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High densities of magnetic nanoparticles supported on graphene fabricated by atomic layer deposition and their use as efficient synergistic microwave absorbers 被引量:36
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作者 Guizhen wang Zhe Gao +3 位作者 Gengping Wan Shiwei Lin Peng Yang Yong Qin 《Nano Research》 SCIE EI CAS CSCD 2014年第5期704-716,共13页
An atomic layer deposition (ALD) method has been employed to synthesize Fe3O4/graphene and Ni/graphene composites. The structure and microwave absorbing properties of the as-prepared composites are investigated. The... An atomic layer deposition (ALD) method has been employed to synthesize Fe3O4/graphene and Ni/graphene composites. The structure and microwave absorbing properties of the as-prepared composites are investigated. The surfaces of graphene are densely covered by Fe3O4 or Ni nanoparticles with a narrow size distribution, and the magnetic nanoparticles are well distributed on each graphene sheet without significant conglomeration or large vacancies. The coated graphene materials exhibit remarkably improved electromagnetic (EM) absorption properties compared to the pristine graphene. The optimal reflection loss (RL) reaches -46.4 dB at 15.6 GHz with a thickness of only 1.4 mm for the Fe3O4/graphene composites obtained by applying 100 cycles of Fe2O3 deposition followed by a hydrogen reduction. The enhanced absorption ability arises from the effective impedance matching, multiple interfacial polarization and increased magnetic loss from the added magnetic constituents. Moreover, compared with other recently reported materials, the composites have a lower filling ratio and smaller coating thickness resulting in significantly increased EM absorption properties. This demonstrates that nanoscale surface modification of magnetic particles on graphene by ALD is a very promising way to design lightweight and high-efficiency microwave absorbers. 展开更多
关键词 atomic layer depositionald GRAPHENE magnetic nanoparticles microwave absorption
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Coaxial multi-interface hollow Ni-AI203-ZnO nanowires tailored by atomic layer deposition for selective- frequency absorptions 被引量:13
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作者 Lili Yan Jia Liu +6 位作者 Shichao Zhao Bin Zhang Zhe Gao Huibin Ge Yao Chen Maosheng Cao Yong Qin 《Nano Research》 SCIE EI CAS CSCD 2017年第5期1595-1607,共13页
In this work, atomic layer deposition (ALD) was employed to fabricate coaxial multi-interface hollow Ni-A12OB-ZnO nanowires. The morpholog34 microstructure, and ZnO shell thickness dependent electromagnetic and micr... In this work, atomic layer deposition (ALD) was employed to fabricate coaxial multi-interface hollow Ni-A12OB-ZnO nanowires. The morpholog34 microstructure, and ZnO shell thickness dependent electromagnetic and microwave absorbing properties of these Ni-A12OB-ZnO nanowires were characterized. Excellent microwave absorbing properties