The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds（IMCs） layer（η-Cu6 Sn5 + e-Cu3 Sn） for various soldering t...The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds（IMCs） layer（η-Cu6 Sn5 + e-Cu3 Sn） for various soldering time and the influence of Bi addition on the thermal behavior of Sn-x Bi solder alloys were investigated. The Cu6 Sn5 IMC could be observed as long as the molten solder contacted with the Cu substrate. However, with the longer welding time such as 60 and 300 s, the Cu3 Sn IMC was formed at the interface between Cu6 Sn5 and Cu substrate. With the increase of soldering time, the thickness of total IMCs increased, meanwhile, the grain size of Cu6 Sn5 also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs,but excessive Bi（≥ 5 wt%） inhibited the growth of Cu6 Sn5 and Cu3 Sn IMC in Sn-x Bi/Cu microelectronic interconnects. Furthermore, with the Bi contents increasing（Sn-10 Bi solder in this present investigation）, some Bi particles accumulated at the interface between Cu6 Sn5 layer and the solder.展开更多
基金Funded by the National Natural Science Foundation of China(No.51465039)Natural Science Foundation of Jiangxi Province(No.20151BAB206041,20161BAB206122)Fund of the State Key Laboratory of Solidification Processing in NWPU(No.SKLSP201508)
文摘The effects of different Bi contents on the properties of Sn solders were studied. The interfacial reaction and growth behavior of intermetallic compounds（IMCs） layer（η-Cu6 Sn5 + e-Cu3 Sn） for various soldering time and the influence of Bi addition on the thermal behavior of Sn-x Bi solder alloys were investigated. The Cu6 Sn5 IMC could be observed as long as the molten solder contacted with the Cu substrate. However, with the longer welding time such as 60 and 300 s, the Cu3 Sn IMC was formed at the interface between Cu6 Sn5 and Cu substrate. With the increase of soldering time, the thickness of total IMCs increased, meanwhile, the grain size of Cu6 Sn5 also increased. An appropriate amount of Bi element was beneficial for the growth of total IMCs,but excessive Bi（≥ 5 wt%） inhibited the growth of Cu6 Sn5 and Cu3 Sn IMC in Sn-x Bi/Cu microelectronic interconnects. Furthermore, with the Bi contents increasing（Sn-10 Bi solder in this present investigation）, some Bi particles accumulated at the interface between Cu6 Sn5 layer and the solder.
