Broadband photodetection,spanning from ultraviolet(UV)to infrared(IR),is pivotal in diverse technological domains including astronomy,remote sensing,environmental monitoring,and medical diagnostics.However,current com...Broadband photodetection,spanning from ultraviolet(UV)to infrared(IR),is pivotal in diverse technological domains including astronomy,remote sensing,environmental monitoring,and medical diagnostics.However,current commercially available broadband photodetectors,predominately based on conventional narrow-bandgap semiconductors,exhibit limited sensitivity in the UV region.This limitation,stemming from the significant energy disparity between the semiconductor bandgap and UV photon,narrows their application scope.Herein,we report an innovative approach involving the in-situ van der Waals(vdW)integration of two-dimensional(2D)GeSe_(2)layers onto a Si substrate.This process yields a high-quality GeSe_(2)/Si vdW heterojunction device,which features a broad response range covering from UV to near-IR(NIR)with a greatly-enhanced sensitivity in the UV region.The device possesses high responsivities of 325 and 533.4 mA/W,large detectivities of 1.24×10^(13)and 2.57×10^(13)Jones,and fast response speeds of 20.6/82.1 and 17.7/81.0μs under 360 and 980 nm,respectively.Notably,the broadband image sensing and secure invisible optical communication capabilities of the GeSe_(2)/Si heterojunction device are demonstrated.Our work provides a viable approach for UV-enhanced broadband photodetection technology,opening up new possibilities and applications across various scientific and technological domains.展开更多
The two-dimensional transition metal dichalcogenides(TMDs)have attracted intense interest as an atomically thin semiconductor channel for the continued transistor scaling.However,with a dangling bond free surface,it h...The two-dimensional transition metal dichalcogenides(TMDs)have attracted intense interest as an atomically thin semiconductor channel for the continued transistor scaling.However,with a dangling bond free surface,it has been a key challenge to reliably integrate high-quality gate dielectrics on TMDs.In particular,the atomic layer deposition of dielectrics on TMDs typically features highly non-uniform nucleation and produces a highly rough or porous dielectric film with rich pinholes that are prone to further damage during the gate integration process.Herein we report a van der Waals(vdW)integration route towards highly reliable gate metal integration on porous dielectrics.The physical lamination process employed by the vdW integration avoids the direct deposition of metal electrodes into porous dielectrics to ensure reliable gate integration and produce low gate leakage devices.The electrical measurements demonstrate the vdW integrated MoS_(2) top gate devices exhibit substantially reduced gate leakage current that is about 3-5 orders of magnitude smaller than that with deposited metal electrodes.Furthermore,we show the vdW integration process can be used to create high performance top-gated MoS_(2) transistors with ultrathin Al_(2)O_(3) dielectrics down to 1 nm,representing the ultimate dielectric scaling for TMDs transistors.This study demonstrates that vdW integration can enable highly reliable gate integration on relatively low quality dielectrics on TMDs,and opens an interesting pathway to high-performance top-gate transistors using dangling bond free two-dimensional(2D)semiconductors.展开更多
基金financially supported by the National Natural Science Foundation of China(Nos.62374149,U2004165,and U22A20138)Key Research Project for Higher Education Institutions in Henan Province(No.24B140010).
文摘Broadband photodetection,spanning from ultraviolet(UV)to infrared(IR),is pivotal in diverse technological domains including astronomy,remote sensing,environmental monitoring,and medical diagnostics.However,current commercially available broadband photodetectors,predominately based on conventional narrow-bandgap semiconductors,exhibit limited sensitivity in the UV region.This limitation,stemming from the significant energy disparity between the semiconductor bandgap and UV photon,narrows their application scope.Herein,we report an innovative approach involving the in-situ van der Waals(vdW)integration of two-dimensional(2D)GeSe_(2)layers onto a Si substrate.This process yields a high-quality GeSe_(2)/Si vdW heterojunction device,which features a broad response range covering from UV to near-IR(NIR)with a greatly-enhanced sensitivity in the UV region.The device possesses high responsivities of 325 and 533.4 mA/W,large detectivities of 1.24×10^(13)and 2.57×10^(13)Jones,and fast response speeds of 20.6/82.1 and 17.7/81.0μs under 360 and 980 nm,respectively.Notably,the broadband image sensing and secure invisible optical communication capabilities of the GeSe_(2)/Si heterojunction device are demonstrated.Our work provides a viable approach for UV-enhanced broadband photodetection technology,opening up new possibilities and applications across various scientific and technological domains.
基金support from the National Key R&D Program of China(No.2018YFA0703700)the National Natural Science Foundation of China(Nos.51802090,61874041,51991340,and 51991341)X.D.acknowledges the support from the National Natural Science Foundation of China(No.51991343)。
文摘The two-dimensional transition metal dichalcogenides(TMDs)have attracted intense interest as an atomically thin semiconductor channel for the continued transistor scaling.However,with a dangling bond free surface,it has been a key challenge to reliably integrate high-quality gate dielectrics on TMDs.In particular,the atomic layer deposition of dielectrics on TMDs typically features highly non-uniform nucleation and produces a highly rough or porous dielectric film with rich pinholes that are prone to further damage during the gate integration process.Herein we report a van der Waals(vdW)integration route towards highly reliable gate metal integration on porous dielectrics.The physical lamination process employed by the vdW integration avoids the direct deposition of metal electrodes into porous dielectrics to ensure reliable gate integration and produce low gate leakage devices.The electrical measurements demonstrate the vdW integrated MoS_(2) top gate devices exhibit substantially reduced gate leakage current that is about 3-5 orders of magnitude smaller than that with deposited metal electrodes.Furthermore,we show the vdW integration process can be used to create high performance top-gated MoS_(2) transistors with ultrathin Al_(2)O_(3) dielectrics down to 1 nm,representing the ultimate dielectric scaling for TMDs transistors.This study demonstrates that vdW integration can enable highly reliable gate integration on relatively low quality dielectrics on TMDs,and opens an interesting pathway to high-performance top-gate transistors using dangling bond free two-dimensional(2D)semiconductors.