with a minimum reflection loss (RL) of approximately -50 dB at 9.44 GHz were found for the Ni-A12OB-100ZnO nanowires, which was 10 times of Ni-A1203 nanowires. The microwave absorption frequency could be effectively varied by simply adjusting the number of ZnO deposition cycles. The absorption peaks of Ni-A1203-100ZnO and Ni-A12OB-150ZnO nanowires shifted of 5.5 and 6.8 GHz towards lower frequencies, respectively, occupying one third of the investigated frequency band. The enhanced microwave absorption arose from multiple loss mechanisms caused by the unique coaxial multi-interface structure, such as multi-interfacial polarization relaxation, natural and exchange resonances, as well as multiple internal reflections and scattering. These results demonstrate that the ALD method can be used to realize tailored nanoscale structures, making it a highly promising method for obtaining high- efficiency microwave absorbers, and opening a potentially novel route for frecluencv adiustment and microwave ima^in~ fields. 展开更多
关键词 atomic layer depositionald Ni-A1203-ZnO nanowires selective frequencyabsorption
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原子层沉积技术的应用现状及发展前景 被引量:11
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作者 廖荣 康唐飞 +2 位作者 邓世杰 吴海洋 王敬云 《传感器与微系统》 CSCD 北大核心 2021年第10期5-9,共5页
介绍了原子层沉积(ALD)技术的应用现状及发展前景,包括ALD原理、ALD技术的主要优势、ALD在各方面的应用,如半导体及纳米电子学应用、光电材料及器件、微机电系统(MEMS)、纳米结构及其它应用。ALD工艺所需温度比其他化学气相沉积方法远... 介绍了原子层沉积(ALD)技术的应用现状及发展前景,包括ALD原理、ALD技术的主要优势、ALD在各方面的应用,如半导体及纳米电子学应用、光电材料及器件、微机电系统(MEMS)、纳米结构及其它应用。ALD工艺所需温度比其他化学气相沉积方法远远降低,温度约为300℃。ALD对薄膜的均匀性有更好的控制,由于原子层技术的独特性,使其在半导体等行业的发展前景十分可观。 展开更多
关键词 原子层沉积 纳米结构 半导体 介电层 芯片
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等离子体增强原子层沉积原理与应用 被引量:7
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作者 曹燕强 李爱东 《微纳电子技术》 CAS 北大核心 2012年第7期483-490,共8页
等离子体增强原子层沉积(PEALD)是一种低温制备高质量超薄薄膜的有效手段,近年来正受到工业界和学术界广泛的关注。简要介绍了PEALD的发展历史和生长原理。描述了PEALD常见的三种设备构造:自由基增强原子层沉积、直接等离子体沉积和远... 等离子体增强原子层沉积(PEALD)是一种低温制备高质量超薄薄膜的有效手段,近年来正受到工业界和学术界广泛的关注。简要介绍了PEALD的发展历史和生长原理。描述了PEALD常见的三种设备构造:自由基增强原子层沉积、直接等离子体沉积和远程等离子体沉积,比较了它们的优缺点。着重评述了PEALD的特点,主要具有沉积温度低、前驱体和生长材料种类广、工艺控制灵活、薄膜性能优异等优势,但也面临着薄膜三维贴合性下降和等离子体损伤等挑战。列举了PEALD的一些重要应用,如在金属薄膜制备、铜互连阻挡层、高介电常数材料、薄膜封裹等领域的应用。最后展望了PEALD的发展前景。 展开更多
关键词 等离子体 原子层沉积(ald) 薄膜沉积 金属薄膜 互连阻挡层 高介电材料 薄膜封裹
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Atomic layer deposition for nanoscale oxide semiconductor thin film transistors:review and outlook 被引量:4
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作者 Hye-Mi Kim Dong-Gyu Kim +2 位作者 Yoon-Seo Kim Minseok Kim Jin-Seong Park 《International Journal of Extreme Manufacturing》 SCIE EI CAS CSCD 2023年第1期153-180,共28页
Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compos... Since the first report of amorphous In–Ga–Zn–O based thin film transistors,interest in oxide semiconductors has grown.They offer high mobility,low off-current,low process temperature,and wide flexibility for compositions and processes.Unfortunately,depositing oxide semiconductors using conventional processes like physical vapor deposition leads to problematic issues,especially for high-resolution displays and highly integrated memory devices.Conventional approaches have limited process flexibility and poor conformality on structured surfaces.Atomic layer deposition(ALD)is an advanced technique which can provide conformal,thickness-controlled,and high-quality thin film deposition.Accordingly,studies on ALD based oxide semiconductors have dramatically increased recently.Even so,the relationships between the film properties of ALD-oxide semiconductors and the main variables associated with deposition are still poorly understood,as are many issues related to applications.In this review,to introduce ALD-oxide semiconductors,we provide:(a)a brief summary of the history and importance of ALD-based oxide semiconductors in industry,(b)a discussion of the benefits of ALD for oxide semiconductor deposition(in-situ composition control in vertical distribution/vertical structure engineering/chemical reaction and film properties/insulator and interface engineering),and(c)an explanation of the challenging issues of scaling oxide semiconductors and ALD for industrial applications.This review provides valuable perspectives for researchers who have interest in semiconductor materials and electronic device applications,and the reasons ALD is important to applications of oxide semiconductors. 展开更多
关键词 atomic layer deposition(ald) oxide semiconductor thin film transistor(TFT)
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有机电致发光器件的新型薄膜封装技术研究 被引量:7
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作者 骆杨 李天骄 段羽 《光电子.激光》 EI CAS CSCD 北大核心 2014年第5期840-844,共5页
针对有机电致发光器件(OLED)在空气中水汽和O2作用下寿命下降的问题,提出一种对OLED进行薄膜封装方法。封装薄膜由电子束蒸镀Al2O3薄膜和原子层沉积(ALD,atomic layer deposition)Al2O3薄膜相结合形成。利用Ca薄膜电学测试方法测定封装... 针对有机电致发光器件(OLED)在空气中水汽和O2作用下寿命下降的问题,提出一种对OLED进行薄膜封装方法。封装薄膜由电子束蒸镀Al2O3薄膜和原子层沉积(ALD,atomic layer deposition)Al2O3薄膜相结合形成。利用Ca薄膜电学测试方法测定封装薄膜的水汽透过率(WVTR)。具体实现方法是,采用玻璃作为衬底,在100nm的Al电极上蒸镀200nm的Ca膜,然后对整个系统进行薄膜封装,只留出Al电极的一部分作为探针接触电极。实验发现,采用电子束蒸镀结合ALD的Al2O3薄膜封装,Ca薄膜变成透明的时间比未封装或采用单一结构封装得到了延长。为了检验薄膜封装效果,制作了一组绿光OLED,器件结构为ITO/MoOX(5nm)/mMTDATA(20nm)/NPB(30nm)/Alq3(50nm)/LiF(1nm)/Al,实验结果表明,本文提出的薄膜封装方法对器件进行封装,器件的寿命得到了延长。 展开更多
关键词 薄膜封装 水汽透过率(WVTR) 原子层沉积(ald)
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ALD法制备Li掺杂NiO_(x)作为HTL提升PSC性能
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作者 罗启仁 刘昌 吴昊 《半导体技术》 CAS 北大核心 2024年第10期885-892,898,共9页
空穴传输层(HTL)是影响钙钛矿太阳能电池性能的主要因素之一。氧化镍(NiOx)是广为关注的无机HTL材料。原子层沉积(ALD)法具有厚度精准控制、台阶覆盖性好、薄膜质量高等优势,采用ALD法制备了不同比例锂(Li)掺杂的NiOx薄膜。结果显示ALD... 空穴传输层(HTL)是影响钙钛矿太阳能电池性能的主要因素之一。氧化镍(NiOx)是广为关注的无机HTL材料。原子层沉积(ALD)法具有厚度精准控制、台阶覆盖性好、薄膜质量高等优势,采用ALD法制备了不同比例锂(Li)掺杂的NiOx薄膜。结果显示ALD法制备的NiOx薄膜具有较小的均方根表面粗糙度、较高的光学透过率、较大的禁带宽度,而合适的Li掺杂量可以调制其与钙钛矿吸收层之间的能带匹配,这有利于获得更高的开路电压与短路电流。最终,以Li与NiO_(x)掺杂比为1∶500的NiOx薄膜作为HTL制备了电池器件,开路电压高达1.14 V,短路电流为21.73 mA/cm^(2),填充因子为80.5%,光电转换效率为19.95%,这在宽带隙倒置钙钛矿电池中是一个不错的水平。 展开更多
关键词 原子层沉积(ald) 氧化镍 钙钛矿太阳能电池 锂掺杂 空穴传输层(HTL)
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退火处理对高阻AZO纳米叠层薄膜电学性能的影响 被引量:6
