The preparation process of electrically conductive filler for anisotropic conductive adhesive was performed and discussed.The spherical filler contains tri-layer structures: resin core,Ni-P intermediate coating layer,...The preparation process of electrically conductive filler for anisotropic conductive adhesive was performed and discussed.The spherical filler contains tri-layer structures: resin core,Ni-P intermediate coating layer,Au outer coating layer.The 4 μm resin spherical cores were synthesized by monodispersion polymerization method.Then they were contributed to electrical conductivity by electrolessly plating Ni-P layer and gold layer.These particles have good corrosion resistance,high stability,and enough mechanical strength.When mixed with thermosetting epoxy resin to produce anisotropic conductive adhesive(ACA),it can realize a good conductive bonding between bumps on dies and pads on substrates.This environmentally friendly conductive material offers numerous advantages over conventional solder technology and is an ideal substitute for the lead-contained solder in electronics packaging.展开更多
基金The National Natural Science Foundation of China(No.10474024)NSFC-RGC Joint Research Scheme(No.60318002)+1 种基金Youth Chenguang Project of Science and Technology of Wuhan City of China(No.20065004116-10)StateKey Lab.of Advanced Technology for Materials Synthesis and Processing(Wuhan University of Technology,No.WUT2004 M08)
文摘The preparation process of electrically conductive filler for anisotropic conductive adhesive was performed and discussed.The spherical filler contains tri-layer structures: resin core,Ni-P intermediate coating layer,Au outer coating layer.The 4 μm resin spherical cores were synthesized by monodispersion polymerization method.Then they were contributed to electrical conductivity by electrolessly plating Ni-P layer and gold layer.These particles have good corrosion resistance,high stability,and enough mechanical strength.When mixed with thermosetting epoxy resin to produce anisotropic conductive adhesive(ACA),it can realize a good conductive bonding between bumps on dies and pads on substrates.This environmentally friendly conductive material offers numerous advantages over conventional solder technology and is an ideal substitute for the lead-contained solder in electronics packaging.
