Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electroma...Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electromagnetic shielding effectiveness were investigated. And P content, microstructure and surface feature of layers obtained at different temperatures were analyzed by energy dispersion spectrometer （EDS）, X-ray diffraction （XRI）） and scanning electron microscopy （SEM）. The results showed that layers with higher electro-conductivity and electromagnetic shielding effectiveness were obtained under the optimum conditions that plating solution was 500 mL, plating time was 30 min and plating temperature was 62℃. The results showed by EDS analysis; that P content increased gradually in a small extent with plating temperature increased. It was showed by XRD and SEM analysis that layers plated at different temperatures were all microcrystalline structure and uniform and successive, which had noticeable metal luster. Those indicated that plating temperature had little influence on microstructure and surface feature under pH value invariable.展开更多
基金The research was supported by the National Natural Science Foundation of China （30571454）. Natural Science Foundation of Heilongjiang Province （C0210） and Harbin City Youth Science Faud （2004AFQXJ027）.
文摘Electrical and electromagnetic shielding wood metal composite was prepared by using electroless nickel plating. The effects of solution amount, plating time and plating temperature on surface resistivity and electromagnetic shielding effectiveness were investigated. And P content, microstructure and surface feature of layers obtained at different temperatures were analyzed by energy dispersion spectrometer （EDS）, X-ray diffraction （XRI）） and scanning electron microscopy （SEM）. The results showed that layers with higher electro-conductivity and electromagnetic shielding effectiveness were obtained under the optimum conditions that plating solution was 500 mL, plating time was 30 min and plating temperature was 62℃. The results showed by EDS analysis; that P content increased gradually in a small extent with plating temperature increased. It was showed by XRD and SEM analysis that layers plated at different temperatures were all microcrystalline structure and uniform and successive, which had noticeable metal luster. Those indicated that plating temperature had little influence on microstructure and surface feature under pH value invariable.