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作者 关钧 拜晓峰 端木庆铎 《半导体技术》 CAS CSCD 北大核心 2018年第2期136-141,共6页
采用原子层沉积技术及退火处理工艺制备高阻氧化锌铝(AZO)纳米叠层薄膜。通过原子力显微镜、X射线衍射仪、高阻测试仪对不同退火工艺处理后的AZO纳米叠层薄膜进行表征和分析,并研究了退火温度、退火时间对薄膜形貌、结构及电学稳定性... 采用原子层沉积技术及退火处理工艺制备高阻氧化锌铝(AZO)纳米叠层薄膜。通过原子力显微镜、X射线衍射仪、高阻测试仪对不同退火工艺处理后的AZO纳米叠层薄膜进行表征和分析,并研究了退火温度、退火时间对薄膜形貌、结构及电学稳定性的影响。研究结果表明,经退火处理后的AZO纳米叠层薄膜电阻率明显增大,且适当的时间退火处理有助于薄膜结构的优化。经400℃,6 h退火处理后的AZO纳米叠层薄膜,表面平整连续,粗糙度仅有0.185 nm,且电学稳定性最好。在测试电压为25~1 000 V时,测得薄膜的方块电阻最大值为5.76×10^(12)Ω/,最小值为5.55×10^(12)Ω/,其方块电阻基本稳定。该工艺制备的AZO纳米叠层薄膜在微通道板电子倍增器中具有一定的应用价值。 展开更多
关键词 氧化锌铝(AZO)纳米叠层薄膜 原子层沉积(ald) 电学特性 退火处理 微通道板(MCP)
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原子层沉积法制备鸡蛋清栅介质ZnO-TFT及其性能研究
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作者 王聪 黄荷 +1 位作者 刘玉荣 彭强 《电子器件》 CAS 2024年第3期865-869,共5页
采用原子层沉积法(ALD),以天然鸡蛋清作为栅介质制备双电层氧化锌薄膜晶体管(ZnO-TFT),并对其电性能进行测试与分析,研究了该器件在栅偏压应力条件下和空气环境下电学性能的稳定性。结果表明,氧化锌薄膜晶体管电特性表现良好,阈值电压为... 采用原子层沉积法(ALD),以天然鸡蛋清作为栅介质制备双电层氧化锌薄膜晶体管(ZnO-TFT),并对其电性能进行测试与分析,研究了该器件在栅偏压应力条件下和空气环境下电学性能的稳定性。结果表明,氧化锌薄膜晶体管电特性表现良好,阈值电压为0.73 V,载流子饱和迁移率为9.95 cm^(2)/(V·s),开关电流比为1.8×10^(4),亚阈值摆幅为0.33 V/decade,工作电压可低至3.0 V。研究还发现,在正栅偏压应力作用下或在空气环境下器件的电性能皆呈现出不稳定性。栅偏压应力不稳定性主要与栅介质层界面处正电荷集聚及新缺陷态的产生有关;干燥空气环境下电性能的退化可解释为沟道有源层吸附空气中的氧气导致沟道层中载流子有所消耗,以及鸡蛋清电解质被氧化而引起双电层效应的退化。 展开更多
关键词 氧化锌薄膜晶体管 偏压应力 稳定性 双电层 原子层沉积
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原子层沉积技术在含能材料表面修饰中的应用研究进展 被引量:5
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作者 秦利军 龚婷 +4 位作者 闫宁 李建国 惠龙飞 郝海霞 冯昊 《火炸药学报》 EI CAS CSCD 北大核心 2019年第5期425-431,I0001,共8页
介绍了原子层沉积技术的原理和特点,并对比传统物理及化学气相沉积薄膜制备工艺,总结了原子层沉积技术在含能材料合成及表面修饰改性方面所具有的薄膜厚度精确可控、工作温度低和大面积及三维均匀性方面的优势。综述了原子层沉积技术在... 介绍了原子层沉积技术的原理和特点,并对比传统物理及化学气相沉积薄膜制备工艺,总结了原子层沉积技术在含能材料合成及表面修饰改性方面所具有的薄膜厚度精确可控、工作温度低和大面积及三维均匀性方面的优势。综述了原子层沉积技术在亚稳态分子间复合物合成,降低金属粉和炸药感度,以及提高铝粉、氢化铝和ADN稳定性等方面的研究进展。评述了原子层沉积技术在含能材料精确合成及表面修饰中的主要作用及未来发展方向。附参考文献29篇。 展开更多
关键词 应用化学 原子层沉积(ald) 分子层沉积(MLD) 含能材料 表面性质 表面修饰
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Performance study of vertical MSM solar-blind photodetectorsbased onβ-Ga_(2)O_(3)thin film
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作者 Chen Haifeng Che Lujie +8 位作者 Lu Qin Wang Shaoqing Liu Xiangtai Liu Zhanhang Guan Youyou Zhao Xu Cheng Hang Han Xiaocong Zhang Xuhui 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2024年第2期17-27,共11页
In this work,β-Ga_(2)O_(3)thin films were grown on SiO_(2)substrate by atomic layer deposition(ALD)and annealed in N_(2)atmosphere to enhance the crystallization quality of the thin films,which were verified from X-r... In this work,β-Ga_(2)O_(3)thin films were grown on SiO_(2)substrate by atomic layer deposition(ALD)and annealed in N_(2)atmosphere to enhance the crystallization quality of the thin films,which were verified from X-rays diffraction(XRD).Based on the grownβ-Ga_(2)O_(3)thin films,vertical metal-semiconductor-metal(MSM)interdigital photodetectors(PDs)were fabricated and investigated.The PDs have an ultralow dark current of 1.92 pA,ultra-high