the laser-induced temperatures and the resulting removal geometry has to be better understood. In this work an analytical modeling of the laser-induced temperatures at the surface of titanium based on a Green-function approach is presented. The main influencing factors (laser, electrolyte, material) as well as possible heat transfer into the electrolyte are included and discussed. To verify the calculated temperatures, single spot experiments are performed and characterized for titanium in phosphoric acid solution within laser irradiation of 1 s. The correlation between the temperature distribution and the resulting removal geometry is investigated based on a spatial superposition. Thereby, the bottom limit temperature is found to range between 63°C and 70°C whereas the upper limit is related to the nucleate boiling regime. Based on the performed correlation an indicator is identified to predict the ruling removal regime and thereby to reduce the experimental expenditure.展开更多
文摘为优化化工企业生产计划,本文建立了化工过程生产计划优化的混合整数非线性规划(mixed integer nonlinear program- ming)模型,并给出相应的迭代求解算法,实际应用表明该算法可以有效的求解模型。应用该MINLP模型和求解算法,在石化企业生产计划图形建模优化系统(graphic I/O petrochemical industry modeling system,GIOPIMS)已经成功开发和实施的基础上,针对化工企业的特点,重新开发出适合化工企业使用的生产计划图形建模优化系统(graphic I/O chemical industry modeling system,GIOCIMS)。GIOCIMS的实施表明,该系统在化工企业中间产品外购或自产,中间产品外销或深加工,工艺路线选择和装置负荷等优化方面发挥了重要作用,获得显著的经济效益?。
基金Project supported by the National Major Science and Technology Special Project of China During the 11th Five-Year Plan Period(No. 2009ZX02023-4-2)
文摘A copper chemical mechanical polishing （Cu CMP） process is reviewed and analyzed from the view of chemical physics. Three steps Cu CMP process modeling is set up based on the actual process of manufacturing and pattern-density-step-height （PDSH） modeling from MIT. To catch the pattern dependency, a 65 nm testing chip is designed and processed in the foundry. Following the model parameter extraction procedure, the model parameters are extracted and verified by testing data from the 65 nm testing chip. A comparison of results between the model predictions and test data show that the former has the same trend as the latter and the largest deviation is less than 5 nm. Third party testing data gives further evidence to support the great performance of model parameter optimization. Since precise CMP process modeling is used for the design of manufacturability （DFM） checks, critical hotspots are displayed and eliminated, which will assure good yield and production capacity of IC.
文摘The laser chemical machining is a non-conventional substractive processing method. It is based on the laser-activation of a material dissolution of metals in electrolyte ambient via local-induced temperature gradients and allows a gentle and smooth processing of especially temperature-sensitive metals. However, the material removal is characterized by a narrow process window and is restricted by occurring disturbances, which are supposed to be related to the localized electrolyte boiling. In order to control the removal quality and avoid disturbances, the correlation between the laser-induced temperatures and the resulting removal geometry has to be better understood. In this work an analytical modeling of the laser-induced temperatures at the surface of titanium based on a Green-function approach is presented. The main influencing factors (laser, electrolyte, material) as well as possible heat transfer into the electrolyte are included and discussed. To verify the calculated temperatures, single spot experiments are performed and characterized for titanium in phosphoric acid solution within laser irradiation of 1 s. The correlation between the temperature distribution and the resulting removal geometry is investigated based on a spatial superposition. Thereby, the bottom limit temperature is found to range between 63°C and 70°C whereas the upper limit is related to the nucleate boiling regime. Based on the performed correlation an indicator is identified to predict the ruling removal regime and thereby to reduce the experimental expenditure.
