It has been more than three decades since stereolithography began to emerge in various forms of additive manufacturing and 3D printing. Today these technologies are proliferating worldwide in various forms of advanced...It has been more than three decades since stereolithography began to emerge in various forms of additive manufacturing and 3D printing. Today these technologies are proliferating worldwide in various forms of advanced manufacturing. The largest segment of the 3D printing market today involves various polymer component fabrications, particularly complex structures not attainable by other manufacturing methods.Conventional printer head systems have also been adapted to selectively print various speciated human cells and special molecules in attempts to construct human organs, beginning with skin and various tissue patches. These efforts are discussed along with metal and alloy fabrication of a variety of implant and bone replacement components by creating powder layers, which are selectively melted into complex forms（such as foams and other open-cellular structures） using laser and electron beams directed by CAD software. Efforts to create a ＂living implant＂ by bone ingrowth and eventual vascularization within these implants will be discussed briefly. Novel printer heads for direct metal droplet deposition as in other 3D printing systems are briefly described since these concepts will allow for the eventual fabrication of very large and complex products, including automotive and aerospace structures and components.展开更多
An optical waveguide interconnect mesh network scheme for parallel multiprocessor systems based on an electro-optical printed circuit board （EOPCB） with multimode polymer waveguide is proposed. The system consists o...An optical waveguide interconnect mesh network scheme for parallel multiprocessor systems based on an electro-optical printed circuit board （EOPCB） with multimode polymer waveguide is proposed. The system consists of 2×2 processor element chips interconnected in a mesh network configuration. An additional layer with optical waveguide structure is embedded in a conventional printed circuit board to construct the EOPCB. Vertical cavity surface emitting laser （VCSEL）/positive intrinsic-negative （PIN） arrays are ap- plied as the optical transmitters/receivers. Three 1 ~ 12 VCSEL/PIN parallel optical transmitting/receiving modules are used to provide 32 input/output optical channels required by the 2~2 chip-to-chip optical mesh interconnect system. The data rate in each optical channel is 3.125 Gbps and thus 10 Gbps parallel optical interconnect link for each direction of a chip is obtained. The optical signals from a processor element chip can be transmitted to another chip through optical waveguide interconnect embedded in the board. Thus the optical interconnect mesh network for parallel multiprocessor system can be implemented.展开更多
基金based by the Office of Research and Sponsored Projects at The University of Texas at El Paso
文摘It has been more than three decades since stereolithography began to emerge in various forms of additive manufacturing and 3D printing. Today these technologies are proliferating worldwide in various forms of advanced manufacturing. The largest segment of the 3D printing market today involves various polymer component fabrications, particularly complex structures not attainable by other manufacturing methods.Conventional printer head systems have also been adapted to selectively print various speciated human cells and special molecules in attempts to construct human organs, beginning with skin and various tissue patches. These efforts are discussed along with metal and alloy fabrication of a variety of implant and bone replacement components by creating powder layers, which are selectively melted into complex forms（such as foams and other open-cellular structures） using laser and electron beams directed by CAD software. Efforts to create a ＂living implant＂ by bone ingrowth and eventual vascularization within these implants will be discussed briefly. Novel printer heads for direct metal droplet deposition as in other 3D printing systems are briefly described since these concepts will allow for the eventual fabrication of very large and complex products, including automotive and aerospace structures and components.
基金supported by the National Natural Science Foundation of China(No.60677023)the National"863"Program of China(No.2006AA01Z240).
文摘An optical waveguide interconnect mesh network scheme for parallel multiprocessor systems based on an electro-optical printed circuit board （EOPCB） with multimode polymer waveguide is proposed. The system consists of 2×2 processor element chips interconnected in a mesh network configuration. An additional layer with optical waveguide structure is embedded in a conventional printed circuit board to construct the EOPCB. Vertical cavity surface emitting laser （VCSEL）/positive intrinsic-negative （PIN） arrays are ap- plied as the optical transmitters/receivers. Three 1 ~ 12 VCSEL/PIN parallel optical transmitting/receiving modules are used to provide 32 input/output optical channels required by the 2~2 chip-to-chip optical mesh interconnect system. The data rate in each optical channel is 3.125 Gbps and thus 10 Gbps parallel optical interconnect link for each direction of a chip is obtained. The optical signals from a processor element chip can be transmitted to another chip through optical waveguide interconnect embedded in the board. Thus the optical interconnect mesh network for parallel multiprocessor system can be implemented.