photo-to-dark current ratio(PDCR)of 1.7×10^(6),and ultra-high detectivity of 4.25×10^(14)Jones at a bias voltage of 10 V under 254 nm deep ultraviolet(DUV).Compared with the horizontal MSM PDs under the same process,the PDCR and detectivity of the fabricated vertical PDs are increased by 1000 times and 100 times,respectively.In addition,the vertical PDs possess a high responsivity of 34.24 A/W and an external quantum efficiency of 1.67×10^(4)%,and also exhibit robustness and repeatability,which indicate excellent performance.Then the effects of electrode size and external irradiation conditions on the performance of the vertical PDs continued to be investigated. 展开更多
关键词 Ga_(2)O_(3) atomic layer deposition(ald) ANNEALING vertical metal-semiconductor-metal(MSM)interdigital photodetectors
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Preparation and characteristic study of Schottky diodes based on Ga_(2)O_(3)thin films
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作者 Zhang Xuhui Chen Haifeng +6 位作者 Liu Xiangtai Lu Qin Wang Zhan Cheng Hang Che Lujie Guan Youyou Han Xiaocong 《The Journal of China Universities of Posts and Telecommunications》 EI CSCD 2024年第2期28-37,共10页
This study uses atomic layer deposition(ALD)to grow Ga_(2)O_(3)films on SiO_(2)substrates and investigates the influence of film thickness and annealing temperature on film quality.Schottky diode devices are fabricate... This study uses atomic layer deposition(ALD)to grow Ga_(2)O_(3)films on SiO_(2)substrates and investigates the influence of film thickness and annealing temperature on film quality.Schottky diode devices are fabricated based on the grown Ga_(2)O_(3)films,and the effects of annealing temperature,electrode size,and electrode spacing on the electrical characteristics of the devices are studied.The results show that as the film thickness increases,the breakdown voltage of the fabricated devices also increases.A Schottky diode with a thickness of 240 nm can achieve a reverse breakdown voltage of 300 V.The film quality significantly improves as the annealing temperature of the film increases.At a voltage of 5 V,the current of the film annealed at 900℃is 64 times that of the film annealed at 700℃.The optimum annealing temperature for Ohmic contact electrodes is 450℃.At 550℃,the Ohmic contact metal tends to burn,and the performance of the device is reduced.Reducing the electrode spacing increases the forward current of the device but decreases the reverse breakdown voltage.Increasing the Schottky contact electrode size increases the forward current,but the change is not significant,and there is no significant change in the reverse breakdown voltage.The device also performs well at high temperatures,with a reverse breakdown voltage of 220 V at 125℃. 展开更多
关键词 atomic layer deposition(ald) Ga_(2)O_(3)film Schottky diode annealing temperature
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原子层沉积技术研究及其应用进展 被引量:5
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作者 仇洪波 刘邦武 +5 位作者 夏洋 李惠琪 陈波 李超波 万军 李勇 《微纳电子技术》 CAS 北大核心 2012年第11期701-708,731,共9页
