We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring re...We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring resonator to characterize the material properties of the glass substrate.The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization.Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM10 mode,the radiation aperture of this proposed antenna is reduced.Located right above the center feeding CPW-fed bow-tie slot,the metasurface patch is realized,supporting the TM10 mode and antiphase TM20 mode simultaneously to improve the bandwidth performance.Using a probe-based antenna measurement setup,the antenna prototype is measured,demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz.At 60 GHz,the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ0×0.31λ0 and a thickness of 0.06λ0.展开更多
For 5G new radio(NR),there are two frequency bands:Frequency Range 1(FR‐1)(low frequency)and Frequency Range 2(FR‐2)(millimeter‐wave frequency).Millimeter‐wave has been officially utilized in mobile applications.T...For 5G new radio(NR),there are two frequency bands:Frequency Range 1(FR‐1)(low frequency)and Frequency Range 2(FR‐2)(millimeter‐wave frequency).Millimeter‐wave has been officially utilized in mobile applications.The wide bandwidth is the key for the millimeter-wave band.However,higher loss has become the major challenge for the wide use of this frequency range.Antenna array and beamforming technologies have been introduced to resolve the path loss and coverage problems.The key design considerations of the beamforming antenna array are low loss,compact system and small size.Antenna-in-package(AiP)has become the most attractive technology for millimeter-wave front-end system.For the design of AiP,many parameters such as RF transition,material and heat need to be considered and designed properly.The Over‐the‐Air(OTA)testing technology is also very critical for AiP mass production.In this paper,the detail of AiP design and new OTA testing technology are discussed and demonstrated.展开更多
基金supported by the National Key R&D Program of China(Nos.2018YFE0205900 and 2016YFC0800400)the National Science and Technology Major Project,China(No.2018ZX03001008)the National Natural Science Foundation of China(Nos.61306030 and 61674037)。
文摘We propose a miniaturized wideband metasurface antenna for 60-GHz antenna-in-package applications.With the glass integrated passive device manufacturing technology,we introduce a coplanar-waveguide-fed(CPW-fed)ring resonator to characterize the material properties of the glass substrate.The proposed antenna is designed on a high dielectric constant glass substrate to achieve antenna miniaturization.Because of the existence of gaps between patch units compared with the conventional rectangular patch in the TM10 mode,the radiation aperture of this proposed antenna is reduced.Located right above the center feeding CPW-fed bow-tie slot,the metasurface patch is realized,supporting the TM10 mode and antiphase TM20 mode simultaneously to improve the bandwidth performance.Using a probe-based antenna measurement setup,the antenna prototype is measured,demonstrating a 10-dB impedance bandwidth from 53.3 to 67 GHz.At 60 GHz,the antenna gain measured is about 5 dBi in the boresight direction with a compact radiation aperture of 0.31λ0×0.31λ0 and a thickness of 0.06λ0.
文摘For 5G new radio(NR),there are two frequency bands:Frequency Range 1(FR‐1)(low frequency)and Frequency Range 2(FR‐2)(millimeter‐wave frequency).Millimeter‐wave has been officially utilized in mobile applications.The wide bandwidth is the key for the millimeter-wave band.However,higher loss has become the major challenge for the wide use of this frequency range.Antenna array and beamforming technologies have been introduced to resolve the path loss and coverage problems.The key design considerations of the beamforming antenna array are low loss,compact system and small size.Antenna-in-package(AiP)has become the most attractive technology for millimeter-wave front-end system.For the design of AiP,many parameters such as RF transition,material and heat need to be considered and designed properly.The Over‐the‐Air(OTA)testing technology is also very critical for AiP mass production.In this paper,the detail of AiP design and new OTA testing technology are discussed and demonstrated.
