Amorphous nano-sized silicon nitride powders were sintered by liquid phase sintering. The influences of the additives of Y2O3 and Al2O3 prepared by two different ways, the polyacrylamide gel method and the precipitati...Amorphous nano-sized silicon nitride powders were sintered by liquid phase sintering. The influences of the additives of Y2O3 and Al2O3 prepared by two different ways, the polyacrylamide gel method and the precipitation method, were investigated. The grain sizes of the additives prepared by the first method were finer than those of prepared by the latter method. When sintered at the same temperature, 1700 ℃, the average grain size of the silicon nitride is 0.3 um for the sample with the former additives, which is much finer than the one with the latter additives. The density of additives prepared by precipitation method is clearly lower than those of prepared by polyacrylamide gel method.展开更多
Nanostructured amorphous silicon nitride (NASN) was obtained by compacting the particles of the order of nanometer. The volume of interfaces occupies a large fraction of the total volume. This type of solid possesse...Nanostructured amorphous silicon nitride (NASN) was obtained by compacting the particles of the order of nanometer. The volume of interfaces occupies a large fraction of the total volume. This type of solid possesses some novel physical properties. The conventional Si<sub>3</sub>N<sub>4</sub> is a kind of excellent insulator, and thus it is展开更多
Hydrogenated amorphous silicon nitride films(Si N x:H) are deposited at low temperature by high-frequency plasmaenhanced chemical vapor deposition(HF PECVD). The main effort is to investigate the roles of plasma ...Hydrogenated amorphous silicon nitride films(Si N x:H) are deposited at low temperature by high-frequency plasmaenhanced chemical vapor deposition(HF PECVD). The main effort is to investigate the roles of plasma frequency and plasma power density in determining the film properties particularly in stress. Information about chemical bonds in the films is obtained by Fourier transform infrared spectroscopy(FTIR). The stresses in the Si N x:H film are determined from substrate curvature measurements. It is shown that plasma frequency plays an important role in controlling the stresses in Si N x:H films. For silicon nitride layers grown at plasma frequency 40.68 MHz initial tensile stresses are observed to be in a range of 400 MPa-700 MPa. Measurements of the intrinsic stresses of silicon nitride films show that the stress quantity is sufficient for film applications in strained silicon photonics.展开更多
基金Funded by the National Postdoctoral Foundation of China(No.20060400787)
文摘Amorphous nano-sized silicon nitride powders were sintered by liquid phase sintering. The influences of the additives of Y2O3 and Al2O3 prepared by two different ways, the polyacrylamide gel method and the precipitation method, were investigated. The grain sizes of the additives prepared by the first method were finer than those of prepared by the latter method. When sintered at the same temperature, 1700 ℃, the average grain size of the silicon nitride is 0.3 um for the sample with the former additives, which is much finer than the one with the latter additives. The density of additives prepared by precipitation method is clearly lower than those of prepared by polyacrylamide gel method.
基金National Natural Science Foundation of Chinathe State ScienceTechnology Committee
文摘Nanostructured amorphous silicon nitride (NASN) was obtained by compacting the particles of the order of nanometer. The volume of interfaces occupies a large fraction of the total volume. This type of solid possesses some novel physical properties. The conventional Si<sub>3</sub>N<sub>4</sub> is a kind of excellent insulator, and thus it is
基金Project supported by RFBR(Grant No.14-03-91154 NNSF)the National Natural Science Foundation of China(Grant No.61411130212)
文摘Hydrogenated amorphous silicon nitride films(Si N x:H) are deposited at low temperature by high-frequency plasmaenhanced chemical vapor deposition(HF PECVD). The main effort is to investigate the roles of plasma frequency and plasma power density in determining the film properties particularly in stress. Information about chemical bonds in the films is obtained by Fourier transform infrared spectroscopy(FTIR). The stresses in the Si N x:H film are determined from substrate curvature measurements. It is shown that plasma frequency plays an important role in controlling the stresses in Si N x:H films. For silicon nitride layers grown at plasma frequency 40.68 MHz initial tensile stresses are observed to be in a range of 400 MPa-700 MPa. Measurements of the intrinsic stresses of silicon nitride films show that the stress quantity is sufficient for film applications in strained silicon photonics.