原子层沉积(ALD)技术是制备复杂纳米结构材料以及材料表面改性的关键技术,该技术已得到了国内外学术界的大量研究。简单介绍了ALD技术、沉积过程、该技术的优点以及该技术可以沉积的薄膜材料,重点论述了ALD技术的应用进展,主要包括半导... 原子层沉积(ALD)技术是制备复杂纳米结构材料以及材料表面改性的关键技术,该技术已得到了国内外学术界的大量研究。简单介绍了ALD技术、沉积过程、该技术的优点以及该技术可以沉积的薄膜材料,重点论述了ALD技术的应用进展,主要包括半导体方面(如IC互连技术、电容器、太阳电池晶体硅表面钝化)以及纳米结构材料方面(如催化剂与燃料电池、光催化、太阳电池、分离膜)。最后,指出了目前ALD在材料制备和生产工艺方面所面临的挑战,并对其未来发展进行了展望。 展开更多
关键词 原子层沉积(ald) 薄膜沉积 太阳电池 互连技术 催化剂 分离膜
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原子层沉积技术制备金属材料的进展与挑战 被引量:5
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作者 朱琳 李爱东 《微纳电子技术》 CAS 北大核心 2015年第2期113-122,共10页
原子层沉积(ALD)技术是一种三维共形沉积金属薄膜或金属纳米结构的有效手段。简要介绍了ALD技术的基本原理和特点,着重阐述和比较了ALD生长贵金属、过渡金属和活泼金属的不同工艺条件、化学过程和反应生长机理,如贵金属的燃烧反应与成... 原子层沉积(ALD)技术是一种三维共形沉积金属薄膜或金属纳米结构的有效手段。简要介绍了ALD技术的基本原理和特点,着重阐述和比较了ALD生长贵金属、过渡金属和活泼金属的不同工艺条件、化学过程和反应生长机理,如贵金属的燃烧反应与成核孕育期、过渡金属铜互连的前驱体与表面平整性以及活泼金属的能量辅助沉积,探讨了前驱体、成核等对金属沉积和质量的重要影响,说明了原位监控手段在生长中的作用。最后简述了ALD沉积金属面临的瓶颈,由于一些重要金属前驱体的匮乏,新的反应路径和生长机理亟待发现,并展望了其未来发展和应用前景。 展开更多
关键词 原子层沉积(ald) 金属薄膜 反应和生长机理 前驱体 成核
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基于原子层沉积的Al_2O_3薄膜微观形貌研究 被引量:5
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作者 王琛英 杨树明 +4 位作者 李常胜 景蔚萱 林启敬 蒋庄德 张易军 《稀有金属材料与工程》 SCIE EI CAS CSCD 北大核心 2015年第12期3078-3082,共5页
研究利用原子层沉积获得的小于10 nm Al_2O_3薄膜表面形貌特点。采用该技术获得4和8 nm的Al_2O_3薄膜,利用原子力扫描电镜(AFM)和扫描电镜(SEM)对薄膜表面形貌进行测量,通过最小二乘法和多重分形研究薄膜表面形貌,分析得出利用原子层沉... 研究利用原子层沉积获得的小于10 nm Al_2O_3薄膜表面形貌特点。采用该技术获得4和8 nm的Al_2O_3薄膜,利用原子力扫描电镜(AFM)和扫描电镜(SEM)对薄膜表面形貌进行测量,通过最小二乘法和多重分形研究薄膜表面形貌,分析得出利用原子层沉积技术加工超薄Al_2O_3薄膜,其形貌与成膜原理有关,与厚度无关。 展开更多
关键词 原子层淀积 AL2O3 多重分形
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有机/无机/有机结构的封装薄膜水汽透过率研究 被引量:4
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作者 高强 杨丹 +4 位作者 杨永强 陶冶 刘云飞 段羽 陈平 《光电子.激光》 EI CAS CSCD 北大核心 2014年第9期1721-1726,共6页
为了减少原子层沉积(ALD)方法在氧化物薄膜制备过程中ALD反应气对有机电致发光器件(OLED)性能的影响,利用旋涂光交联聚合物技术,直接在OLED上形成有机/无机/有机3层结构的保护薄膜。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)的表面... 为了减少原子层沉积(ALD)方法在氧化物薄膜制备过程中ALD反应气对有机电致发光器件(OLED)性能的影响,利用旋涂光交联聚合物技术,直接在OLED上形成有机/无机/有机3层结构的保护薄膜。通过扫描电子显微镜(SEM)、原子力显微镜(AFM)的表面形貌分析表明,3层结构的封装薄膜表面平滑且致密,减少水(H2O)汽在氧化物表面积聚,降低H2O对氧化物薄膜的腐蚀作用,且成膜过程对OLED的各功能层没有伤害。经Ca薄膜的电学方法测量证明,这种3层结构的封装薄膜对气体有极高的阻隔作用,其H2O汽透过率(WVTR)可以达到9.0×10-5 g/(m2·day),从而实现了对OLED的有效保护。 展开更多
关键词 原子层沉积(ald) Ca电学测试 有机/无机/有机3层封装结构
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Surface modifications of layered LiNi_(x)Mn_(y)Co_(z)O_(2)cathodes via atomic and molecular layer deposition
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作者 Xin Wang Xiang-Bo Meng 《Rare Metals》 SCIE EI CAS CSCD 2023年第7期2121-2156,共36页
