Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,whic...Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,which in itself,has been the focus of research and development extensively.This paper sheds light and conveys our perspective on the current state-of-the-art in different aspects of application-driven on-chip silicon lasers.We tackle this from two perspectives:device-level and system-wide points of view.In the former,the different routes taken in integrating on-chip lasers are explored from different material systems to the chosen integration methodologies.Then,the discussion focus is shifted towards system-wide applications that show great prospects in incorporating photonic integrated circuits(PIC)with on-chip lasers and active devices,namely,optical communications and interconnects,optical phased array-based LiDAR,sensors for chemical and biological analysis,integrated quantum technologies,and finally,optical computing.By leveraging the myriad inherent attractive features of integrated silicon photonics,this paper aims to inspire further development in incorporating PICs with on-chip lasers in,but not limited to,these applications for substantial performance gains,green solutions,and mass production.展开更多
采用模块化方法对集中式仲裁共享总线和二维网格片上网络(Network on Chip,NoC)的硬件开销和延迟进行了数学上的分析。在此基础上,通过可综合Verilog代码对这两种片上通信结构在RTL级进行描述,并建立了这两种通信方式的周期准确级的功...采用模块化方法对集中式仲裁共享总线和二维网格片上网络(Network on Chip,NoC)的硬件开销和延迟进行了数学上的分析。在此基础上,通过可综合Verilog代码对这两种片上通信结构在RTL级进行描述,并建立了这两种通信方式的周期准确级的功能验证和性能分析环境。结果表明,在同样工艺条件下,共享总线的面积与NoC相比相当小;但对于大规模片上系统通信,NoC的吞吐效率及带宽明显优于共享总线。展开更多
基金supported by Intel(CG#62148533)Advanced Research Projects Agency-Energy(ARPA-E)(DE-AR0001039)+1 种基金the U.S.Department of Defense under AIM Photonics(Air Force contract FA8650-15-2-5220)the DARPA LUMOS(DARPA contract HR001120C0142).
文摘Integrated silicon photonics has sparked a significant ramp-up of investment in both academia and industry as a scalable,power-efficient,and eco-friendly solution.At the heart of this platform is the light source,which in itself,has been the focus of research and development extensively.This paper sheds light and conveys our perspective on the current state-of-the-art in different aspects of application-driven on-chip silicon lasers.We tackle this from two perspectives:device-level and system-wide points of view.In the former,the different routes taken in integrating on-chip lasers are explored from different material systems to the chosen integration methodologies.Then,the discussion focus is shifted towards system-wide applications that show great prospects in incorporating photonic integrated circuits(PIC)with on-chip lasers and active devices,namely,optical communications and interconnects,optical phased array-based LiDAR,sensors for chemical and biological analysis,integrated quantum technologies,and finally,optical computing.By leveraging the myriad inherent attractive features of integrated silicon photonics,this paper aims to inspire further development in incorporating PICs with on-chip lasers in,but not limited to,these applications for substantial performance gains,green solutions,and mass production.
文摘采用模块化方法对集中式仲裁共享总线和二维网格片上网络(Network on Chip,NoC)的硬件开销和延迟进行了数学上的分析。在此基础上,通过可综合Verilog代码对这两种片上通信结构在RTL级进行描述,并建立了这两种通信方式的周期准确级的功能验证和性能分析环境。结果表明,在同样工艺条件下,共享总线的面积与NoC相比相当小;但对于大规模片上系统通信,NoC的吞吐效率及带宽明显优于共享总线。