Currently,there has an ever-growing interest in layered LiNi_(x)Mn_(y)Co_(z)O_(2)(NMCs,x+y+z=1)cathode materials for lithium-ion batteries(LIBs)and lithium metal batteries(LMBs),due to their low cost and high capacity... Currently,there has an ever-growing interest in layered LiNi_(x)Mn_(y)Co_(z)O_(2)(NMCs,x+y+z=1)cathode materials for lithium-ion batteries(LIBs)and lithium metal batteries(LMBs),due to their low cost and high capacity.However,they still suffer from a series of issues,such as Li/Ni cation mixing,irreversible phase transition,and transition metal dissolution.These issues result in severe capacity degradation and limited cyclability of NMCs.Recently,atomic and molecular layer deposition(ALD and MLD)have emerged as a novel tool to tackle these issues,featuring their unique capabilities to fine-tailor NMCs'surfaces for stable interfaces and improved electrochemical performance in LIBs and LMBs.In this review,we specially summarize the recent advances of different ALD and MLD coatings on NMCs and discuss their working mechanisms.We expect that this review will stimulate more efforts to further develop better NMCs using novel ALD/MLD coatings. 展开更多
关键词 Lithium-ion batteries(LIBs) Lithium metal batteries(LMBs) NMC cathodes atomic layer deposition(ald) Molecular layer deposition(MLD) Surface coating
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热ALD和等离子增强ALD沉积HfO2薄膜的比较(英文) 被引量:2
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作者 乌李瑛 柏荣旭 +4 位作者 瞿敏妮 田苗 沈赟靓 王英 程秀兰 《半导体技术》 CAS 北大核心 2019年第10期795-802,共8页
以四(甲乙胺)铪(TEMAHf)作为前驱体,采用热原子层沉积(TALD)技术和等离子体增强原子层沉积(PEALD)技术分别在硅衬底上沉积二氧化铪(HfO2)薄膜。分别研究了水和臭氧作为共反应物对TALD HfO2薄膜性能的影响及采用电容耦合等离子体(CCP)PEA... 以四(甲乙胺)铪(TEMAHf)作为前驱体,采用热原子层沉积(TALD)技术和等离子体增强原子层沉积(PEALD)技术分别在硅衬底上沉积二氧化铪(HfO2)薄膜。分别研究了水和臭氧作为共反应物对TALD HfO2薄膜性能的影响及采用电容耦合等离子体(CCP)PEALD HfO2薄膜的最佳工艺条件。通过X射线衍射(XRD)、扫描电子显微镜(SEM)和光电子能谱(XPS)对不同工艺制备的HfO2薄膜的微观结构、表面形貌进行了表征。结果表明,反应温度为300℃时,TALD 50 nm厚的HfO2薄膜为单斜相晶体;PEALD在较低反应温度(150℃)下充分反应,所沉积的50 nm厚的HfO2薄膜杂质含量较低,薄膜未形成结晶态;PEALD工艺得到的HfO2薄膜的界面层最厚,主要为硅的亚氧化物或铪硅酸盐。电流-电压(I-V)和电容-电压(C-V)测试结果表明,以水作为氧源且反应温度300℃的TALD工艺所得到的HfO2薄膜,其金属-绝缘体-半导体(MIS)器件的漏电流及电滞回线最小。 展开更多
关键词 二氧化铪(HfO2) 原子层沉积(ald) 热原子层沉积(Tald) 等离子增强原子层沉积(PEald) 介电常数
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Freestanding hierarchical porous carbon film derived from hybrid nanocellulose for high-power supercapacitors 被引量:3
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作者 Zhi Li Kaveh Ahadi +5 位作者 Keren Jiang Behzad Ahvazi Peng Li Anthony O. Anyia Ken Cadien Thomas Thundat 《Nano Research》 SCIE EI CAS CSCD 2017年第5期1847-1860,共14页
Nanocellulose is a sustainable and eco-friendly nanomaterial derived from renewable biomass. In this study, we utilized the structural advantages of two types of nanocellulose and fabricated freestanding carbonized hy... Nanocellulose is a sustainable and eco-friendly nanomaterial derived from renewable biomass. In this study, we utilized the structural advantages of two types of nanocellulose and fabricated freestanding carbonized hybrid nanocellulose films as electrode materials for supercapacitors. The long cellulose nanofibrils (CNFs) formed a macroporous framework, and the short cellulose nanocrystals were assembled around the CNF framework and generated micro/mesopores. This two-level hierarchical porous structure was successfully preserved during carbonization because of a thin atomic layer deposited (ALD) A1203 conformal coating, which effectively prevented the aggregation of nanocellulose. These carbonized, partially graphitized nanocellulose fibers were interconnected, forming an integrated and highly conductive network with a large specific surface area of 1,244 m2·g-1. The two-level hierarchical porous structure facilitated fast ion transport in the film. When tested as an electrode material with a high mass loading of 4 mg·cm-2 for supercapacitors, the hierarchical porous carbon film derived from hybrid nanocellulose exhibited a specific capacitance of 170 F·g-1 and extraordinary performance at high current densities. Even at a very high current of 50 A-g-l, it retained 65% of its original specific capacitance, which makes it a promising electrode material for high-power applications. 展开更多
关键词 NANOCELLULOSE SUPERCAPACITORS hierarchical structure atomic layer depositionald integrated structure
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Fabrication of Nanoscale Step Height Structure Using Atomic Layer Deposition Combined with Wet Etching 被引量:3
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作者 WANG Chenying YANG Shuming +4 位作者 JING Weixuan REN Wei LIN Qijing ZHANG Yijun JIANG Zhuangde 《Chinese Journal of Mechanical Engineering》 SCIE EI CAS CSCD 2016年第1期91-97,共7页
The current techniques used for the fabrication of nanosteps are normally done by layer growth and then ion beam thinning. There are also extra films grown on the step surfaces in order to reduce the roughness. So the... The current techniques used for the fabrication of nanosteps are normally done by layer growth and then ion beam thinning. There are also extra films grown on the step surfaces in order to reduce the roughness. So the whole process is time consuming. In this paper, a nanoscale step height structure is fabricated by atomic layer deposition (ALD) and wet etching techniques. According to the traceable of the step height value, the fabrication process is controllable. Because ALD technology can grow a variety of materials, aluminum oxide (Al2O3) is used to fabricate the nanostep. There are three steps of Al2O3 in this structure including 8 nm, 18 nm and 44 inn. The thickness of Al2O3 film and the height of the step are measured by anellipsometer. The experimental results show that the thickness of Al2O3 film is consistent with the height of the step. The height of the step is measured by AFM. The measurement results show that the height is related to the number of cycles of ALD and the wet etching time. The bottom and the sidewall surface roughness are related to the wet etching time. The step height is calibrated by Physikaliseh-Technische Bundesanstalt (PTB) and the results were 7.5±1.5 nm, 15.5±2.0 nm and 41.8±2.1 nm, respectively. This research provides a method for the fabrication of step height at nanoscale and the nanostep fabricated is potential used for standard references. 展开更多
关键词 atomic layer deposition ald wet etching step height
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